Abstract: A semiconductor integrated circuit includes: a plurality of chips configured to receive an external voltage. Each one of the chips detects a signal delay characteristic of the one of the chips to generate an internal voltage having a level corresponding to the signal delay characteristic.

Abstract: A delay circuit includes: a delay unit configured to receive a clock signal, delay an input signal sequentially by a predetermined time interval, and output a plurality of first delayed signals; and an option unit configured to select one of the plurality of first delayed signals based on one or more select signals, and output a second delayed signal.

Abstract: A semiconductor apparatus has a plurality of chips stacked therein. Read control signals for controlling read operations of the plurality of chips are synchronized with a reference clock such that the time taken from the application of a read command to the output of data for each of the plurality of chips is maintained substantially the same.

Abstract: A semiconductor apparatus has a plurality of chips stacked therein, and generation timing of read control signals for controlling read operations of the plurality of stacked chips is controlled such that times after a read command is applied to when data are outputted from respective chips are made to substantially correspond to one another.

Abstract: The internal voltage generating apparatus includes a first charge pumping circuit, an external voltage level detector, and a second charge pumping circuit. The first charge pumping circuit outputs an internal voltage and selectively performs first charge pumping for the internal voltage depending on a result detecting a level of the internal voltage feed-backed. The external voltage level detector detects a level of an external voltage and outputs the result detecting the level of the internal voltage and outputs a result detecting the level of the external voltage as a detection signal. The second charge pumping circuit performs second charge pumping for the internal voltage together with the first charge pumping against a case in which the level of the external voltage is lower than a predetermined level by the detection signal of the external voltage level detector.

Abstract: A delay circuit of a semiconductor memory apparatus includes a decoding unit configured to decode a plurality of test signals and enable one of a plurality of control signals; a bias voltage generation unit configured to generate a first bias voltage and a second bias voltage depending upon the control signal enabled among the plurality of control signals; and a delay unit configured to determine a delay time depending upon levels of the first and second bias voltages, delay an input signal by the determined delay time, and output a resultant signal as an output signal.

Abstract: A semiconductor device includes: a first reference voltage generator for generating a first reference voltage; a first band gap circuit for dividing a voltage at a second reference voltage output node to produce a first and a second band gap voltages having a property relative to temperature variations; a first comparator for receiving the first reference voltage as a bias input and comparing the first band gap voltage with the second band gap voltage; and a first driver for pull-up driving the second reference voltage output node in response to an output signal of the first comparator.

Abstract: In an apparatus for generating a power-up signal, a mode register set (MRS) and other circuits are prevented from being reset, thereby providing stable circuit operation. A final power-up signal is not disabled even though an internal voltage generating unit is turned off at a test mode. The apparatus includes a power-up signal generator for producing a power-up signal; a multiplexing unit for selectively outputting the power-up signal or a static voltage signal in a test mode; and a power-up signal generator for producing a final power-up signal in response to the power-up signal of the power-up signal generator and an output signal of the multiplexing unit as the final power-up signal.

Abstract: A buffer of a semiconductor memory apparatus includes a buffering section configured to generate an output signal by buffering an input signal. A mismatch compensation section generates a control voltage in correspondence with sizes of a second transistor of the same type as a first transistor constituting the buffering section, wherein the buffering section controls a transition time of the output signal in response to a level of the control voltage.

Abstract: A semiconductor apparatus having a plurality of semiconductor chips is configured in such a manner that the plurality of semiconductor chips share one or more source voltages generated in one of the plurality of semiconductor chips.

Abstract: A circuit for testing a semiconductor apparatus includes a test voltage applying unit configured to apply a test voltage to a first end of a through-silicon via (TSV) in response to a test mode signal and a detecting unit configured to be connected to a second end of the TSV and detect a current outputted from the second end of the TSV.

Abstract: A semiconductor apparatus comprises a power-up signal generation section configured to generate a power-up signal, a driver configured to drive and output the power-up signal, and a main circuit block configured to perform predetermined functions in response to an output from the driver, wherein the power-up signal generation section and an input terminal of the driver are connected by a disconnectable element.

Abstract: A calibration circuit of an on-die termination device includes a code generating unit configured to receive a voltage of a calibration node connected to an external resistor and a reference voltage to generate pull-up calibration codes. The calibration circuit also includes a pull-up calibration resistor unit configured to pull up the calibration node in response to the pull-up calibration codes. The pull-up calibration resistor unit is calibrated such that its resistance becomes higher as a power supply voltage increases.

Abstract: A core voltage discharger is capable of adjusting an amount of a current discharged according to temperature. The discharger for decreasing a level of a predetermined voltage receives temperature information from an on die thermal sensor and discharges a different amount of current in response to the temperature information.

Abstract: A semiconductor memory device employs a clamp for preventing latch up. For the purpose, the semiconductor memory device includes a precharging/equalizing unit for precharging and equalizing a pair of bit lines, and a control signal generating unit for producing a control signal which controls enable and disable of the precharging/equalizing unit, wherein the control signal generating unit includes a clamping unit to clamp its source voltage to a voltage level lower than that of its bulk bias.

Abstract: A semiconductor buffer circuit that operates stably against PVT fluctuation is disclosed. The disclosed semiconductor buffer unit of the present invention includes: a detecting block configured to generate a plurality of code signals by detecting an external voltage, using a plurality of reference voltages; and a buffer unit configured to receive an input signal and the plurality of code signals and, based on the code signals, to generate an output signal, wherein a consumption of a driving current of the buffer unit is controlled based on the code signals.

Abstract: A semiconductor memory apparatus that generates a voltage by performing a pumping operation in response to an oscillator signal includes a driving voltage detecting unit configured to control the cycle of the oscillator signal in accordance with the level of a driving voltage that is used to perform the pumping operation.

Abstract: The internal voltage generating apparatus includes a first charge pumping circuit, an external voltage level detector, and a second charge pumping circuit. The first charge pumping circuit outputs an internal voltage and selectively performs first charge pumping for the internal voltage depending on a result detecting a level of the internal voltage feed-backed. The external voltage level detector detects a level of an external voltage and outputs the result detecting the level of the internal voltage and outputs a result detecting the level of the external voltage as a detection signal. The second charge pumping circuit performs second charge pumping for the internal voltage together with the first charge pumping against a case in which the level of the external voltage is lower than a predetermined level by the detection signal of the external voltage level detector.

Abstract: An apparatus for supplying an overdriving signal in a memory apparatus. The apparatus includes: a voltage detecting block that outputs a plurality of detection signals according to the level of an external voltage, and a pulse generator that outputs the overdriving signals having different pulse widths according to the plurality of detection signals.

Abstract: An internal voltage generation circuit of a semiconductor memory device controls a dead zone voltage, in which the driving unit that supplies a power supply voltage, does not need to operate. An internal voltage having a dead zone is determined by first and second driving signals based on a level of a reference voltage, and by selectively supplying first and second voltages by means of the first and second driving signals.