Abstract: In inputting control information for setting access conditions in a system having a common data bus (3), when a predetermined bit string making up an access condition setting command is inputted to predetermined terminals which are not data input/output terminals (S3), the predetermined terminals are set as control information input terminals (S5) and inputted control information is temporarily maintained in a non-volatile memory device (S13). When inputting of control information is completed (S15), the control information that has been temporarily maintained is stored in a non-volatile memory region all at once (S17). During an access condition setting operation, the data input/output terminals are released (S7) and the data bus (3) is made available to other banks or devices (2) so that data transfer efficiency of the system can be improved.

Abstract: An address identifying memory block is match-compared with address information stored in a to-be-remedied block memory section in a block redundancy judge section. A redundant block select signal is outputted from the block redundancy judge section by judgment of address match. A memory block column select section selects a memory block column having a redundant memory block irrespective of an address signal as the redundant block select signal is activated if block redundancy is activated to output a memory block column select signal. A column redundancy memory section selects address information of column redundancy relating a redundant memory block arranged in a memory block column in accordance with the memory block column select signal.

Abstract: In inputting control information for setting access conditions in a system having a common data bus (3), when a predetermined bit string making up an access condition setting command is inputted to predetermined terminals which are not data input/output terminals (S3), the predetermined terminals are set as control information input terminals (S5) and inputted control information is temporarily maintained in a non-volatile memory device (S13). When inputting of control information is completed (S15), the control information that has been temporarily maintained is stored in a non-volatile memory region all at once (S17). During an access condition setting operation, the data input/output terminals are released (S7) and the data bus (3) is made available to other banks or devices (2) so that data transfer efficiency of the system can be improved.

Abstract: An address identifying memory block is match-compared with address information stored in a to-be-remedied block memory section in a block redundancy judge section. A redundant block select signal is outputted from the block redundancy judge section by judgment of address match. A memory block column select section selects a memory block column having a redundant memory block irrespective of an address signal as the redundant block select signal is activated if block redundancy is activated to output a memory block column select signal. A column redundancy memory section selects address information of column redundancy relating a redundant memory block arranged in a memory block column in accordance with the memory block column select signal.

Abstract: The invention relates to an adhesive resin composition comprising an ethylene polymer having a melting point of 70 to 132.degree. C., a density of 0.88 to 0.94% g/cm.sup.3 and a melt flow rate (MFR) of 0.05 to 50 g/10 min. and/or a modified product thereof with an unsaturated carboxylic acid or its derivative (component A); a tackifier (component B); and a block copolymer containing at least one polymer block mainly composed of a vinyl aromatic hydrocarbon and at least one polymer block mainly composed of a conjugated diene or a hydrogenated product thereof (component C). This composition is useful as an adhesives showing excellent adhesion over a wide temperature range as well as processability by film molding, sheet molding, blow molding, etc. It is available for laminates comprising various kinds of resins such as polyolefins, styrenic resins, polyesters, acrylic resins and polyamides.