Patents by Inventor Satoru Tanaka

Satoru Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230022814
    Abstract: A substrate processing method of drying a substrate by using a processing fluid in a supercritical state is performed by a substrate processing apparatus. The substrate processing apparatus includes a fluid discharge unit, a supply line, a fluid drain unit, a drain line and a flow control device. The substrate processing method includes: flowing the processing fluid from the fluid discharge unit to the fluid drain unit such that the processing fluid flows along a surface of the substrate. The flowing of the processing fluid includes flowing the processing fluid in a first flow mode and flowing the processing fluid in a second flow mode. Between the first flow mode and the second flow mode, a flow direction distribution of the processing fluid is different, and a switchover between the first flow mode and the second flow mode is performed by the flow control device.
    Type: Application
    Filed: July 22, 2022
    Publication date: January 26, 2023
    Inventors: Saya Inoue, Satoru Tanaka, Shinichiro Shimomura, Toru Ihara, Satoshi Biwa
  • Publication number: 20230001629
    Abstract: An attached body production method having a sealing material disposing step for disposing a sealing material on a mold and/or a molded product so that a molded surface of the molded product is surrounded by the sealing material when the mold and the molded product are attached together; a pressure reduction step for reducing the pressure of the atmosphere around the mold and the molded product in a state where the mold and the molded product are separated from each other; a sealing step for putting the mold and the molded product on top of each other, and sealing a space between the mold 1 and the molded product with the sealing material; and a first pressure-application step for applying pressure with a fluid in a state where the space between the mold and the molded product is sealed, wherein the sealing material has fluidity in at least the sealing step, and is configured to attach to only one of the mold and the molded product when the molded product is released from the mold.
    Type: Application
    Filed: June 2, 2020
    Publication date: January 5, 2023
    Inventors: Yutaka Taniguchi, Satoru Tanaka
  • Patent number: 11538667
    Abstract: A stage includes a stage body having a placement surface and a radio-frequency electrode embedded in the stage body. The stage body is made of ceramics, and the radio-frequency electrode extends in a thickness direction of the stage body in a region below an outer periphery of the placement surface.
    Type: Grant
    Filed: February 15, 2021
    Date of Patent: December 27, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Taro Ikeda, Satoru Kawakami, Sumi Tanaka
  • Patent number: 11526103
    Abstract: An image forming apparatus includes a first image forming portion, a second image forming portion, a belt, a charging voltage applying portion, and a transfer voltage applying portion. With respect to a movement direction of a recording material, the first image forming portion is provided upstream of the second image forming portion. In an image forming operation, a potential difference between a first transfer voltage and a potential at a first transfer portion, which is formed on a first image bearing member and does not form the image, is greater than a potential difference between a second transfer voltage and a potential at a second transfer portion, which is formed on a second image bearing member and does not form an image.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: December 13, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroki Tanaka, Satoru Motohashi, Nobuo Oshima, Akihisa Matsukawa, Katsuichi Abe, Takayuki Namiki
  • Patent number: 11512155
    Abstract: A method for producing a fluoropolymer of the invention which includes polymerizing a fluoromonomer in an aqueous medium in the presence of a surfactant to provide a fluoropolymer. The surfactant includes at least one selected from the group consisting of a surfactant represented by R1a—CO—R2a—CO—R3a-Aa and a surfactant represented by R1b—CO—(CR2b2)n—(OR3b)p—(CR4b2)q-L-Ab.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: November 29, 2022
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Taketo Kato, Satoru Yoneda, Manabu Fujisawa, Kazuya Asano, Takahiro Kitahara, Masahiro Higashi, Akiyoshi Yamauchi, Sumi Ishihara, Yosuke Kishikawa, Shinnosuke Nitta, Marina Nakano, Hirotoshi Yoshida, Yoshinori Nanba, Kengo Ito, Chiaki Okui, Hirokazu Aoyama, Masamichi Sukegawa, Taku Yamanaka, Yuuji Tanaka, Kenji Ichikawa, Yohei Fujimoto, Hiroyuki Sato
  • Patent number: 11489091
    Abstract: A semiconductor light emitting device includes a light extraction layer having a light extraction surface. The light extraction layer includes: a plurality of cone-shaped parts formed in an array on the light extraction surface, and a plurality of granular parts formed both on a side part of the cone-shaped part and in a space between adjacent cone-shaped parts. A method of manufacturing the semiconductor light emitting device includes: forming a mask having an array pattern on the light extraction layer; and etching the mask and the light extraction layer from above the mask. The etching includes first dry-etching performed until an entirety of the mask is removed and second dry-etching performed to further dry-etch the light extraction layer after the mask is removed.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: November 1, 2022
    Assignees: NIKKISO CO., LTD., SCIVAX CORPORATION
    Inventors: Noritaka Niwa, Tetsuhiko Inazu, Yasumasa Suzaki, Akifumi Nawata, Satoru Tanaka
  • Publication number: 20220332865
    Abstract: An object of the present disclosure is to provide, for example, a fluoropolymer electret material with hardness. The present disclosure relates to an electret material comprising a fluoropolymer, wherein the fluoropolymer comprises, as a main component, a monomer unit represented by formula (1): wherein R1 to R4 are each independently a fluorine atom, a fluoroalkyl group, or a fluoroalkoxy group; and the fluoropolymer has a mass average molecular weight of 1 million or more and 5 million or less, or 5000 or more and less than 20000.
    Type: Application
    Filed: July 6, 2022
    Publication date: October 20, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yoshito TANAKA, Makoto MATSUURA, Yuuki SUZUKI, Akitoshi OGATA, Satoru YONEDA
  • Publication number: 20220317568
    Abstract: The present disclosure provides an imprinting device and an imprinting method. The present disclosure also provides a stamp comprising a resin-made molding component.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 6, 2022
    Applicants: SCIVAX CORPORATION, SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yukiko Kondo, Satoru Tanaka
  • Publication number: 20220319724
    Abstract: Ensuring a high output temperature while preventing leakage of radioactive substances, etc. A nuclear reactor includes a fuel unit; a shield unit that covers a circumference of the fuel unit for shielding from radioactive rays; and a heat conductive portion that penetrates the shield unit, is arranged such that the heat conductive portion extends to inside of the fuel unit and outside of the shield unit, and transfers heat of the fuel unit to the outside of the shield unit by solid heat conduction.
    Type: Application
    Filed: November 6, 2020
    Publication date: October 6, 2022
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Hideyuki Kudo, Hironori Noguchi, Koichi Tanimoto, Yuichi Otani, Yutaka Tanaka, Takafumi Noda, Kazuhiro Yoshida, Hideyuki Sakata, Tatsuo Ishiguro, Hideaki Ikeda, Satoru Kamohara, Shohei Otsuki, Nozomu Murakami, Wataru Nakazato, Takashi Hasegawa, Tadakatsu Yodo, Yasutaka Harai, Shota Kobayashi
  • Patent number: 11459228
    Abstract: A physical quantity sensor includes a substrate, a movable body that is provided displaceably in a state of being opposed to the substrate and is provided with a first through-hole and a second through-hole as through-holes, and a protrusion configured integrally with the substrate at a side of the movable body of the substrate, and in which the protrusion is provided at a position where the protrusion overlaps the through-hole and the movable body in plan view.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: October 4, 2022
    Assignee: Seiko Epson Corporation
    Inventor: Satoru Tanaka
  • Patent number: 11460483
    Abstract: An inertial sensor includes a substrate, a movable element that swings around a swing axis; and a protrusion that overlaps with the movable element in the plan view and protrudes from the substrate toward the movable element. The protrusion includes a first protrusion and a second protrusion so located as to be farther from the swing axis than the first protrusion, and when the movable element swings relative to the substrate around the swing axis, the first protrusion and the second protrusion come into contact with the movable element at the same time or the first protrusion comes into contact with the movable element and then the second protrusion comes into contact with the movable element.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: October 4, 2022
    Inventor: Satoru Tanaka
  • Patent number: 11454645
    Abstract: An inertial sensor includes a movable element including a first movable section and a second movable section, a first detection electrode, and a first dummy electrode. The first movable section has a first section, a second section that is farther from the swing axis than the first section, and a third section disposed between the first section and second section. The first section of the first movable section has a first opening and the third section of the first movable section has a second opening. An opening ratio of the first opening to the first section of the first movable section is smaller than an opening ratio of the second opening to the third section of the first movable section.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: September 27, 2022
    Inventor: Satoru Tanaka
  • Publication number: 20220281122
    Abstract: A linear member gripping device includes: a first gripping member that abuts a linear member; a second gripping member that abuts the linear member and has a protrusion; a first drive part and a second drive part that change relative positions of the first and second gripping members; and a limitation part that limits movement of the linear member sandwiched between the first and second gripping members at a predetermined limitation position.
    Type: Application
    Filed: August 28, 2020
    Publication date: September 8, 2022
    Applicant: OMRON Corporation
    Inventors: Satoru NISHIMAKI, Takayuki KOMAYA, Nobumasa MIKI, Kazumasa SEKI, Toshiaki MAEDA, Toshinori TANAKA
  • Publication number: 20220277968
    Abstract: A method for cleaning a substrate includes supplying, to a substrate which does not have a resist formed thereon, a film-forming processing liquid which includes a volatile component and forms a processing film, volatilizing the volatile component of the film-forming processing liquid such that the film-forming processing liquid on the substrate is solidified or cured and that the processing film is formed on the substrate, heating a peeling processing liquid which peels off the processing film from the substrate without dissolving the processing film such that a heated peeling processing liquid is prepared, and supplying, to the processing film formed on the substrate, the heated peeling processing liquid such that the heated peeling processing liquid peels off the processing film from the substrate without dissolving the processing film.
    Type: Application
    Filed: May 17, 2022
    Publication date: September 1, 2022
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Miyako KANEKO, Keiji TANOUCHI, Takehiko ORII, Itaru KANNO, Meitoku AIBARA, Satoru TANAKA
  • Patent number: 11430914
    Abstract: A semiconductor light emitting device includes a light extraction layer having a light extraction surface. Multiple cone-shaped parts formed in an array are provided on the light extraction surface of the semiconductor light emitting device. A proportion of an area occupied by the multiple cone-shaped parts per a unit area of the light extraction surface is not less than 65% and not more than 95% in a plan view of the light extraction surface, and an aspect ratio h/p defined as a proportion of a height h of the cone-shaped part relative to a distance p between apexes of adjacent cone-shaped parts is not less than 0.3 and not more than 1.0.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: August 30, 2022
    Assignee: NIKKISO CO., LTD.
    Inventors: Noritaka Niwa, Tetsuhiko Inazu, Yasumasa Suzaki, Akifumi Nawata, Satoru Tanaka
  • Patent number: 11424565
    Abstract: A connector assembly can be attached to a surface of a substrate and has high airtightness to improve reliability. The connector assembly includes: a connector including a connector body and a terminal attached to the body; and a protective member including a wall extending in a longitudinal direction or a width direction of the body and an accommodation unit in which at least a part of four sides of a periphery is defined by the wall, the protective member being attached to the surface of the substrate with the connector accommodated in the accommodation unit. The protective member includes a protective member body made of an insulating material and a protective metal fitting made of a conductive metal integrally formed with the protective member body, and the protective member is placed on the surface of the substrate while coupled to the connector with the connector accommodated in the accommodation unit.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: August 23, 2022
    Assignee: Molex, LLC
    Inventors: Toshiyuki Someya, Daiki Tanaka, Satoru Teruki, Yuki Seki
  • Patent number: 11411333
    Abstract: A connector assembly can be easily and certainly attached to a surface of a substrate while having a simple configuration, and high airtightness or watertightness is certainly maintained to improve reliability. The connector assembly includes: a connector including a connector body, a terminal attached to the connector body, and a reinforcing metal fitting attached to the connector body, the connector being attached to a surface of a substrate; and a protective member including a pair of parallel first walls extending in a longitudinal direction of the connector body, a pair of parallel second walls extending in a width direction of the connector body, the pair of second walls being connected to both ends of each of the pair of first walls, and an opening in which four sides of periphery are defined by the first wall and the second wall, the protective member being attachable to the surface of the substrate with the connector accommodated in the opening.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: August 9, 2022
    Assignee: Molex, LLC
    Inventors: Toshiyuki Someya, Daiki Tanaka, Satoru Teruki, Yuki Seki
  • Patent number: 11391753
    Abstract: An inertial sensor includes a movable element including a first movable section and a second movable section, a first detection electrode, and a first dummy electrode. The first movable section has a first section, a second section that is farther from the swing axis than the first section, and a third section disposed between the first section and second section. A separation distance between the third section and the first dummy electrode is greater than a separation distance between the first section and the first detection electrode.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: July 19, 2022
    Inventor: Satoru Tanaka
  • Patent number: 11380994
    Abstract: A coil device comprising a coil, and a ferrite core arranged in a hollow portion of the coil, and a resin covering them; the ferrite core being a Ni ferrite core having initial permeability ?i of 450 or more at a frequency of 100 kHz and a temperature of 20° C., and an average crystal grain size of 5-9 ?m, both of temperature-dependent inductance change ratios TLa and TLb and stress-dependent inductance change ratios PLa and PLb being ?0.6% to +0.6%, and both of the sum of TLa and PLa and the sum of TLb and PLb being more than ?1.0% and less than +1.0%; and an antenna comprising it.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: July 5, 2022
    Assignee: HITACHI METALS, LTD.
    Inventors: Hiroki Yamamoto, Tomoyuki Tada, Satoru Tanaka
  • Publication number: 20220206415
    Abstract: An image forming apparatus includes a first image forming portion, a second image forming portion, a belt, a charging voltage applying portion, and a transfer voltage applying portion. With respect to a movement direction of the recording material, the first image forming portion is provided upstream of the second image forming portion. In an image forming operation, a potential difference between the first transfer voltage and a potential, at the first transfer portion, which is formed on the first image bearing member and does not form the image is larger than a potential difference between the second transfer voltage and a potential, at the second transfer portion, which is formed on the second image bearing member and does not form the image.
    Type: Application
    Filed: November 15, 2021
    Publication date: June 30, 2022
    Inventors: Hiroki Tanaka, Satoru Motohashi, Nobuo Oshima, Akihisa Matsukawa, Katsuichi Abe, Takayuki Namiki