Abstract: Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.

Abstract: Embodiments herein relate to techniques for baseline wander (BLW) compensation. The technique may include identifying a data stream that is to be modulated by a ring modulator of an optical transmitter, wherein the data stream has a frequency operable to cause thermal-based BLW of an optical output of the optical transmitter. The technique may further include adjusting a time-varying direct current (DC) voltage bias of the ring modulator based on the frequency of the data stream. Other embodiments may be described and/or claimed.

Abstract: Various embodiments disclosed relate to semiconductor packaging for photonic modules in LiDAR systems. The present disclosure includes semiconductor assemblies using an organic substrate interposer surface mounted to the printed circuit board, with an electronic integrated circuit die attached to the organic substrate and a photonic integrated circuit die attached to the organic substrate, wherein the electronic integrated circuit die, and the photonic integrated circuit die are electrically coupled to each other through the organic substrate interposer.

Abstract: Embodiments herein relate to techniques for baseline wander (BLW) compensation. The technique may include identifying a data stream that is to be modulated by a ring modulator of an optical transmitter, wherein the data stream has a frequency operable to cause thermal-based BLW of an optical output of the optical transmitter. The technique may further include adjusting a time-varying direct current (DC) voltage bias of the ring modulator based on the frequency of the data stream. Other embodiments may be described and/or claimed.

Abstract: Various embodiments disclosed relate to LiDAR systems. The present disclosure includes a method and assemblies for connection photonics modules to LiDAR systems. In an example, a connection assembly can include a system board, a flex printed circuit board (PCB) connected to the system board through an interface, a photonics integrated circuit die mounted on a first side of the flex PCB and an electronic integrated circuit die mounted on a second side of the flex PCB, opposite the first side.

Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

Abstract: A system (1) for in-vitro determination of a parameter of a whole blood sample, comprising a cartridge (2) comprising an analysis chamber (45) for receipt of a whole blood sample and an impedance microsensor (8) comprising an arrangement of electrodes integrated into the analysis chamber, and a reader device (3) configured for detachable coupling with the cartridge. The reader device comprising a radio frequency (RF) transmitter (20) configured to electrically couple with the impedance microsensor when the reader device is coupled to the cartridge, generate an input RF signal, and transmit the input RF signal to an RF input of the impedance microsensor and a radio frequency (RF) receiver (21) configured to electrically couple with the impedance microsensor when the reader device is coupled to the cartridge to receive an output RF signal from an RF output of the impedance microsensor.

Abstract: Technologies directed to performing switchover across Internet service providers in a last-mile network are described. One method includes receiving, by a first wireless device, a destination address, a first network address of a first network addressing scheme, and a first message. The method further includes determining a first status of at least one of a first NSP or a second NSP. The first NSP uses a second network addressing scheme and the second NSP uses a third network addressing scheme. The method further includes determining a second network address of the third network addressing scheme. The method further includes sending, using the second NSP the second network address and the first message. The method further includes determining a third network address of a fourth network addressing scheme and sending to a fourth wireless device corresponding to the destination address the third network address and the first message.

Abstract: Embodiments of the disclosure relate to a blister package having a laminate structure that is heat-sealable to a lacquer layer on strain-hardened aluminum foil. The blister package includes a lid layer comprising a strain-hardened aluminum foil, a lacquer layer on a sealing surface of the strain-hardened aluminum foil and a laminate structure sealed directly to the lacquer layer. The laminate structure includes a multilayer film and a plurality of wells formed therethrough. The multilayer film includes a first formable layer of a thermoplastic material and a sealing layer of a copolyester material. The sealing layer overlies the first formable layer and has an outer surface opposite the first formable layer. The sealing layer has crystallinity from 5% to 20% as measured by differential scanning calorimetry (DSC). The outer surface of the sealing layer is sealed directly against the lacquer layer.

Abstract: Methods are provided for producing differentiated cells from stem cells, including producing hepatocytes. Compositions thereof are also provided, as are methods of treating a liver disorder.

Abstract: A system, method and computer readable medium for generating and maintaining a resource deployment map for a project over a communications network includes a database for storing the resource deployment map including a set of tasks, dependencies between tasks, a predefined period of time required for completing each task, a set of resources, and assignments of the set of resources to the tasks, a web server for receiving project change information including a modified set of resources, and time delays in the tasks, identifying integration points in the resource deployment map, wherein an integration point comprises tasks, assigning the modified set of resources to the tasks as follows: assign all resources necessary for a first integration point, assign all remaining resources necessary for a next integration point, repeat the previous step until all resources are assigned, and generating a revised resource deployment map based on the modified set of resources, and time delays.

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.

Abstract: A system, method and computer readable medium for generating and maintaining a resource deployment map for a project over a communications network includes a database for storing the resource deployment map including a set of tasks, dependencies between tasks, a predefined period of time required for completing each task, a set of resources, and assignments of the set of resources to the tasks, a web server for receiving project change information including a modified set of resources, and time delays in the tasks, identifying integration points in the resource deployment map, wherein an integration point comprises tasks, assigning the modified set of resources to the tasks as follows: assign all resources necessary for a first integration point, assign all remaining resources necessary for a next integration point, repeat the previous step until all resources are assigned, and generating a revised resource deployment map based on the modified set of resources, and time delays.

Abstract: Various embodiments disclosed relate to semiconductor packaging for photonic modules in LiDAR systems. The present disclosure includes semiconductor assemblies using an organic substrate interposer surface mounted to the printed circuit board, with an electronic integrated circuit die attached to the organic substrate and a photonic integrated circuit die attached to the organic substrate, wherein the electronic integrated circuit die, and the photonic integrated circuit die are electrically coupled to each other through the organic substrate interposer.

Abstract: A secure communication channel is established between network devices separated by an unsecured physical space by dynamically performing server/client resolution based on comparison of unique identifiers of the devices. After a link between a first network device and a second network device is established, the devices exchange start frames in accordance with a network security protocol such as the Media Access Control Security (MACsec) protocol. Comparison logic at the first network device compares a value of a unique identifier of the first network device to a value of a unique identifier of the second network device obtained from the start frame transmitted by the second network device, and vice versa. Based on the comparison, one of the devices assumes a server/authenticator role, and the other device assumes a client/supplicant role. The devices operate in their determined roles to perform an authentication process and thereby establish a secure communication channel.

Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

Abstract: Various embodiments disclosed relate to LiDAR systems. The present disclosure includes a method and assemblies for connection photonics modules to LiDAR systems. In an example, a connection assembly can include a system board, a flex printed circuit board (PCB) connected to the system board through an interface, a photonics integrated circuit die mounted on a first side of the flex PCB and an electronic integrated circuit die mounted on a second side of the flex PCB, opposite the first side.

Abstract: Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.

Abstract: Embodiments of the disclosure relate to a blister package having a laminate structure that is heat-sealable to a lacquer layer on strain-hardened aluminum foil. The blister package includes a lid layer comprising a strain-hardened aluminum foil, a lacquer layer on a sealing surface of the strain-hardened aluminum foil and a laminate structure sealed directly to the lacquer layer. The laminate structure includes a multilayer film and a plurality of wells formed therethrough. The multilayer film includes a first formable layer of a thermoplastic material and a sealing layer of a copolyester material. The sealing layer overlies the first formable layer and has an outer surface opposite the first formable layer. The sealing layer has crystallinity from 5% to 20% as measured by differential scanning calorimetry (DSC). The outer surface of the sealing layer is sealed directly against the lacquer layer.

Abstract: Filter circuitry is provided for use with a light detection and ranging (Lidar) device implemented using silicon photonics. The filter circuitry includes high-pass filter circuitry to receive a signal from a photodetector of the lidar device and attenuate a lower frequency portion of the signal, where the lower frequency portion of the signal is the result of optical back reflections within the lidar device.