Patents by Inventor Sang-Pil Kim
Sang-Pil Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11945864Abstract: A monoclonal antibody or an antigen-binding fragment thereof according to an embodiment of the present invention can bind to lymphocyte-activation gene 3 (LAG-3) including a heavy chain variable region and a light chain variable region and inhibit the activity thereof. Thus it is expected to be useful for the development of immunotherapeutic agents for various disorders that are associated with LAG-3.Type: GrantFiled: June 28, 2019Date of Patent: April 2, 2024Assignee: Y-BIOLOGICS INC.Inventors: Sang Pil Lee, Ji-Young Shin, Sunha Yoon, Yunseon Choi, Jae Eun Park, Ji Su Lee, Youngja Song, Gisun Baek, Seok Ho Yoo, Yeung-chul Kim, Dong Jung Lee, Bum-Chan Park, Young Woo Park
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Publication number: 20240103796Abstract: [SUMMARY] A method of providing an audio mixing interface using multiple audio stems according to embodiment may comprise an audio mixing screen display step which displays an audio mixing screen including an audio block screen indicating audio blocks corresponding to at least one stem item preset for at least one audio version pre-stored for the audio on the display of a user device by the processor, when audio to be mixed is executed by the user, an audio block selection step which displays a selection block on a display of the user device in a shade different from that of the audio blocks by the processor, when the selection block selected by the user exists among the audio blocks displayed on the audio mixing screen and an audio session generation step which combines the audio information included in the selection block and create one session audio, when the user's selection of the audio block is completed.Type: ApplicationFiled: September 20, 2023Publication date: March 28, 2024Applicant: Neutune Co.,Ltd.Inventors: Jong-Pil LEE, Sang-Eun KUM, Tae-Hyoung KIM, Keun-Hyoung KIM
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Publication number: 20240075853Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.Type: ApplicationFiled: April 13, 2023Publication date: March 7, 2024Applicants: Hyundai Motor Company, Kia Corporation, DAS CO., LTD, Faurecia Korea, Ltd., Hyundai Transys Inc.Inventors: Sang Soo LEE, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Sang Do PARK, Chan Ho JUNG, Dong Hoon LEE, Hea Yoon KANG, Deok Soo LIM, Seung Pil JANG, Seon Ho KIM, Jong Seok YUN, Hyo Jin KIM, Dong Gyu SHIN, Jin Ho SEO, Young Jun KIM, Taek Jun NAM
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Patent number: 11489241Abstract: The present invention relates to a transmission line having improved bending durability, which includes a strip structure or a micro-strip structure that is divided into a base part and a bending part that is bent and unfolded based on the base part, wherein the base part and the bending part include a signal line configured to extend in a length direction so as to transmit a high frequency signal, a first dielectric of which an upper surface or a lower surface is provided with the signal line formed thereon, and a second dielectric formed above the first dielectric; and the second dielectric is coupled to the first dielectric in the base part and separated from the first dielectric in the bending part.Type: GrantFiled: July 18, 2019Date of Patent: November 1, 2022Assignee: GIGALANE CO., LTD.Inventors: Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee seok Jung
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Patent number: 11470018Abstract: Provided is a system-on-chip. A central controller is configured to, in response to a request from a host, generate a first signal for requesting error information related to an error from a design of an IP. A local controller is configured to generate a second signal including the error information of the target IP if the request from the host is determined to be for the target IP based on the first signal.Type: GrantFiled: August 30, 2019Date of Patent: October 11, 2022Assignee: Electronics and Telecommunications Research InstituteInventors: Kyuseung Han, Sukho Lee, Jae-Jin Lee, Sang Pil Kim, Young Hwan Bae, Kyung Jin Byun
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Patent number: 11452200Abstract: An antenna carrier includes a flexible circuit board, the flexible circuit board comprising: a first dielectric formed to include a width direction and a length direction; a first signal line positioned on one side in the width direction of an upper surface or a lower surface of the first dielectric; a second signal line spaced apart from the first signal line to the other side in the width direction and positioned on the upper surface or the lower surface of the first dielectric; a second dielectric positioned on one side in the width direction above the first dielectric and having the first signal line positioned below the second dielectric; a third dielectric spaced apart from the second dielectric to the other side in the width direction and positioned below the first dielectric, and having the second signal line positioned above the third dielectric; a first ground; and a second ground.Type: GrantFiled: November 20, 2019Date of Patent: September 20, 2022Assignee: GIGALANE CO., LTD.Inventors: Sang Pil Kim, Byung Yeol Kim, Ik Soo Kim, Hee Seok Jung
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Publication number: 20220151064Abstract: A flexible circuit board comprises: a first dielectric which has a first signal line in contact with an upper surface or lower surface thereof, has a greater width than the first signal line, and extends along an extension direction of the first signal line; a second dielectric which is located below the first dielectric, has a second signal line in contact with the upper or lower surface thereof, has a greater width than the second signal line, and extends along an extension direction of the second signal line; a vertical section in which the first signal line and the second signal line are located on a same vertical line and the first signal line and the second signal line extend in parallel; and a horizontal section in which the position of the first signal line or the second signal line is changed through a via hole.Type: ApplicationFiled: March 31, 2020Publication date: May 12, 2022Inventors: Sang Pil KIM, Ik Soo KIM, Byung Yeol KIM, Hee Seok JUNG
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Publication number: 20220109808Abstract: Disclosed is a network-on-chip including a first data converter that receives first image data and second image data from at least one image sensor and encodes one image data among the first image data and the second image data, into first data, based on whether the first image data is identical to the second image data and a second data converter that receives non-image data from at least one non-image sensor and encodes the received non-image data into second data. The network-on-chip outputs the first data and the second data to transmit the first data and the second data to an external server at a burst length.Type: ApplicationFiled: August 11, 2021Publication date: April 7, 2022Applicant: Electronics and Telecommunications Research InstituteInventors: Sukho LEE, Sang Pil KIM, Young Hwan BAE, Jae-Jin LEE, Kyuseung HAN, Tae Wook KANG, Sung Eun KIM, Hyuk KIM, Kyung Hwan PARK, Hyung-IL PARK, Kyung Jin BYUN, Kwang IL OH, In Gi LIM
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Publication number: 20220110212Abstract: A flexible circuit board according to an embodiment includes a first signal line extending on a first plane, a first dielectric extending in an extension direction of the first signal line while being in contact with the first signal line, a second signal line extending on a second plane parallel with the first plane, and a second dielectric extending in an extension direction of the second signal line while being in contact with the second signal line. The first signal line includes a first part overlapped with the second signal line and a second part not overlapped with the second signal line when viewed in a normal direction of the first plane, and the second signal line includes a first part overlapped with the first signal line and a second part not overlapped with the first signal line when viewed in the normal direction.Type: ApplicationFiled: March 4, 2020Publication date: April 7, 2022Inventors: Sang Pil KIM, Ik Soo KIM, Byung Yeol KIM, Hee Seok JUNG
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Patent number: 11272611Abstract: A flexible circuit board with improved bending reliability and a manufacturing method thereof are disclosed, the flexible circuit board comprising: a first dielectric formed to be elongated in a horizontal direction; a second dielectric positioned above the first dielectric; a third dielectric spaced apart from the second dielectric in the horizontal direction and positioned above the first dielectric; a first cover layer positioned on the first dielectric and covering an upper portion of the first dielectric between the second dielectric and the third dielectric; a first bonding sheet positioned between the first dielectric and the second dielectric and covering an upper portion of one end of the first cover layer; and a second bonding sheet positioned between the first dielectric and the third dielectric and covering an upper portion of the other end of the first cover layer.Type: GrantFiled: November 7, 2019Date of Patent: March 8, 2022Assignee: GIGALANE CO., LTD.Inventors: Sang Pil Kim, Byung Yeol Kim, Ik Soo Kim, Hee Seok Jung
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Publication number: 20210360773Abstract: An antenna carrier includes a flexible circuit board, the flexible circuit board comprising: a first dielectric formed to include a width direction and a length direction; a first signal line positioned on one side in the width direction of an upper surface or a lower surface of the first dielectric; a second signal line spaced apart from the first signal line to the other side in the width direction and positioned on the upper surface or the lower surface of the first dielectric; a second dielectric positioned on one side in the width direction above the first dielectric and having the first signal line positioned below the second dielectric; a third dielectric spaced apart from the second dielectric to the other side in the width direction and positioned below the first dielectric, and having the second signal line positioned above the third dielectric; a first ground; and a second ground.Type: ApplicationFiled: November 20, 2019Publication date: November 18, 2021Inventors: Sang Pil KIM, Byung Yeol KIM, Ik Soo KIM, Hee Seok JUNG
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Publication number: 20210360780Abstract: A flexible circuit board with improved bending reliability and a manufacturing method thereof are disclosed, the flexible circuit board comprising: a first dielectric formed to be elongated in a horizontal direction; a second dielectric positioned above the first dielectric; a third dielectric spaced apart from the second dielectric in the horizontal direction and positioned above the first dielectric; a first cover layer positioned on the first dielectric and covering an upper portion of the first dielectric between the second dielectric and the third dielectric; a first bonding sheet positioned between the first dielectric and the second dielectric and covering an upper portion of one end of the first cover layer; and a second bonding sheet positioned between the first dielectric and the third dielectric and covering an upper portion of the other end of the first cover layer.Type: ApplicationFiled: November 7, 2019Publication date: November 18, 2021Inventors: Sang Pil KIM, Byung Yeol KIM, Ik Soo KIM, Hee Seok JUNG
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Publication number: 20210242554Abstract: The present invention relates to a transmission line having improved bending durability, which includes a strip structure or a micro-strip structure that is divided into a base part and a bending part that is bent and unfolded based on the base part, wherein the base part and the bending part include a signal line configured to extend in a length direction so as to transmit a high frequency signal, a first dielectric of which an upper surface or a lower surface is provided with the signal line formed thereon, and a second dielectric formed above the first dielectric; and the second dielectric is coupled to the first dielectric in the base part and separated from the first dielectric in the bending part.Type: ApplicationFiled: July 18, 2019Publication date: August 5, 2021Inventors: Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Byung Yeol KIM, Hee seok JUNG
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Patent number: 10750612Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.Type: GrantFiled: April 5, 2019Date of Patent: August 18, 2020Assignee: GIGALANE CO., LTD.Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
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Patent number: 10681803Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.Type: GrantFiled: December 19, 2018Date of Patent: June 9, 2020Assignee: GIGALANE CO., LTD.Inventors: Byung Hoon Jo, Sang Pil Kim, Byung Yeol Kim, Hee seok Jung
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Patent number: 10624209Abstract: A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.Type: GrantFiled: February 6, 2017Date of Patent: April 14, 2020Assignee: GIGALANE CO., LTD.Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
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Publication number: 20200092226Abstract: Provided is a system-on-chip. A central controller is configured to, in response to a request from a host, generate a first signal for requesting error information related to an error from a design of an IP. A local controller is configured to generate a second signal including the error information of the target IP if the request from the host is determined to be for the target IP based on the first signal.Type: ApplicationFiled: August 30, 2019Publication date: March 19, 2020Applicant: Electronics and Telecommunications Research InstituteInventors: Kyuseung HAN, Sukho LEE, Jae-Jin LEE, Sang Pil KIM, Young Hwan BAE, Kyung Jin BYUN
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Patent number: 10561015Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.Type: GrantFiled: April 5, 2019Date of Patent: February 11, 2020Assignee: GigaLane Co., Ltd.Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
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Patent number: 10512158Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.Type: GrantFiled: December 19, 2018Date of Patent: December 17, 2019Assignee: GigaLane Co., Ltd.Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
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Patent number: D886073Type: GrantFiled: July 6, 2018Date of Patent: June 2, 2020Assignee: GIGALANE CO., LTD.Inventors: Sang Pil Kim, Ik Soo Kim, Byung Yeol Kim, Byung Hoon Jo, Hee seok Jung