Patents by Inventor Sanjeev Gupta

Sanjeev Gupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240095678
    Abstract: A system, method and computer readable medium for generating and maintaining a resource deployment map for a project over a communications network includes a database for storing the resource deployment map including a set of tasks, dependencies between tasks, a predefined period of time required for completing each task, a set of resources, and assignments of the set of resources to the tasks, a web server for receiving project change information including a modified set of resources, and time delays in the tasks, identifying integration points in the resource deployment map, wherein an integration point comprises tasks, assigning the modified set of resources to the tasks as follows: assign all resources necessary for a first integration point, assign all remaining resources necessary for a next integration point, repeat the previous step until all resources are assigned, and generating a revised resource deployment map based on the modified set of resources, and time delays.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 21, 2024
    Inventors: Sanjeev Gupta, Ravi Shankar
  • Publication number: 20230318247
    Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Inventors: Eleanor Patricia Paras RABADAM, Guiyun BAI, Sanjeev GUPTA, Ronald SPREITZER, Jonathan DOYLEND, Ankur AGRAWAL, Boping XIE, Sushrutha Reddy GUJJULA, Jason GARCIA, Kenneth BROWN, Dan WANG, Daniel GRODENSKY, Israel PETRONIUS, Konstantin MATYUCH
  • Patent number: 11763223
    Abstract: A system, method and computer readable medium for generating and maintaining a resource deployment map for a project over a communications network includes a database for storing the resource deployment map including a set of tasks, dependencies between tasks, a predefined period of time required for completing each task, a set of resources, and assignments of the set of resources to the tasks, a web server for receiving project change information including a modified set of resources, and time delays in the tasks, identifying integration points in the resource deployment map, wherein an integration point comprises tasks, assigning the modified set of resources to the tasks as follows: assign all resources necessary for a first integration point, assign all remaining resources necessary for a next integration point, repeat the previous step until all resources are assigned, and generating a revised resource deployment map based on the modified set of resources, and time delays.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: September 19, 2023
    Assignee: REALIZATION TECHNOLOGIES, INC
    Inventors: Sanjeev Gupta, Ravi Shankar
  • Publication number: 20230197699
    Abstract: Various embodiments disclosed relate to semiconductor packaging for photonic modules in LiDAR systems. The present disclosure includes semiconductor assemblies using an organic substrate interposer surface mounted to the printed circuit board, with an electronic integrated circuit die attached to the organic substrate and a photonic integrated circuit die attached to the organic substrate, wherein the electronic integrated circuit die, and the photonic integrated circuit die are electrically coupled to each other through the organic substrate interposer.
    Type: Application
    Filed: December 17, 2021
    Publication date: June 22, 2023
    Inventors: Ronald L. Spreitzer, Ankur Agrawal, Guiyun Bai, Eleanor Patricia Paras Rabadam, Sanjeev Gupta
  • Patent number: 11671451
    Abstract: A secure communication channel is established between network devices separated by an unsecured physical space by dynamically performing server/client resolution based on comparison of unique identifiers of the devices. After a link between a first network device and a second network device is established, the devices exchange start frames in accordance with a network security protocol such as the Media Access Control Security (MACsec) protocol. Comparison logic at the first network device compares a value of a unique identifier of the first network device to a value of a unique identifier of the second network device obtained from the start frame transmitted by the second network device, and vice versa. Based on the comparison, one of the devices assumes a server/authenticator role, and the other device assumes a client/supplicant role. The devices operate in their determined roles to perform an authentication process and thereby establish a secure communication channel.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: June 6, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Sanjeev Gupta, Frederick David Sinn, Venkata Satish Kumar Vangala, John Mark Glotzer
  • Publication number: 20220404474
    Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.
    Type: Application
    Filed: December 21, 2021
    Publication date: December 22, 2022
    Inventors: Eleanor Patricia Paras Rabadam, Guiyun Bai, Israel Petronius, Sushrutha Gujjula, Ronald L. Spreitzer, Kenneth Brown, Konstantin Matyuch, Boping Xie, Stephen Keele, Qifeng Wu, Ankur Agrawal, Jonathan Doylend, Sanjeev Gupta, Sam Khalili, Daniel Grodensky, Nan Kong Ng, Ron Friedman, Gal Dvoretzki
  • Publication number: 20220400548
    Abstract: Various embodiments disclosed relate to LiDAR systems. The present disclosure includes a method and assemblies for connection photonics modules to LiDAR systems. In an example, a connection assembly can include a system board, a flex printed circuit board (PCB) connected to the system board through an interface, a photonics integrated circuit die mounted on a first side of the flex PCB and an electronic integrated circuit die mounted on a second side of the flex PCB, opposite the first side.
    Type: Application
    Filed: December 17, 2021
    Publication date: December 15, 2022
    Inventors: Sanjeev Gupta, Jin Hong
  • Publication number: 20220390562
    Abstract: Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.
    Type: Application
    Filed: December 21, 2021
    Publication date: December 8, 2022
    Inventors: Guiyun Bai, Sushrutha Gujjula, Ronald L. Spreitzer, Naresh Satyan, David Mathine, Sam Khalili, Sanjeev Gupta, Eleanor Patricia Paras Rabadam, Ankur Agrawal, Kenneth Brown, Jonathan Doylend, Daniel Grodensky, Israel Petronius
  • Publication number: 20220234803
    Abstract: Embodiments of the disclosure relate to a blister package having a laminate structure that is heat-sealable to a lacquer layer on strain-hardened aluminum foil. The blister package includes a lid layer comprising a strain-hardened aluminum foil, a lacquer layer on a sealing surface of the strain-hardened aluminum foil and a laminate structure sealed directly to the lacquer layer. The laminate structure includes a multilayer film and a plurality of wells formed therethrough. The multilayer film includes a first formable layer of a thermoplastic material and a sealing layer of a copolyester material. The sealing layer overlies the first formable layer and has an outer surface opposite the first formable layer. The sealing layer has crystallinity from 5% to 20% as measured by differential scanning calorimetry (DSC). The outer surface of the sealing layer is sealed directly against the lacquer layer.
    Type: Application
    Filed: May 26, 2020
    Publication date: July 28, 2022
    Applicant: Flex Films (USA), Inc.
    Inventors: Ashok Chaturvedi, Steven Sargeant, Sudhir Naik, Sanjeev Gupta, Dipak Boral, Pramod Sirsamkar
  • Publication number: 20220221743
    Abstract: Techniques for termination for microring modulators are disclosed. In the illustrative embodiment, a microring modulator on a photonic integrated circuit (PIC) die is modulated by radiofrequency (RF) signals connected to electrodes across the microring modulator. A resistor is connected to each of the electrodes. The resistors both provide termination for the RF signals, preventing or reducing reflections, as well as forming part of a bias tee, allowing for a DC bias voltage to be applied across the electrodes.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 14, 2022
    Applicant: Intel Corporation
    Inventors: Sanjeev Gupta, Olufemi I. Dosunmu, Nikolai Fediakine, Jin Hong, David Chak Wang Hui, Christian Malouin, Meer Nazmus Sakib, Jianying Zhou
  • Publication number: 20220221566
    Abstract: Filter circuitry is provided for use with a light detection and ranging (Lidar) device implemented using silicon photonics. The filter circuitry includes high-pass filter circuitry to receive a signal from a photodetector of the lidar device and attenuate a lower frequency portion of the signal, where the lower frequency portion of the signal is the result of optical back reflections within the lidar device.
    Type: Application
    Filed: March 29, 2022
    Publication date: July 14, 2022
    Applicant: Intel Corporation
    Inventors: Jin Hong, Jianying Zhou, Sanjeev Gupta, Syed S. Islam, Christian Malouin
  • Publication number: 20220182149
    Abstract: Embodiments herein relate to techniques for baseline wander (BLW) compensation. The technique may include identifying a data stream that is to be modulated by a ring modulator of an optical transmitter, wherein the data stream has a frequency operable to cause thermal-based BLW of an optical output of the optical transmitter. The technique may further include adjusting a time-varying direct current (DC) voltage bias of the ring modulator based on the frequency of the data stream. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: February 21, 2022
    Publication date: June 9, 2022
    Inventors: Taehwan KIM, Hao LI, Meer Nazmus SAKIB, Haisheng RONG, Ganesh BALAMURUGAN, Sanjeev GUPTA, Jin HONG, Nikolai FEDIAKINE
  • Patent number: 11265301
    Abstract: Technology is described for using a first key to secure communications over a network link between a server and a client. A second key may be identified. A first message may indicate the server may receive data from the client using the second key but not to transmit data to the client using the second key, and that the first key is valid for sending and receiving data between the server and the client. A second message may indicate that the client may send and receive data with the server using the second key, and that the client may receive data from the server using the first key but not transmit data to the server using the first key. A third message may indicate that the server may send and receive data with the client using the second key, and that the first key is invalid for sending and receiving data between the server and the client.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: March 1, 2022
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Sanjeev Gupta, Frederick David Sinn
  • Patent number: 10992638
    Abstract: Technologies directed to network address translation based on logical channels in a shared private network with a single ingress to an ISP and multiple customer devices are described. One method receives a first public IP address assigned to an endpoint device by an ISP. The method creates a sub-interface on a WAN interface and adds a first rule that translates the first public IP address to a first private IP address assigned to the customer STA and a second rule that translates the first private IP address to the second public IP address. The first customer STA creates a second sub-interface between the customer STA and the endpoint device, adds a third rule that translates the first private IP address to a second private IP address assigned to the first endpoint device, and adds a fourth rule that translates the second private IP address to the first private IP address.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: April 27, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Burak Varan, Sanjeev Gupta, Ravi Manghirmalani
  • Publication number: 20200371385
    Abstract: Embodiments of the present disclosure are directed to a photonic integrated circuit (PIC) that includes a micro-ring modulator (MRM) that is coupled with termination circuitry to reduce the reflection coefficient of the MRM when the PIC is electrically coupled to a driver. In embodiments, the termination circuitry may include one or more passive elements. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: August 12, 2020
    Publication date: November 26, 2020
    Inventors: Siamak Amiralizadeh Asl, David Hui, Sanjeev Gupta
  • Publication number: 20190390163
    Abstract: Methods are provided for producing differentiated cells from stem cells, including producing hepatocytes. Compositions thereof are also provided, as are methods of treating a liver disorder.
    Type: Application
    Filed: March 21, 2019
    Publication date: December 26, 2019
    Inventors: Sanjeev Gupta, Sriram Bandi
  • Patent number: 10299086
    Abstract: Receiving short message service (SMS) messages and providing a response report based at least in part on the received SMS message is disclosed. A user equipment (UE) may receive an SMS message via a communications link between the UE and mobile a mobile communications network. The UE may be configured to determine if the SMS message was received with or without error. Based at least in part on this determination, the UE may generate the response report to provide to the mobile communications network. The UE may further identify that the communications link between itself and the mobile communications network may be severed. As a result, the UE may reestablish the communications link with the mobile communications network and then transmit the response report.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: May 21, 2019
    Assignee: Amazon Technologies, Inc.
    Inventors: Sanjeev Gupta, Nupur Rastogi
  • Patent number: 10287552
    Abstract: Methods are provided for producing differentiated cells from stem cells, including producing hepatocytes. Compositions thereof are also provided, as are methods of treating a liver disorder.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: May 14, 2019
    Assignee: Albert Einstein College of Medicine
    Inventors: Sanjeev Gupta, Sriram Bandi
  • Patent number: 10200187
    Abstract: In an optical communications system, the thermal pathway for dissipating heat generated by clock and data recovery (CDR) circuitry of an optical communications module is a separate from the thermal pathway that is used to dissipate heat generated by other components of the module. The CDR circuitry is external to the module and is provided with its own heat dissipation device. Keeping the CDR circuitry external to the module and providing it with its own heat dissipation device decouples the thermal pathway for dissipating heat generated by the CDR circuitry from the thermal pathways used for dissipating heat generated by other components of the module. This results in more effective heat dissipation and better component performance.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: February 5, 2019
    Assignee: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
    Inventors: Hui Xu, Sanjeev Gupta, Bob Ritter
  • Publication number: 20180208892
    Abstract: Methods are provided for producing differentiated cells from stem cells, including producing hepatocytes. Compositions thereof are also provided, as are methods of treating a liver disorder.
    Type: Application
    Filed: February 21, 2018
    Publication date: July 26, 2018
    Applicant: ALBERT EINSTEIN COLLEGE OF MEDICINE, INC.
    Inventors: Sanjeev Gupta, Sriram Bandi