Abstract: A camera module includes a housing, a frame disposed in an interior space of the housing, a movable body, a lens holder, first and second optical image stabilization (OIS) actuators. The movable body is configured to move in a first direction, perpendicular to an optical axis. The lens holder is configured to move in a second direction perpendicular to the first direction. The first OIS actuator is configured to move the movable body in the first direction. The second OIS actuator is configured to move the lens holder in the second direction. The frame includes a first opening through which a first OIS coil and a first OIS magnet of the first OIS actuator are disposed to face each other, and a second opening through which a second OIS coil and a second OIS magnet of the second OIS actuator are disposed to face each other.

Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected through coil connecting portions and include coil patterns disposed on an outer side and coil patterns disposed on an inner side thereof, a coil pattern disposed on the inner side adjacent to the coil pattern disposed on the outer side includes two coil connecting portions spaced apart from each other and facing each other in a length direction of the body, and a dummy electrode pattern is further disposed in a void portion between two coil connecting portions.

Abstract: A camera module is provided. The camera module includes a lens module having at least one lens; a housing, configured to accommodate the lens module; and a driving unit, disposed between the lens module and the housing, and including a magnet portion and a coil portion, wherein the coil portion is disposed to surround the magnet portion.

Abstract: A rotor apparatus is provided. The rotor apparatus includes a rotor, configured to rotate around a rotational axis, an angular position identification layer configured to surround surface of the rotor, and configured to rotate with the rotor, and configured to have a width that varies based on an angular position of the rotor, and a permeability layer configured to surround the surface of the rotor, and configured to have a higher permeability than a permeability of the rotor.

Abstract: A coil component includes a body including an internal coil and including an upper surface and a lower surface opposing each other in a thickness direction thereof; a first external electrode connected to one end of the internal coil; and a second external electrode connected to the other end of the internal coil. The first external electrode and the second external electrode may be formed on the same one side portion of the lower surface of the body.

Abstract: A coil component includes: a body having a first surface and a second surface opposing each other in a thickness direction of the body and a wall surface connecting the first and second surfaces; a coil part including coil patterns and including at least one turn centered on the thickness direction; external electrodes disposed on the first surface of the body and electrically connected to the coil part; a shielding layer including a cap portion disposed on the second surface of the body and side wall portions disposed on the wall surface of the body and each having a first end connected to the cap portion; an insulating layer disposed between the body and the shielding layer; and a gap portion bounded by a second end of the shielding layer opposing the first end and the first surface of the body to expose portions of the wall surface.

Abstract: A chip antenna module includes: a substrate including a feed wiring layer to provide a feed signal, a feeding via connected to the feed wiring layer, and a dummy via separated from the feed wiring layer; and a chip antenna disposed on a first surface of the substrate and including a body portion formed of a dielectric substance, a radiating portion that extends from a first surface of the body portion and is connected to the feeding via and the dummy via, and a grounding portion that extends from a second surface of the body portion opposite the first surface of the body portion.

Abstract: A coil component includes a body including an internal coil and first and second external electrodes respectively disposed on outer surfaces of the body. The first and second external electrodes extend from a lower surface of the body to first and second end surfaces connected thereto, respectively. The first external electrode on the first end surface and the second external electrode on the second end surface each include a base portion and an extending portion extending from the base portion in a height direction, having a predetermined height, and having a width narrower than a width of the base portion.

Abstract: A camera module includes a fixed portion, a movable portion configured to be moved relative to the fixed portion in an optical axis direction, at least two position detection sensors, and a magnet disposed to oppose the at least two position detection sensors in a direction intersecting the optical axis direction. The magnet includes an N-pole and an S-pole on a surface opposing the at least two position detection sensors and a neutral zone between the N-pole and the S-pole. The at least two position detection sensors are disposed such that at least one position detection sensor opposes one of the N-pole and the S-pole and at least one other positon detection sensor opposes the neutral zone when the movable portion is moved in the optical axis direction.

Abstract: A semiconductor package includes a frame having a through-hole, and a first semiconductor chip disposed in the through-hole of the frame and having an active surface on which a connection pad is disposed, an inactive surface opposing the active surface, and a side surface connecting the active and inactive surfaces. A first encapsulant covers at least a portion of each of the inactive surface and the side surface of the first semiconductor chip. A connection structure has a first surface having disposed thereon the active surface of the first semiconductor chip, and includes a redistribution layer electrically connected to the connection pad of the first semiconductor chip. A first passive component is disposed on a second surface of the connection structure opposing the first surface, the first passive component being electrically connected to the redistribution layer and having a thickness greater than a thickness of the first semiconductor chip.

Abstract: A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.

Abstract: A multilayer capacitor and a board on which the multilayer capacitor is mounted provide increased capacitor effective area. The multilayer capacitor includes a capacitor body having first and second dielectric layers each with first and second internal electrodes, first and second external electrodes disposed on a surface of the capacitor body, a first via electrode connecting the first internal electrodes to the first external electrode, and a second via electrode connecting the second internal electrodes to the second external electrode. The first and second dielectric layers are alternately stacked in the first direction such that the first internal electrode of the first dielectric layer overlaps the second internal electrode of the second dielectric layer in a first direction, and the second internal electrode of the first dielectric layer overlaps the first internal electrode of the second dielectric layer in the first direction.

Abstract: Provided is a multilayer capacitor and a board on which the multilayer capacitor is mounted. The multilayer capacitor includes a capacitor body including first to six surfaces, first and second dielectric layers, and first and second internal electrodes; first and second external electrodes disposed on the first surface of the capacitor body; the first and second dielectric layers are alternately layered in a first direction such that the first internal electrode of the first dielectric layer overlaps the second internal electrode of the second dielectric layer in the first direction, and the second internal electrode of the first dielectric layer overlaps the first internal electrode of the second dielectric layer in the first direction.

Abstract: A multilayer capacitor includes a capacitor body including first and second dielectric layers, a plurality of internal electrodes, and a plurality of second internal electrodes, and first and second external electrodes. First and second internal electrodes are disposed in one of the first dielectric layers to be spaced apart from each other. The first and second internal electrodes are disposed in one of the second dielectric layers to be spaced apart from each other. The first and second dielectric layers are alternately laminated in the first direction, such that the first internal electrode of the first dielectric layer and the second internal electrode of the second dielectric layer overlap each other in the first direction and the second internal electrode of the first dielectric layer and the first internal electrode of the second dielectric layer overlap each other in the first direction.

Abstract: A semiconductor package includes: a frame having a first surface and a second surface opposing each other, and including a through-hole and a wiring structure connected to the first surface and the second surface; a connection structure disposed on the first surface of the frame and including a redistribution layer; a semiconductor chip disposed in the through-hole and including connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip and covering the second surface of the frame; and a plurality of electrical connection metal members disposed on the second surface of the frame and connected to the wiring structure. The wiring structure includes a shielding wiring structure surrounding the through-hole, and the plurality of electrical connection metal members include a plurality of grounding electrical connection metal members connected to the shielding wiring structure.

Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.

Abstract: A camera module includes: a housing in which a lens module is accommodated; and a shake correction portion including first and second movable yokes mounted on the lens module and first and second coil portions disposed to oppose the first and second movable yokes, respectively. The first coil portion is configured to attract the first movable yoke in response to power being applied to the first coil portion. The second coil portion is configured to attract the second movable yoke in response to power being applied to the second coil portion.

Abstract: A camera module includes a housing, a frame disposed in an interior space of the housing, a movable body, a lens holder, first and second optical image stabilization (OIS) actuators. The movable body is configured to move in a first direction, perpendicular to an optical axis. The lens holder is configured to move in a second direction perpendicular to the first direction. The first OIS actuator is configured to move the movable body in the first direction. The second OIS actuator is configured to move the lens holder in the second direction. The frame includes a first opening through which a first OIS coil and a first OIS magnet of the first OIS actuator are disposed to face each other, and a second opening through which a second OIS coil and a second OIS magnet of the second OIS actuator are disposed to face each other.

Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.

Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.