Patents by Inventor Sang-Yeon Han

Sang-Yeon Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11822212
    Abstract: One embodiment of a camera module comprises: a lens barrel including at least one lens; a bobbin for accommodating the lens barrel; and a fixing part disposed between the lens barrel and the bobbin so as to inhibit the lens barrel from being separated from the bobbin, wherein one surface, which makes surface contact with the fixing part, of the bobbin can include a bobbin provided so as to protrude toward the lens barrel.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: November 21, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Yeon Han, Do Yun Kim, Jung Hwan Kim, Yong Nam Choi
  • Patent number: 11815735
    Abstract: The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: November 14, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Young Don O, Sang Yeon Han
  • Publication number: 20230300437
    Abstract: A camera module according to an embodiment includes a circuit board including a cavity; a first plate including a first region vertically overlapping the cavity and a second region other than the first region; a second plate disposed on the first region of the first plate; and an image sensor disposed on the second plate; and wherein an upper surface of the second plate is positioned lower than an upper surface of the circuit board.
    Type: Application
    Filed: August 26, 2021
    Publication date: September 21, 2023
    Applicant: LG INNOTEK CO., LTD.
    Inventor: Sang Yeon HAN
  • Publication number: 20230247272
    Abstract: The present embodiment relates to a camera device comprising: a bracket comprising a first hole and a second hole; a first camera module disposed in the first hole of the bracket; a second camera module disposed in the second hole of the bracket; a first magnet disposed on the outer surface of the first camera module; and a second magnet disposed at a position corresponding to the first magnet on the outer surface of the bracket, wherein the first magnet is fixed to the outer surface of the first camera module and the second magnet is movably disposed on the bracket.
    Type: Application
    Filed: May 4, 2021
    Publication date: August 3, 2023
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sang Yeon HAN, Deok Yong LEE, Woo Yeong LEE
  • Publication number: 20230112602
    Abstract: The present embodiment relates to a camera module comprising: a bobbin, which has a through-hole formed therein; a lens module, which is accommodated in the through-hole and is coupled to the bobbin; a protrusion formed to protrude from the outer peripheral surface of the lens module; and a recess formed to be recessed from the inner peripheral surface of the bobbin so as to accommodate at least a part of the protrusion, wherein the recess comprises a first guide portion, which extends downwards from the upper end of the bobbin, and a second guide portion, which extends so as to slope from the first guide portion.
    Type: Application
    Filed: November 30, 2022
    Publication date: April 13, 2023
    Inventors: Sang Yeon Han, Young Taek Oh
  • Patent number: 11594538
    Abstract: A semiconductor device includes a device isolation layer defining first and second active regions, a buried contact connected to the second active region, and first and second bit line structures disposed on the first and second active regions. Each of the first and second bit line structures comprises a bit line contact part and a bit line pass part. The bit line contact part is electrically connected to the first active region. The bit line pass part is disposed on the device isolation layer. A height of a lowest part of the buried contact is smaller than a height of a lowest part of the bit line pass part. The height of the lowest part of the buried contact is greater than a height of a lowest part of the bit line contact part. A lower end of the bit line pass part is buried in the second active region.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: February 28, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Ho Lee, Eun A Kim, Ki Seok Lee, Jay-Bok Choi, Keun Nam Kim, Yong Seok Ahn, Jin-Hwan Chun, Sang Yeon Han, Sung Hee Han, Seung Uk Han, Yoo Sang Hwang
  • Patent number: 11575820
    Abstract: Provided is a camera module. A camera module according to one aspect of the present invention comprises: a first bracket including a first hole; a second bracket which includes a first groove and which is connected to the first bracket; a first lens module arranged in the first hole of the first bracket; and a second lens module arranged in the first groove of the second bracket, wherein the second lens module is formed to be smaller than the first groove, and the second bracket has a first protrusion being extended inwardly from the inner side surface of the first groove so as to fix the position of the second lens module.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: February 7, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Sang Yeon Han
  • Patent number: 11567286
    Abstract: The present embodiment relates to a camera module comprising: a bobbin, which has a through-hole formed therein; a lens module, which is accommodated in the through-hole and is coupled to the bobbin; a protrusion formed to protrude from the outer peripheral surface of the lens module; and a recess formed to be recessed from the inner peripheral surface of the bobbin so as to accommodate at least a part of the protrusion, wherein the recess comprises a first guide portion, which extends downwards from the upper end of the bobbin, and a second guide portion, which extends so as to slope from the first guide portion.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: January 31, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Yeon Han, Young Taek Oh
  • Publication number: 20230022373
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate which includes a cell region and a core region, a boundary element separation film which is placed inside the substrate, and separates the cell region and the core region, and a bit line which is placed on the cell region and the boundary element separation film and extends along a first direction, in which the boundary element separation film includes a first region and a second region, a height of an upper side of the first region of the boundary element separation film is different from a height of an upper side of the second region of the boundary element separation film, on a basis of a bottom side of the boundary element separation film, and the bit line is placed over the first region and the second region of the boundary element separation film.
    Type: Application
    Filed: March 30, 2022
    Publication date: January 26, 2023
    Inventors: Jong In KANG, Jun Young CHOI, Yoon Gi HONG, Tae Hoon KIM, Sung-Jin YEO, Sang Yeon HAN
  • Publication number: 20220291476
    Abstract: The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
    Type: Application
    Filed: June 1, 2022
    Publication date: September 15, 2022
    Inventors: Young Don O, Sang Yeon HAN
  • Patent number: 11378772
    Abstract: The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: July 5, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Young Don O, Sang Yeon Han
  • Publication number: 20220197114
    Abstract: One embodiment of a camera module comprises: a lens barrel including at least one lens; a bobbin for accommodating the lens barrel; and a fixing part disposed between the lens barrel and the bobbin so as to inhibit the lens barrel from being separated from the bobbin, wherein one surface, which makes surface contact with the fixing part, of the bobbin can include a bobbin provided so as to protrude toward the lens barrel.
    Type: Application
    Filed: December 27, 2021
    Publication date: June 23, 2022
    Inventors: Sang Yeon Han, Do Yun Kim, Jung Hwan Kim, Yong Nam Choi
  • Publication number: 20220070347
    Abstract: Provided is a camera module. A camera module according to one aspect of the present invention comprises: a first bracket including a first hole; a second bracket which includes a first groove and which is connected to the first bracket; a first lens module arranged in the first hole of the first bracket; and a second lens module arranged in the first groove of the second bracket, wherein the second lens module is formed to be smaller than the first groove, and the second bracket has a first protrusion being extended inwardly from the inner side surface of the first groove so as to fix the position of the second lens module.
    Type: Application
    Filed: January 8, 2020
    Publication date: March 3, 2022
    Applicant: LG INNOTEK CO., LTD.
    Inventor: Sang Yeon HAN
  • Publication number: 20210408004
    Abstract: A semiconductor device includes a device isolation layer defining first and second active regions, a buried contact connected to the second active region, and first and second bit line structures disposed on the first and second active regions. Each of the first and second bit line structures comprises a bit line contact part and a bit line pass part. The bit line contact part is electrically connected to the first active region. The bit line pass part is disposed on the device isolation layer. A height of a lowest part of the buried contact is smaller than a height of a lowest part of the bit line pass part. The height of the lowest part of the buried contact is greater than a height of a lowest part of the bit line contact part. A lower end of the bit line pass part is buried in the second active region.
    Type: Application
    Filed: September 8, 2021
    Publication date: December 30, 2021
    Inventors: Sang Ho LEE, Eun A KIM, Ki Seok LEE, Jay-Bok CHOI, Keun Nam KIM, Yong Seok AHN, Jin-Hwan CHUN, Sang Yeon HAN, Sung Hee HAN, Seung Uk HAN, Yoo Sang HWANG
  • Patent number: 11121134
    Abstract: A semiconductor device includes a device isolation layer defining first and second active regions, a buried contact connected to the second active region, and first and second bit line structures disposed on the first and second active regions. Each of the first and second bit line structures comprises a bit line contact part and a bit line pass part. The bit line contact part is electrically connected to the first active region. The bit line pass part is disposed on the device isolation layer. A height of a lowest part of the buried contact is smaller than a height of a lowest part of the bit line pass part. The height of the lowest part of the buried contact is greater than a height of a lowest part of the bit line contact part. A lower end of the bit line pass part is buried in the second active region.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: September 14, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Ho Lee, Eun A Kim, Ki Seok Lee, Jay-Bok Choi, Keun Nam Kim, Yong Seok Ahn, Jin-Hwan Chun, Sang Yeon Han, Sung Hee Han, Seung Uk Han, Yoo Sang Hwang
  • Publication number: 20210098460
    Abstract: A semiconductor device includes a device isolation layer defining first and second active regions, a buried contact connected to the second active region, and first and second bit line structures disposed on the first and second active regions. Each of the first and second bit line structures comprises a bit line contact part and a bit line pass part. The bit line contact part is electrically connected to the first active region. The bit line pass part is disposed on the device isolation layer. A height of a lowest part of the buried contact is smaller than a height of a lowest part of the bit line pass part. The height of the lowest part of the buried contact is greater than a height of a lowest part of the bit line contact part. A lower end of the bit line pass part is buried in the second active region.
    Type: Application
    Filed: April 28, 2020
    Publication date: April 1, 2021
    Inventors: Sang Ho LEE, Eun A KIM, Ki Seok LEE, Jay-Bok CHOI, Keun Nam KIM, Yong Seok AHN, Jin-Hwan CHUN, Sang Yeon HAN, Sung Hee HAN, Seung Uk HAN, Yoo Sang HWANG
  • Publication number: 20200348487
    Abstract: The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
    Type: Application
    Filed: July 21, 2020
    Publication date: November 5, 2020
    Inventors: Young Don O, Sang Yeon HAN
  • Patent number: 10761292
    Abstract: The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: September 1, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Young Don O, Sang Yeon Han
  • Publication number: 20200150377
    Abstract: The present embodiment relates to a camera module comprising: a bobbin, which has a through-hole formed therein; a lens module, which is accommodated in the through-hole and is coupled to the bobbin; a protrusion formed to protrude from the outer peripheral surface of the lens module; and a recess formed to be recessed from the inner peripheral surface of the bobbin so as to accommodate at least a part of the protrusion, wherein the recess comprises a first guide portion, which extends downwards from the upper end of the bobbin, and a second guide portion, which extends so as to slope from the first guide portion.
    Type: Application
    Filed: January 15, 2020
    Publication date: May 14, 2020
    Inventors: Sang Yeon HAN, Young Taek OH
  • Patent number: 10571643
    Abstract: The present embodiment relates to a camera module comprising: a bobbin, which has a through-hole formed therein; a lens module, which is accommodated in the through-hole and is coupled to the bobbin; a protrusion formed to protrude from the outer peripheral surface of the lens module; and a recess formed to be recessed from the inner peripheral surface of the bobbin so as to accommodate at least a part of the protrusion, wherein the recess comprises a first guide portion, which extends downwards from the upper end of the bobbin, and a second guide portion, which extends so as to slope from the first guide portion.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: February 25, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Yeon Han, Young Taek Oh