Patents by Inventor Sang-Pil Kim

Sang-Pil Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11390287
    Abstract: A device for identifying a road surface includes: storage for storing a deep learning-based road surface model; and a controller configured to identify a type of a road surface on which a vehicle is currently traveling, using the road surface model. The device for identifying a road surface can identify a type of a road surface on which the vehicle is traveling based on deep learning and control the terrain mode of the vehicle based on the identified type of the road surface. The type of the road surface on which the vehicle is traveling may be identified with a high accuracy and an optimal terrain mode may be set, thereby improving not only travel stability but also riding comfort of the vehicle.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: July 19, 2022
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Jung Mo Koo, Sang Pil Hwang, Hyung Il Koo, Yong Gyun Kim, Beom Geum Cho, So Yeon Kim, Min Sang Kim
  • Patent number: 11387441
    Abstract: Provided is a solid state battery which solves the problems of the conventional solid state battery, and is effectively inhibited from a dimensional change caused by charging/discharging, an increase in internal resistance and degradation of charging/discharging characteristics or cycle life at a high current. The solid state battery is provided with an electrode active material layer including a negative electrode active material, a solid electrolyte and a conductive material, wherein the negative electrode active material includes a carbonaceous material and the carbonaceous material includes a plurality of pores, a porosity of 10-60 vol %, and a pore size of 100-300 nm based on the largest diameter of the pores.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: July 12, 2022
    Inventors: Jun-Hyuk Song, Eun-Kyung Kim, Sang-Wook Woo, Jung-Pil Lee
  • Publication number: 20220214749
    Abstract: A haptic effect transmission method for providing real-time immersive content according to the present invention includes executing participatory content in which one or more users participate, collecting motion information of the users participating in the participatory content through a haptic device, multiplexing the motion information with video and audio files of the participatory content to obtain a multiplexed file, and demultiplexing the multiplexed file and providing the demultiplexed file to a display device and a haptic device of a client terminal.
    Type: Application
    Filed: September 18, 2019
    Publication date: July 7, 2022
    Inventors: Woo Chool PARK, Jun Hwan JANG, Yong Hwa KIM, Jin Wook YANG, Sang Pil YOON, Hyun Wook KIM, Eun Kyung CHO, Min Su CHOI, Jun Suk LEE, Jae Young YANG
  • Publication number: 20220205090
    Abstract: An apparatus for processing a substrate includes a first processing unit configured to have a first processing container having a first inner space and a first support unit supporting and rotating the substrate in the first inner space; a second processing unit configured to have a second processing container having a second inner space and a second support unit supporting and rotating the substrate in the second inner space; an exhaust unit configured to exhaust the first and the second inner space; a first exhaust pipe configured to have a first exhaust port for introducing atmosphere of the first inner space and exhaust the atmosphere introduced through the first exhaust port to the integrated duct; and a second exhaust pipe configured to have a second exhaust port for introducing atmosphere of the second inner space and exhaust the atmosphere introduced through the second exhaust port to the integrated duct.
    Type: Application
    Filed: December 29, 2021
    Publication date: June 30, 2022
    Inventors: Ju Won KIM, Yang Yeol RYU, Hee Man AHN, Jun Ho SEO, Dong Woon PARK, Sang Pil YOON
  • Publication number: 20220208569
    Abstract: The inventive concept provides a substrate treating apparatus. According to the inventive concept, the substrate treating apparatus treats the substrate by supplying a treating liquid on a rotating substrate. The exhaust unit exhausting an atmosphere of an inner space comprises: a first exhaust port introducing the atmosphere of the inner space, a first exhaust line provided to exhaust an atmosphere introduced through the first exhaust port in a first direction and a second exhaust port introducing the atmosphere of the inner space, and a second exhaust line provided to exhaust an atmosphere introduced through the second exhaust port in a second direction. The controller controls the support unit so an exhaust direction inside of the first exhaust line and the second exhaust line become a forward direction with respect to a rotation direction of the substrate.
    Type: Application
    Filed: December 28, 2021
    Publication date: June 30, 2022
    Applicant: SEMES CO., LTD.
    Inventors: JU WON KIM, JUN HO SEO, DONG WOON PARK, SANG PIL YOON
  • Publication number: 20220151064
    Abstract: A flexible circuit board comprises: a first dielectric which has a first signal line in contact with an upper surface or lower surface thereof, has a greater width than the first signal line, and extends along an extension direction of the first signal line; a second dielectric which is located below the first dielectric, has a second signal line in contact with the upper or lower surface thereof, has a greater width than the second signal line, and extends along an extension direction of the second signal line; a vertical section in which the first signal line and the second signal line are located on a same vertical line and the first signal line and the second signal line extend in parallel; and a horizontal section in which the position of the first signal line or the second signal line is changed through a via hole.
    Type: Application
    Filed: March 31, 2020
    Publication date: May 12, 2022
    Inventors: Sang Pil KIM, Ik Soo KIM, Byung Yeol KIM, Hee Seok JUNG
  • Publication number: 20220109808
    Abstract: Disclosed is a network-on-chip including a first data converter that receives first image data and second image data from at least one image sensor and encodes one image data among the first image data and the second image data, into first data, based on whether the first image data is identical to the second image data and a second data converter that receives non-image data from at least one non-image sensor and encodes the received non-image data into second data. The network-on-chip outputs the first data and the second data to transmit the first data and the second data to an external server at a burst length.
    Type: Application
    Filed: August 11, 2021
    Publication date: April 7, 2022
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Sukho LEE, Sang Pil KIM, Young Hwan BAE, Jae-Jin LEE, Kyuseung HAN, Tae Wook KANG, Sung Eun KIM, Hyuk KIM, Kyung Hwan PARK, Hyung-IL PARK, Kyung Jin BYUN, Kwang IL OH, In Gi LIM
  • Publication number: 20220110212
    Abstract: A flexible circuit board according to an embodiment includes a first signal line extending on a first plane, a first dielectric extending in an extension direction of the first signal line while being in contact with the first signal line, a second signal line extending on a second plane parallel with the first plane, and a second dielectric extending in an extension direction of the second signal line while being in contact with the second signal line. The first signal line includes a first part overlapped with the second signal line and a second part not overlapped with the second signal line when viewed in a normal direction of the first plane, and the second signal line includes a first part overlapped with the first signal line and a second part not overlapped with the first signal line when viewed in the normal direction.
    Type: Application
    Filed: March 4, 2020
    Publication date: April 7, 2022
    Inventors: Sang Pil KIM, Ik Soo KIM, Byung Yeol KIM, Hee Seok JUNG
  • Patent number: 11272611
    Abstract: A flexible circuit board with improved bending reliability and a manufacturing method thereof are disclosed, the flexible circuit board comprising: a first dielectric formed to be elongated in a horizontal direction; a second dielectric positioned above the first dielectric; a third dielectric spaced apart from the second dielectric in the horizontal direction and positioned above the first dielectric; a first cover layer positioned on the first dielectric and covering an upper portion of the first dielectric between the second dielectric and the third dielectric; a first bonding sheet positioned between the first dielectric and the second dielectric and covering an upper portion of one end of the first cover layer; and a second bonding sheet positioned between the first dielectric and the third dielectric and covering an upper portion of the other end of the first cover layer.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: March 8, 2022
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Byung Yeol Kim, Ik Soo Kim, Hee Seok Jung
  • Publication number: 20210360773
    Abstract: An antenna carrier includes a flexible circuit board, the flexible circuit board comprising: a first dielectric formed to include a width direction and a length direction; a first signal line positioned on one side in the width direction of an upper surface or a lower surface of the first dielectric; a second signal line spaced apart from the first signal line to the other side in the width direction and positioned on the upper surface or the lower surface of the first dielectric; a second dielectric positioned on one side in the width direction above the first dielectric and having the first signal line positioned below the second dielectric; a third dielectric spaced apart from the second dielectric to the other side in the width direction and positioned below the first dielectric, and having the second signal line positioned above the third dielectric; a first ground; and a second ground.
    Type: Application
    Filed: November 20, 2019
    Publication date: November 18, 2021
    Inventors: Sang Pil KIM, Byung Yeol KIM, Ik Soo KIM, Hee Seok JUNG
  • Publication number: 20210360780
    Abstract: A flexible circuit board with improved bending reliability and a manufacturing method thereof are disclosed, the flexible circuit board comprising: a first dielectric formed to be elongated in a horizontal direction; a second dielectric positioned above the first dielectric; a third dielectric spaced apart from the second dielectric in the horizontal direction and positioned above the first dielectric; a first cover layer positioned on the first dielectric and covering an upper portion of the first dielectric between the second dielectric and the third dielectric; a first bonding sheet positioned between the first dielectric and the second dielectric and covering an upper portion of one end of the first cover layer; and a second bonding sheet positioned between the first dielectric and the third dielectric and covering an upper portion of the other end of the first cover layer.
    Type: Application
    Filed: November 7, 2019
    Publication date: November 18, 2021
    Inventors: Sang Pil KIM, Byung Yeol KIM, Ik Soo KIM, Hee Seok JUNG
  • Publication number: 20210242554
    Abstract: The present invention relates to a transmission line having improved bending durability, which includes a strip structure or a micro-strip structure that is divided into a base part and a bending part that is bent and unfolded based on the base part, wherein the base part and the bending part include a signal line configured to extend in a length direction so as to transmit a high frequency signal, a first dielectric of which an upper surface or a lower surface is provided with the signal line formed thereon, and a second dielectric formed above the first dielectric; and the second dielectric is coupled to the first dielectric in the base part and separated from the first dielectric in the bending part.
    Type: Application
    Filed: July 18, 2019
    Publication date: August 5, 2021
    Inventors: Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Byung Yeol KIM, Hee seok JUNG
  • Patent number: 10750612
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: August 18, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10681803
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 9, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Byung Hoon Jo, Sang Pil Kim, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10624209
    Abstract: A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: April 14, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20200092226
    Abstract: Provided is a system-on-chip. A central controller is configured to, in response to a request from a host, generate a first signal for requesting error information related to an error from a design of an IP. A local controller is configured to generate a second signal including the error information of the target IP if the request from the host is determined to be for the target IP based on the first signal.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 19, 2020
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kyuseung HAN, Sukho LEE, Jae-Jin LEE, Sang Pil KIM, Young Hwan BAE, Kyung Jin BYUN
  • Patent number: 10561015
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: February 11, 2020
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10512158
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: December 17, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10477690
    Abstract: A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: November 12, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: D886073
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: June 2, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Ik Soo Kim, Byung Yeol Kim, Byung Hoon Jo, Hee seok Jung