Abstract: In an apparatus for generating a power-up signal, a mode register set (MRS) and other circuits are prevented from being reset, thereby providing stable circuit operation. A final power-up signal is not disabled even though an internal voltage generating unit is turned off at a test mode. The apparatus includes a power-up signal generator for producing a power-up signal; a multiplexing unit for selectively outputting the power-up signal or a static voltage signal in a test mode; and a power-up signal generator for producing a final power-up signal in response to the power-up signal of the power-up signal generator and an output signal of the multiplexing unit as the final power-up signal.

Abstract: A semiconductor apparatus may include a master chip, first to nth slave chips, first to nth slave chip ID generating units, and a master chip ID generating unit. The first to nth slave chip ID generating units are disposed respectively in the first to nth slave chips and connected in series to each other. Each of the first to nth slave chip ID generating units is configured to add a predetermined code value to an mth operation code to generate an (m+1)th operation code. The master chip ID generating unit is disposed in the master chip to generate a variable first operation code in response to a select signal. Here, ‘n’ is an integer that is equal to or greater than 2, and ‘m’ is an integer that is equal to or greater than 1 and equal to or smaller than ‘n’.

Abstract: A semiconductor apparatus having stacked first and second chips includes a first through line of the first chip configured to receive a first coding signal and be electrically connected to a first through line of the second chip; a second through line of the first chip configured to receive a second coding signal; and a second through line of the second chip configured to be electrically connected to the first through line of the first chip and receive the first coding signal.

Abstract: A semiconductor apparatus may comprise: a first chip ID generation unit configured to receive an enable signal through a first through-silicon via and a clock signal through a second through-silicon via and generate a first chip ID signal and a delayed enable signal; a second chip ID generation unit configured to receive the delayed enable signal through a third through-silicon via from the first chip ID generation unit and the clock signal and generate a second chip ID signal; a first chip selection signal generation unit configured to receive the first chip ID signal and a main ID signal and generate a first chip selection signal; and a second chip selection signal generation unit configured to receive the second chip ID signal and the main ID signal and generate a second chip selection signal.

Abstract: A semiconductor memory apparatus includes an internal circuit configured to be driven by current flowing between first and second voltage nodes, and a current control unit configured to control an amount of the current in response to an operational-speed information signal.

Abstract: Provided is a 3D stacked semiconductor integrated circuit including a plurality of chips coupled through a plurality of TSVs. A first chip among the plurality of chips is configured to detect and repair a defective TSV among the plurality of TSVs, and transmit repair information to remaining chips other than the first chip, and the remaining chips other than the first chip are configured to repair the defective TSV in response to the repair information.

Abstract: A resistance calibration code generating apparatus includes a code calibration unit configured to calibrate and output code values of a resistance calibration code during predetermined cycles of a calibration clock, which are determined by a code calibration time control command, and a calibration clock generating unit configured to output the calibration clock using a code calibration command.

Abstract: A buffer circuit of a semiconductor memory apparatus includes a compensation voltage generation unit configured to generate a compensation voltage in response to a level of a reference voltage; and a buffering unit configured to generate an output signal by buffering an input signal depending on the reference voltage and control a transition section of the output signal depending on a level of the compensation voltage.

Abstract: A semiconductor memory apparatus includes a clock control unit configured to receive a first clock when an enable signal is activated and generate a second clock which has a cycle closer in length to a target clock cycle than the first clock; a DLL input clock generation unit configured to output one of the first clock and the second clock as a DLL input clock according to a DLL select signal; and an address/command input clock generation unit configured to output one of the first clock and the second clock as an AC input clock according to the enable signal.

Abstract: A semiconductor system for identifying stacked chips includes a first semiconductor chip and a plurality of second semiconductor chips. The first semiconductor chip generates a plurality of counter codes by using an internal clock or an external input clock and transmits slave address signals and the counter codes through a through-chip via. The second semiconductor chips are given corresponding identifications (IDs) by latching the counter codes for a predetermined delay time, compare the latched counter codes with the slave address signals, and communicate data with the first semiconductor chip through the through-chip via according to the comparison result.

Abstract: A semiconductor buffer circuit that operates stably against PVT fluctuation is disclosed. The disclosed semiconductor buffer unit of the present invention includes: a detecting block configured to generate a plurality of code signals by detecting an external voltage, using a plurality of reference voltages; and a buffer unit configured to receive an input signal and the plurality of code signals and, based on the code signals, to generate an output signal, wherein a consumption of a driving current of the buffer unit is controlled based on the code signals.

Abstract: A semiconductor integrated circuit includes: a semiconductor chip; a through-chip via passing through a conductive pattern disposed in the semiconductor chip and cutting the conductive pattern; and an insulation pattern disposed on an outer circumference surface of the through-chip via to insulate the conductive pattern from the through-chip via.

Abstract: A semiconductor integrated circuit having a multi-chip structure includes a number of stacked semiconductor chips. Each of the semiconductor chips includes a first through electrode formed through the semiconductor chip, a first bump pad formed over the semiconductor chip at a region where the first bump pad is separated from the first through electrode, a first internal circuit formed inside the semiconductor chip, coupled to the first through electrode through a first metal path, and coupled to the first bump pad through a second metal path; and a redistribution layer (RDL) formed over a backside of the semiconductor chip.

Abstract: A semiconductor apparatus includes an individual-chip-designating-code setting block configured to generate a plurality of sets of individual-chip-designating-codes which have different code values or in which at least two sets of individual-chip-designating-codes have the same code value, in response to a plurality of chip fuse signals; a control block configured to generate a plurality of enable control signals in response to the plurality of chip fuse signals and most significant bits of the plurality of sets of individual-chip-designating-codes; and an individual chip activation block configured to compare individual-chip-designating-codes of the plurality of sets of individual-chip-designating-codes excluding the most significant bits, with chip selection addresses in response to the plurality of enable control signals, and enable one of a plurality of individual-chip-activation-signals depending upon a comparison result.

Abstract: A core voltage discharger is capable of adjusting an amount of a current discharged according to temperature. The discharger for decreasing a level of a predetermined voltage receives temperature information from an on die thermal sensor and discharges a different amount of current in response to the temperature information.

Abstract: An internal voltage generator of a semiconductor device includes a charge pumping unit for performing a charge pumping operation on the basis of the voltage level of a reference voltage to generate a charge pumped voltage having a voltage level higher than the external power supply voltage; and an internal voltage generating unit for performing a charge pumping operation on the basis of an internal voltage level that is linear with respect to a temperature change in a first temperature range to generate an internal voltage, and to perform a charge pumping operation on the basis of an internal voltage clamping level that is constant independent of a temperature change in a second temperature range to generate the internal voltage.

Abstract: A semiconductor memory device of the claimed invention, having an active state for performing a read or write operation and an inactive state except for the active state includes a data input/output (I/O) line; a pull-up latch unit for pulling-up the data I/O line when the semiconductor memory device is in the inactive state; a pull-down latch unit for pulling-down the data I/O line when the semiconductor memory device is in the inactive state; and a selection unit for selectively driving one of the pull-up latch unit and the pull-down latch unit.

Abstract: A semiconductor apparatus includes an individual chip designating code setting block configured to generate a plurality of individual chip designating codes which have different code values or at least two of which have the same code value, in response to a plurality of chip fuse signals; and an individual chip activation block configured to compare the plurality of individual chip designating codes with chip selection address in response to the plurality of chip fuse signals, and enable one of a plurality of individual chip activation signals based on a result of the comparison.

Abstract: A semiconductor device includes: a first reference voltage generator for generating a first reference voltage; a first band gap circuit for dividing a voltage at a second reference voltage output node to produce a first and a second band gap voltages having a property relative to temperature variations; a first comparator for receiving the first reference voltage as a bias input and comparing the first band gap voltage with the second band gap voltage; and a first driver for pull-up driving the second reference voltage output node in response to an output signal of the first comparator.

Abstract: In an apparatus for generating a power-up signal, a mode register set (MRS) and other circuits are prevented from being reset, thereby providing stable circuit operation. A final power-up signal is not disabled even though an internal voltage generating unit is turned off at a test mode. The apparatus includes a power-up signal generator for producing a power-up signal; a multiplexing unit for selectively outputting the power-up signal or a static voltage signal in a test mode; and a power-up signal generator for producing a final power-up signal in response to the power-up signal of the power-up signal generator and an output signal of the multiplexing unit as the final power-up signal.