Abstract: A light source unit includes; a first base layer, a plurality of conductive pads disposed on the first base layer, a second base layer disposed on the first base layer and including a plurality of openings therein exposing the plurality of conductive pads, a wiring portion disposed on the second base layer, and a plurality of light source elements disposed on the plurality of conductive pads exposed by the plurality of openings in the second base layer.

Abstract: The present invention relates to an integrated safety control system for vehicles. In particular, the present invention includes a sensor unit, an actuating unit, an actuating control unit, and an integrated control unit. The sensor unit includes a plurality of sensors for outputting sensed signals required for chassis control and Advanced Safety Vehicle (ASV) control of the vehicle. The actuating unit includes a plurality of actuating subunits for performing the chassis control and the ASV control. The actuating control unit includes a plurality of actuating control subunits provided for the respective actuating subunits, and configured to operate the respective actuating subunits. The integrated control unit compares and analyzes the sensed signals and selectively controls the respective actuating subunits so as to perform chassis control and ASV control in an integrated control manner.

Abstract: A pattern is inspected by acquiring a scanning electron microscope picture of an inspection pattern, and acquiring a scanning electron microscope secondary electron signal profile of the inspection pattern. A determination is made as to whether the inspection pattern is defective by comparing the scanning electron microscope picture of the inspection pattern to a scanning electron microscope picture of a sample pattern, and by comparing the scanning electron microscope secondary electron signal profile of the inspection pattern to a scanning electron microscope secondary electron signal profile of a sample pattern.

Abstract: The present invention relates to a sustained release film formulation for healing wound comprising epidermal growth factor, chitosan, viscosity modifiers, plasticizers, and stabilizers. Specifically, the present invention relates to a sustained release film formulation for healing wound comprising epidermal growth factor as an effective ingredient and chitosan as a main base, and additionally comprising one or more antioxidants selected from the group consisting of EDTA and vitamin C; one or more viscosity modifiers selected from the group consisting of hydroxypropylmethylcellulose, gellan gum and pullulan; and one or more plasticizers selected from the group consisting of glycerin, propylene glycol, polyethylene glycol, polyvinyl alcohol and polyvinylpyrrolidone thereto. When the present film is attached to wound site, it absorbs exudation from wound site, and so is changed to hydrogel to keep wound site humid, which is good for wound-healing.

Abstract: A pattern is inspected by acquiring a scanning electron microscope picture of an inspection pattern, and acquiring a scanning electron microscope secondary electron signal profile of the inspection pattern. A determination is made as to whether the inspection pattern is defective by comparing the scanning electron microscope picture of the inspection pattern to a scanning electron microscope picture of a sample pattern, and by comparing the scanning electron microscope secondary electron signal profile of the inspection pattern to a scanning electron microscope secondary electron signal profile of a sample pattern.

Abstract: A method for classifying defects of an object includes irradiating lights having different polarizations onto the object to create an inspection spot on the object, collecting scattered lights generated by the irradiated lights scattering from the inspection spot, and classifying defects of the object by type of defect by analyzing the scattered lights. An apparatus for classifying defects of an object includes light creating means emitting lights having different polarizations to create an inspection spot on the object, and a detecting member for collecting scattered lights that are created from the lights scattering from the inspection spot, wherein the scattered lights are analyzed and classified in accordance with defects positioned on the inspection spot of the object.

Abstract: A semiconductor memory device that performs an error control operation when an error exists in an externally received command or an externally received address, and a method of driving the semiconductor memory device are provided. The semiconductor memory device includes a memory cell array having a single-level cell area and a multi-level cell area, a command decoder which receives a command from an external source and decoding the command, an area determination unit which receives an address from an external source and determines whether a memory cell corresponding to the address belongs to either the single-level cell area or the multi-level cell area, a command flag generation unit which generates at least one enable control signal according to the decoded command and the determination result, and a logic circuit which generates a control signal for driving the memory cells included in the memory cell array or performs an error control operation, in response to the enable control signal.

Abstract: A portable storage apparatus capable of freely changing a data bus width and a method of setting the data bus width of the apparatus are provided, where the portable storage apparatus has at least one command line and a plurality of data lines and includes a non-volatile memory, a command packet decoder, and a control unit such that the non-volatile memory stores data, the command packet decoder receives command packets through a command line and outputs command information by decoding the received command packets, the command packet decoder receives a data transmit command packet or a data request command packet and outputs a write command or a read command, address information, and data bus width information, the control unit performs a control operation in response to the command information and selects all or some of the plurality of data lines in response to the data bus width information and receives or transmits the data through the selected data line, and controls data writing or reading of the non-vo

Abstract: A portable storage apparatus capable of freely changing a data bus width and a method of setting the data bus width of the apparatus are provided, where the portable storage apparatus has at least one command line and a plurality of data lines and includes a non-volatile memory, a command packet decoder, and a control unit such that the non-volatile memory stores data, the command packet decoder receives command packets through a command line and outputs command information by decoding the received command packets, the command packet decoder receives a data transmit command packet or a data request command packet and outputs a write command or a read command, address information, and data bus width information, the control unit performs a control operation in response to the command information and selects all or some of the plurality of data lines in response to the data bus width information and receives or transmits the data through the selected data line, and controls data writing or reading of the non-vo

Abstract: A portable storage apparatus capable of freely changing a data bus width and a method of setting the data bus width of the apparatus are provided, where the portable storage apparatus has at least one command line and a plurality of data lines, and includes a non-volatile memory, a command packet decoder, and a control unit, such that the non-volatile memory stores data, the command packet decoder receives command packets through a command line and outputs command information by decoding the received command packets, the command packet decoder receives a data transmit command packet or a data request command packet and outputs a write command or a read command, address information, and data bus width information, the control unit performs a control operation in response to the command information and selects all or some of the plurality of data lines in response to the data bus width information and receives or transmits the data through the selected data line, and controls data writing or reading of the non-

Abstract: An auto focusing method and apparatus for determining a focusing evaluation value, comparing the focusing evaluation value with an acceptance level of a preset focusing evaluation value, and iteratively focusing, while widening the depth of focus, when the focusing evaluation value is lower than the acceptance level.

Abstract: A pattern is inspected by acquiring a scanning electron microscope picture of an inspection pattern, and acquiring a scanning electron microscope secondary electron signal profile of the inspection pattern. A determination is made as to whether the inspection pattern is defective by comparing the scanning electron microscope picture of the inspection pattern to a scanning electron microscope picture of a sample pattern, and by comparing the scanning electron microscope secondary electron signal profile of the inspection pattern to a scanning electron microscope secondary electron signal profile of a sample pattern.

Abstract: A pattern is inspected by acquiring a scanning electron microscope picture of an inspection pattern, and acquiring a scanning electron microscope secondary electron signal profile of the inspection pattern. A determination is made as to whether the inspection pattern is defective by comparing the scanning electron microscope picture of the inspection pattern to a scanning electron microscope picture of a sample pattern, and by comparing the scanning electron microscope secondary electron signal profile of the inspection pattern to a scanning electron microscope secondary electron signal profile of a sample pattern.

Abstract: An apparatus and method for measuring a dimension of a pattern on a semiconductor device are provided. The method may include at least overlapping a reference pattern with an actual pattern that may be formed on a substrate, comparing the actual pattern with the reference pattern to determine whether the actual pattern may be aligned with the reference pattern, moving the actual pattern or the reference pattern in accordance with the results of the comparison to align the actual pattern with the reference pattern, and measuring a dimension of the actual pattern.

Abstract: In an apparatus and a method of measuring a thickness of a multilayer on a substrate, a spectrum of reflected light reflected from the substrate is measured. A plurality of recipe data, each corresponding to one of a plurality of hypothetical multilayers, is stored. One of the plurality of hypothetical multilayers is initially assumed to be the multilayer actually formed on the substrate. A plurality of theoretical spectra is calculated using one of the plurality of recipe data in accordance with various theoretical thicknesses of one of the plurality of hypothetical multilayers. The measured spectrum is compared with the plurality of theoretical spectra to determine a temporary thickness of the multilayer. A reliability of the temporary thickness of the multilayer is estimated. The temporary thickness is output as a thickness of the multilayer on the substrate when the reliability of the temporary thickness is within an allowable range.

Abstract: An auto focusing method and apparatus for quantifying a focusing average value, comparing the focusing average value with an acceptance level of a preset focusing evaluation value, and iteratively focusing, while widening the depth of focus, when the focusing average value is lower than the acceptance level.

Abstract: A pattern is inspected by acquiring a scanning electron microscope picture of an inspection pattern, and acquiring a scanning electron microscope secondary electron signal profile of the inspection pattern. A determination is made as to whether the inspection pattern is defective by comparing the scanning electron microscope picture of the inspection pattern to a scanning electron microscope picture of a sample pattern, and by comparing the scanning electron microscope secondary electron signal profile of the inspection pattern to a scanning electron microscope secondary electron signal profile of a sample pattern.

Abstract: A method and apparatus for numerically analyzing a growth degree of grains grown on a surface of a semiconductor wafer, in which the growth degree of grains is automatically calculated and numerated through a computer by using an image file of the surface of the semiconductor wafer scanned by an SEM. A predetermined portion of a surface of the wafer is scanned using the SEM, and the scanned SEM image is simultaneously stored into a database. An automatic numerical program applies meshes to an analysis screen frame and selects an analysis area on a measured image. Thereafter, a smoothing process for reducing an influence of noise is performed on respective pixels designated by the meshes using an average value of image data of adjacent pixels. A standardization process is then performed, based on respective images in order to remove a brightness difference between the measured images.

Abstract: In an apparatus and a method of measuring a thickness of a multilayer on a substrate, a spectrum of reflected light reflected from the substrate is measured. A plurality of recipe data, each corresponding to one of a plurality of hypothetical multilayers, is stored. One of the plurality of hypothetical multilayers is initially assumed to be the multilayer actually formed on the substrate. A plurality of theoretical spectra is calculated using one of the plurality of recipe data in accordance with various theoretical thicknesses of one of the plurality of hypothetical multilayers. The measured spectrum is compared with the plurality of theoretical spectra to determine a temporary thickness of the multilayer. A reliability of the temporary thickness of the multilayer is estimated. The temporary thickness is output as a thickness of the multilayer on the substrate when the reliability of the temporary thickness is within an allowable range.

Abstract: A method for classifying defects of an object includes irradiating lights having different wavelengths onto the object to create an inspection spot on the object, collecting scattered lights generated by the irradiated lights scattering from the inspection spot, and classifying defects of the object by type of defect by analyzing the scattered lights. An apparatus for classifying defects of an object includes light creating means emitting lights having different wavelengths to create an inspection spot on the object, and a detecting member for collecting scattered lights that are created from the lights scattering from the inspection spot, wherein the scattered lights are analyzed and classified in accordance with defects positioned on the inspection spot of the object.