Abstract: A method of forming a circuit includes providing a first substrate; positioning an interconnect region on a surface of the first substrate; providing a second substrate; positioning a device structure on a surface of the second substrate, the device structure including a stack of at least three doped semiconductor material layers; and bonding the device structure to the interconnect region.

Abstract: Vertically oriented semiconductor memory cells are added to a separately fabricated substrate that includes electrical devices and/or interconnect. The plurality of vertically oriented semiconductor memory cells are physically separated from each other, and are not disposed within the same semiconductor body. The plurality of vertically oriented semiconductor memory cells can be added to the separately fabricated substrate as a thin layer including several doped semiconductor regions which, subsequent to attachment, are etched to produce individual doped stack structures, which are then supplied with various dielectric coatings, gate electrodes, and contacts by means of further processing operations. Alternatively, the plurality of vertically oriented semiconductor memory cells may be completely fabricated prior to attachment. DRAMs, SRAMs, non-volatile memories, and combinations of memory types can be provided.

Abstract: An apparatus includes a semiconductor chip with a base support structure having a surface and an opposed surface. At least one device structure extends from the surface of the base support structure. A first conductive region is coupled to the base support structure. At least a portion of the first conductive region extends below the opposed surface.

Abstract: A method of coupling substrates together includes steps of providing first and second substrates. The second substrate includes a conductive bonding region positioned on its surface. Heat is provided to the conductive bonding region to reduce its number of defects. The surface of the conductive bonding region is bonded to the first substrate so that the conductive bonding region and the first substrate are coupled together.

Abstract: The present invention provides a method of coupling substrates together. The method includes providing first and second substrates and then coupling the first and second substrates together. One of the first and second substrates includes devices with an interconnect region positioned thereon and the other substrate carries a device structure.

Abstract: A method for forming a dual damascene interconnect in a dielectric layer is provided. Generally, a first aperture is etched in the dielectric. A poison barrier layer is formed over part of the dielectric, which prevents resist poisoning. A patterned mask is formed over the poison barrier layer. A second aperture is etched into the dielectric layer, wherein at least part of the first aperture shares the same area as at least part of the second aperture.

Abstract: The present invention relates to a method for processing an address of a short message service center in a WCDMA network, including: a load centralization confirmation step where an operation control unit receives short message processing states from each short message service center, confirms load centralization states of each short message service center, and generates an operation message; a path setup step where a mobile switching center receives a short message from a mobile station, and sets up a transmission path of the short message according to the operation message; and an optimal transmission step where the mobile switching center transmits the short message from the mobile station to the corresponding short message service center through the transmission path according to the result of the path setup step.

Abstract: Circuitry includes first and second circuits spaced apart by an interconnect region. The interconnect region includes a first interconnect and the second circuit includes a stack of semiconductor layers. The first interconnect extends between the first and second circuits to provide communication therebetween. The second circuit operates as a memory circuit.

Abstract: A novel polyvinyl alcohol-based polymer membrane is disclosed. The novel polyvinyl alcohol-based polymer membrane of the present invention comprises two different compounds which are crosslinked by irradiating light such as UV or electronic beams or heat treatment to form a covalent bond between double bonds thereby providing improved properties such as chemical resistance and durability. This invention also relates to a process its preparation.

Abstract: A back light structure includes lamps for supplying light to an LCD panel, and a micro-lens formed on over or below the lamps, the micro-lens having a plurality of concave portions or convex portions.

Abstract: An optical disc drive including a main frame in which a turntable is provided; a tray on which the optical disc is mounted and which is slidable in the main frame; a cover, which covers a top surface of the main frame and includes a clamper to fix the optical disc in the turntable; and a noise reducer, which is disposed in the cover and causes air generated by rotation of the optical disc circulate from an inner circumference to an outer circumference of the optical disc and from the outer circumference to the inner circumference thereof, thereby reducing noise.

Abstract: The present invention discloses a dual stack mobile communication system for building a single interworking network of an old network which is a 2G/2.5G synchronous mobile communication network such as CDMA2000 communication network and a new network which is a 3G asynchronous mobile communication network such as a universal mobile telecommunications service (UMTS) network in a mobile communication network where the old network and the new network have coexisted the dual stack mobile communication system of the mobile communication network in which the old synchronous network and the new asynchronous network coexist forms a single node by combining same kind nodes of the old network and the new network, wherein the single node searches information for generating two output signal points according to a synchronous protocol and an asynchronous protocol in one input signal point according to the synchronous protocol or asynchronous protocol, and generates one output signal point.

Abstract: Vertically oriented semiconductor devices may be added to a separately fabricated substrate that includes electrical devices and/or interconnect. The plurality of vertically oriented semiconductor devices are physically separated from each other, and are not disposed within the same semiconductor body, or semiconductor substrate. The plurality of vertically oriented semiconductor devices may be added to the separately fabricated substrate as a thin layer including several doped semiconductor regions which, subsequent to attachment, are etched to produce individual doped stack structures. Alternatively, the plurality of vertically oriented semiconductor devices may be fabricated prior to attachment to the separately fabricated substrate. The doped stack structures may form the basis for diodes, capacitors, n-MOSFETs, p-MOSFETs, bipolar transistors, and floating gate transistors.

Abstract: The present invention relates to apparatus and method of providing a history of failed calls for a subscriber who is targeted by the failed calls. In the present invention, when an exchanger can not route a call to a target subscriber it notifies an HLR (Home Location Register) of call routing failure. Then, the HLR sends information about the failed call, which includes the called and the calling number, and call originating time (or call receiving time), to a call control system. The call control system adds the received failed-call information to a calling history for the called number. Afterwards, when the called number is accessible the call control system provides a subscriber of the called number with the calling history, whereby the subscriber can know all of calling numbers that requested to make connections with him or her while he or she was not able to communicate with a mobile network.

Abstract: The present invention discloses a method for tracking location of synchronous and asynchronous mobile communication network subscribers by using a dual stack home location register and a dual stack mobile positioning center. When the dual stack mobile positioning center externally receives a location tracking request for a subscriber, it requests reception subscriber information to the dual stack home location register, confirms whether the terminal is located in a synchronous or asynchronous mobile communication network by referring to the reception subscriber information from the dual stack home location register and network information, and requests location tracking for the terminal to the corresponding mobile communication network. Accordingly, location of the synchronous and asynchronous mobile communication network subscribers can be tracked in the network in which mobile communication networks using different protocols coexist.

Abstract: A method for forming a dual damascene interconnect in a dielectric layer is provided. Generally, a first aperture is etched in the dielectric. A poison barrier layer is formed over part of the dielectric, which prevents resist poisoning. A patterned mask is formed over the poison barrier layer. A second aperture is etched into the dielectric layer, wherein at least part of the first aperture shares the same area as at least part of the second aperture.

Abstract: The present invention relates to method and apparatus for providing an arbitrary sound chosen by a called subscriber instead of ringback tone to a calling subscriber. In this present invention, if a call is received, a terminating exchanger requests a trunk connection to a sound db server based on the first information on whether or not to replace a ringback tone and the second information on a route to the sound db server that are received from a home location register (HLR), and provides a called subscriber identification for the sound server. Then, the sound db server searches its db for a sound specified by the called, and provides the found sound for the caller instead of a conventional ringback tone via the terminating exchanger connected through a trunk. Through this sequential procedure of network elements, a caller can hear a sound specified by a called instead of a dry ringback tone.

Abstract: A method for forming a dual damascene interconnect in a dielectric layer is provided. Generally, a first aperture is etched in the dielectric. A poison barrier layer is formed over part of the dielectric, which prevents resist poisoning. A patterned mask is formed over the poison barrier layer. A second aperture is etched into the dielectric layer, wherein at least part of the first aperture shares the same area as at least part of the second aperture.

Abstract: The present invention discloses a mobile location based service system and method. The mobile location based service system includes an application server for receiving a location based service request, and providing a location based service of a mobile station, and a location information providing system for discriminating location of the mobile station according to a kind of a location information service, and transmitting the location of the mobile station to the application server. A cell or GPS based location based service can be selectively provided according to a function of a mobile station of a mobile communication subscriber and a service request type. The GPS based location based service can be provided by an SMS delivery point to point message through an N07 signal network, and thus embodied during a voice call of the mobile station.

Abstract: The present invention is directed to a silicon carbide anti-reflective coating (ARC) and a silicon oxycarbide ARC. Another embodiment is directed to a silicon oxycarbide ARC that is treated with oxygen plasma. The invention includes method embodiments for forming silicon carbide layers and silicon oxycarbide layers as ARC's on a semiconductor substrate surface. Particularly, the methods include introducing methyl silane materials into a process chamber where they are ignited as plasma and deposited onto the substrate surface as silicon carbide. Another method includes introducing methyl silane precursor materials with an inert carrier gas into the process chamber with oxygen. These materials are ignited into a plasma, and silicon oxycarbide material is deposited onto the substrate. By regulating the oxygen flow rate, the optical properties of the silicon oxycarbide layer can be adjusted. In another embodiment, the silicon oxycarbide layer can be treated with oxygen plasma.