Abstract: Provided is a method of detecting a concentrated address of a semiconductor device using an n-bit address. The method includes dividing the n-bit address into k groups, wherein each of n and k is an integer equal to or greater than 2, for each group of the k groups, detecting one or more concentrated sub addresses corresponding to the group, and generating at least one concentrated address by combining the one or more concentrated sub addresses for the k groups.

Abstract: A semiconductor memory device includes a memory cell array configured to store data including a verification code; a sensing unit configured to sense the stored data including the verification code; and a verification unit configured to determine whether the sensing unit is able to sense the stored data based on a sensing condition, wherein the verification unit is configured to determine whether the sensing unit is able to sense the stored data based on the sensing condition and a value of the verification code sensed by the sensing unit.

Abstract: Provided are a method and an apparatus for repairing a memory cell in a memory test system. A test device detects a fail address by testing a memory device according to a test command, and temporarily stores the fail address in a fail address memory (FAM). The fail address is transmitted to the memory device according to a fail address transmission mode, is temporarily stored in a temporary fail address storage of the memory device, and is then stored in an anti-fuse array, which is a non-volatile storage device. To secure the reliability of data, stored data can be read to verify the data and a verification result can be transmitted in series or in parallel to the test device.

Abstract: A semiconductor memory device includes a memory cell array, a repair control circuit and a refresh control circuit. The memory cell array includes a plurality of memory cells and a plurality of redundancy memory cells. The repair control circuit receives a repair command and performs a repair operation on a first defective memory cell among the plurality of memory cells during a repair mode. The semiconductor memory device may operate in a repair mode in response to the repair command. The refresh control circuit performs a refresh operation on non-defective ones of the plurality of memory cells during the repair mode.

Abstract: Provided are a method and an apparatus for repairing a memory cell in a memory test system. A test device detects a fail address by testing a memory device according to a test command, and temporarily stores the fail address in a fail address memory (FAM). The fail address is transmitted to the memory device according to a fail address transmission mode, is temporarily stored in a temporary fail address storage of the memory device, and is then stored in an anti-fuse array, which is a non-volatile storage device. To secure the reliability of data, stored data can be read to verify the data and a verification result can be transmitted in series or in parallel to the test device.

Abstract: Provided are a microorganism for use in quantification of homocysteine and methionine and a method of quantifying homocysteine and methionine in a sample by using the microorganism.

Abstract: A semiconductor memory device includes a first memory block of a first type of memory; and a second memory block of a second type of memory having a different type from the first type. A first address region of the first memory block and a second address region of the second memory block are included in the same address domain. Each of the first and second memory blocks is accessed by an address signal including an address of the address domain, and the second memory block is a nonvolatile memory.

Abstract: A semiconductor memory device includes a memory cell array configured to store data including a verification code; a sensing unit configured to sense the stored data including the verification code; and a verification unit configured to determine whether the sensing unit is able to sense the stored data based on a sensing condition, wherein the verification unit is configured to determine whether the sensing unit is able to sense the stored data based on the sensing condition and a value of the verification code sensed by the sensing unit.

Abstract: Provided are a method and an apparatus for repairing a memory cell in a memory test system. A test device detects a fail address by testing a memory device according to a test command, and temporarily stores the fail address in a fail address memory (FAM). The fail address is transmitted to the memory device according to a fail address transmission mode, is temporarily stored in a temporary fail address storage of the memory device, and is then stored in an anti-fuse array, which is a non-volatile storage device. To secure the reliability of data, stored data can be read to verify the data and a verification result can be transmitted in series or in parallel to the test device.

Abstract: Provided are a microorganism for use in quantification of homocysteine and methionine and a method of quantifying homocysteine and methionine in a sample by using the microorganism.

Abstract: A semiconductor memory device for reducing ripple noise of a back-bias voltage, and a method of driving the semiconductor memory device include a word line driving circuit and a delay logic circuit. The word line driving circuit enables a sub-word line connected to a selected memory cell to a first voltage, and disables the sub-word line of a non-selected memory cell to a second voltage and a third voltage, in response to a sub-word line enable signal, a first word line driving signal, and a second word line driving signal. The delay logic circuit controls the semiconductor memory device so that an amount of charge of the sub-word line that is introduced to the third voltage is greater than an amount of charge of the sub-word line that is introduced to the second voltage by changing a transition point of time of the sub-word line enable signal with respect to a transition point of time of the first word line driving signal, during the disabling of the sub-word line.

Abstract: A semiconductor memory device includes a bitline sensing amp detecting and amplifying data of a pair of bitlines from a memory cell, a column selecting unit transmitting the data of the pair of bitlines to a pair of local datalines in response to a column selecting signal, a dataline precharging unit precharging the pair of local datalines to a precharging voltage level in response to a precharging signal, and a dataline sensing amp detecting and amplifying data transmitted to the pair of local datalines. The dataline sensing amp includes a charge sync unit discharging the pair of local datalines at the precharging voltage level in response to a first dataline sensing enabling signal and data of the pair of local datalines, and a data sensing unit transmitting data of the pair of local datalines to a pair of global datalines in response to a second dataline sensing enabling signal.

Abstract: A bit line pre-charge circuit for a dynamic random access memory (DRAM) uses a charge sharing scheme. The pre-charge circuit includes switching elements disposed between a power voltage node and an output node, capacitors connected between intermediate nodes and ground. The switching elements being operated by successively activated control signals to effectively charge a bit line pair to one half a power voltage using charge sharing between the capacitors.

Abstract: A semiconductor memory device for reducing ripple noise of a back-bias voltage, and a method of driving the semiconductor memory device include a word line driving circuit and a delay logic circuit. The word line driving circuit enables a sub-word line connected to a selected memory cell to a first voltage, and disables the sub-word line of a non-selected memory cell to a second voltage and a third voltage, in response to a sub-word line enable signal, a first word line driving signal, and a second word line driving signal. The delay logic circuit controls the semiconductor memory device so that an amount of charge of the sub-word line that is introduced to the third voltage is greater than an amount of charge of the sub-word line that is introduced to the second voltage by changing a transition point of time of the sub-word line enable signal with respect to a transition point of time of the first word line driving signal, during the disabling of the sub-word line.

Abstract: A semiconductor memory device includes a bitline sensing amp detecting and amplifying data of a pair of bitlines from a memory cell, a column selecting unit transmitting the data of the pair of bitlines to a pair of local datalines in response to a column selecting signal, a dataline precharging unit precharging the pair of local datalines to a precharging voltage level in response to a precharging signal, and a dataline sensing amp detecting and amplifying data transmitted to the pair of local datalines. The dataline sensing amp includes a charge sync unit discharging the pair of local datalines at the precharging voltage level in response to a first dataline sensing enabling signal and data of the pair of local datalines, and a data sensing unit transmitting data of the pair of local datalines to a pair of global datalines in response to a second dataline sensing enabling signal.

Abstract: A bit line pre-charge circuit for a dynamic random access memory (DRAM) uses a charge sharing scheme. The pre-charge circuit includes switching elements disposed between a power voltage node and an output node, capacitors connected between intermediate nodes and ground. The switching elements being operated by successively activated control signals to effectively charge a bit line pair to one half a power voltage using charge sharing between the capacitors.

Abstract: A data output buffer includes an output terminal, a buffer and a pull-down driver. The output terminal is coupled to a first end of a transmission line, the transmission line being coupled to a pull-up termination resistor at a second end. The buffer pulls up the output terminal to a first power supply voltage and pulls down the output terminal to a second power supply voltage based on an output data signal. The pull-down driver pre-emphasizes an initial stage of a pull-down driving operation of the output terminal based on the output data.

Abstract: An internal voltage generating circuit for use in a semiconductor memory device includes a reference voltage input terminal to receive a reference voltage, a comparison unit to output a first internal voltage, the first internal voltage having a voltage level based at least in part on the reference voltage, a first feedback unit to receive the first internal voltage and an external voltage and to provide a first feedback internal voltage to the comparison unit, a loading circuit to output a second internal voltage, and a second feedback unit to receive the second internal voltage from the loading circuit and to provide a second feedback internal voltage to the comparison unit.

Abstract: We describe an input buffer having a stabilized operating point and an associated method. An input buffer may include a first differential amplifying unit to generate a first output signal having a first operating point and a second differential amplifying unit to generate a second output signal having a second operating point. An output control circuit varies respective weights of the first and second output signals responsive to an output control signal. The first differential amplifying unit may operate responsive to a reference voltage and an input voltage signal. The second differential amplifying unit may operate responsive to the reference voltage and the input voltage signal. The first operating point may be relatively higher than the second operating point.

Abstract: A dual data rate dynamic random access memory (DDR DRAM) device may operate in dual DDR modes via a mode selection circuit configured to enable a Dual Data Rate (DDR) 1 mode of operation for the DDR DRAM or a DDR2 mode of operation for the DDR DRAM.