Patents by Inventor Sang-Pil Kim

Sang-Pil Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10512158
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: December 17, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10477690
    Abstract: A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: November 12, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10448499
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: October 15, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10440816
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: October 8, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10440815
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: October 8, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190281696
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Application
    Filed: May 29, 2019
    Publication date: September 12, 2019
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190281695
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Application
    Filed: May 29, 2019
    Publication date: September 12, 2019
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190239343
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190239344
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10365687
    Abstract: A laptop computer, according to the present invention, comprises: a main body part comprising a mainboard and a coaxial cable, one end of which is connected to the mainboard; and a display part hinge-coupled with the main body part and comprising a flexible printed circuit board which is installed on the back of the display part and has one end thereof coupled with the other end of the coaxial cable.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: July 30, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190230786
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Application
    Filed: December 19, 2018
    Publication date: July 25, 2019
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190230787
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.
    Type: Application
    Filed: December 19, 2018
    Publication date: July 25, 2019
    Inventors: Byung Hoon Jo, Sang Pil Kim, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190230785
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.
    Type: Application
    Filed: December 19, 2018
    Publication date: July 25, 2019
    Inventors: Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10362675
    Abstract: Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: July 23, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10356895
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: July 16, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10340903
    Abstract: Provided is a semiconductor device including a target circuit, a monitoring circuit, and a voltage controller. The target circuit includes a transistor. The monitoring circuit is configured to measure a temperature of the target circuit or measure a delay time between an input and an output of the target circuit. The voltage controller is configured to adjust a driving voltage for driving the target circuit or a back-bias voltage for adjusting a threshold voltage of the transistor by referring to at least one of the temperature and the delay time. As the temperature increases, the delay time decreases.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: July 2, 2019
    Assignee: ELECTRONICS & TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Woojoo Lee, Jae-Jin Lee, Sukho Lee, Kyuseung Han, Sang Pil Kim, Young Hwan Bae
  • Patent number: 10299375
    Abstract: The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: May 21, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190053379
    Abstract: A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.
    Type: Application
    Filed: February 8, 2017
    Publication date: February 14, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Publication number: 20190045630
    Abstract: A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.
    Type: Application
    Filed: February 6, 2017
    Publication date: February 7, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Publication number: 20190041907
    Abstract: A laptop computer, according to the present invention, comprises: a main body part comprising a mainboard and a coaxial cable, one end of which is connected to the mainboard; and a display part hinge-coupled with the main body part and comprising a flexible printed circuit board which is installed on the back of the display part and has one end thereof coupled with the other end of the coaxial cable.
    Type: Application
    Filed: July 5, 2016
    Publication date: February 7, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG