Patents by Inventor Satoshi Asai

Satoshi Asai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10815572
    Abstract: A chemically amplified positive resist composition is provided comprising (A) a polymer adapted to tarn soluble in alkaline aqueous solution under the action, of acid, (B) a photoacid generator, (C) a car boxy lie acid, and (D) a benzotriazole compound and/or an imidazole compound. When the resist composition is coated on a copper substrate as a thick film of 5-250 ?m thick and lithographically processed into a pattern, a high resolution is available and the pattern is of rectangular profile.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: October 27, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Hirano, Satoshi Asai, Katsuya Takemura
  • Patent number: 10809903
    Abstract: An information processing apparatus according to an embodiment of the present technology includes a detection unit, an acceptance unit, and an image control unit. The detection unit is capable of detecting whether or not each of a plurality of reproduction apparatuses constitutes a group related to reproduction of content, each of the plurality of reproduction apparatuses being connected to a network, each of the plurality of reproduction apparatuses being capable of reproducing the content. The acceptance unit accepts a user operation related to constitution of the group. The image control unit outputs a group state image on the basis of a detection result by the detection unit, the group state image representing a constitution state of the group, the group state image including an image of each of the plurality of reproduction apparatuses, and controls the group state image in response to the accepted user operation related to constitution of the group.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: October 20, 2020
    Assignee: SONY CORPORATION
    Inventors: Koji Fujita, Satoshi Asai, Naohiro Uriya, Kenichiro Takyu, Minako Kawata, Hisanori Nagata, Takashi Onohara, Ryo Sokabe, Naoki Yuasa, Takuma Higo
  • Patent number: 10719015
    Abstract: A laminate comprising a thermoplastic film and a positive resist film is provided, the positive resist film comprising (A) a novolak resin-naphthoquinone diazide (NQD) base resin composition, (B) a polyester, and (C) 3-30 wt % of an organic solvent. The resist film may be transferred to a stepped support without forming voids.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: July 21, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Hirano, Satoshi Asai, Kazunori Kondo
  • Publication number: 20200201182
    Abstract: A photosensitive resin composition comprising a polymer containing a silphenylene skeleton and a fluorene skeleton and having a crosslinkable site in the molecule, a phenol compound having a Mw of 300-10,000, a photoacid generator, and a benzotriazole or imidazole compound has improved film properties. Even from a thick film, a fine size pattern can be formed.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 25, 2020
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshinori Hirano, Michihiro Sugo, Satoshi Asai, Takahiro Goi
  • Patent number: 10554192
    Abstract: An acoustic wave device and an electronic component are disclosed. The acoustic wave device includes a substrate, excitation electrodes on the substrate and a cover. The cover comprises a frame member on the substrate, and a lid member. The frame member surrounds the excitation electrodes and includes an inner wall, top surface and an outer wall. The lid member is disposed on the top surface, and includes first and second surfaces opposite to each other, and a descending part on the second surface. The second surface faces the substrate. The descending part extends downward from the second surface, and covers at least a part of the inner wall or at least a part of the outer wall. The electronic component includes the acoustic wave device on a mounting substrate via an electrically conductive bonding member, and molding resin covering the device.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: February 4, 2020
    Assignee: KYOCERA CORPORATION
    Inventors: Yasutaka Ohashi, Satoshi Asai, Masaru Nagata
  • Patent number: 10546401
    Abstract: The present technology relates to an information processing device, a program, and an information processing system capable of displaying enormous data so as to be easily understood. The information processing device is provided with a data obtaining unit which obtains a predetermined number of data, and an output unit which outputs image control data which controls to display a particle stereoscopic image in which particles corresponding to the data are stereoscopically distributed with a particle size determined according to the number of data of the obtained data. The present technology is applicable to, for example, the information processing device which displays data and the like.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: January 28, 2020
    Assignee: SONY CORPORATION
    Inventors: Junji Oi, Takehisa Souraku, Hiroki Gohara, Tetsuhiro Uchida, Satoshi Asai, Emika Arai
  • Patent number: 10514601
    Abstract: A laminate comprising a thermoplastic film and a chemically amplified positive resist film thereon is provided, the resist film comprising (A) a base polymer having a hydroxyphenyl group and a protective group, the polymer turning alkali soluble as a result of the protective group being eliminated under the action of acid, (B) a photoacid generator, (C) an organic solvent, and (D) a polymer having an ester bond in its backbone. The resist film may be transferred to a stepped support without forming voids.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: December 24, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Hirano, Satoshi Asai, Kazunori Kondo
  • Patent number: 10416557
    Abstract: A method for manufacturing a semiconductor apparatus, including preparing a first substrate provided with a pad optionally having a plug and a second substrate or device provided with a plug, forming a solder ball on at least one of the pad or plug of first substrate and the plug of second substrate or device, covering at least one of a pad-forming surface of first substrate and a plug-forming surface of second substrate or device with a photosensitive insulating layer, forming an opening on the pad or plug of the substrate or device that has been covered with photosensitive insulating layer by lithography, pressure-bonding the second substrate or device's plug to the pad or plug of first substrate with the solder ball through the opening, electrically connecting pad or plug of first substrate to second substrate or device's plug by baking, and curing photosensitive insulating layer by baking.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: September 17, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kyoko Soga, Satoshi Asai
  • Patent number: 10416559
    Abstract: A film material includes a support film having a transmittance of at least 60% with respect to light of wavelength 300-450 nm, and a resin layer containing 0.001-10 wt % of a basic compound with a molecular weight of up to 10,000, and having a thickness of 1-100 ?m. A pattern is formed by attaching the resin layer in the film material to a chemically amplified negative resist layer on a wafer, exposing, baking, and developing the resist layer. The profile of openings in the pattern is improved.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: September 17, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Satoshi Asai, Kyoko Soga, Hideto Kato
  • Patent number: 10319653
    Abstract: A semiconductor apparatus includes a semiconductor device, on-semiconductor-device metal pad and metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second layer. The metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second layer, penetrates the second layer from its upper surface, and is electrically connected to the through electrode at an lower surface of the second layer, and an under-semiconductor-device metal interconnect is between the first layer and the semiconductor device, and the under-semiconductor-device metal interconnect is electrically connected to the metal interconnect at the lower surface of the second layer.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: June 11, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Michihiro Sugo, Hideto Kato
  • Patent number: 10284832
    Abstract: There is provided an image processing apparatus, an image processing method, and a program which can cause an image adapted to an object located between an operation unit and a drawing destination (30) to be drawn on the drawing destination, the image processing apparatus including: an image generating unit configured to generate a drawn image to be drawn on a drawing destination on a basis of a position of an operation unit. The image generating unit generates the drawn image on a basis of detected information of a stencil target (40) located between the operation unit and the drawing destination.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: May 7, 2019
    Assignee: SONY CORPORATION
    Inventors: Satoshi Asai, Hiroshi Nakayama, Hiromi Iizuka, Takumi Suzuki, Tomoya Narita
  • Publication number: 20190087989
    Abstract: The present technology relates to an information processing device, a program, and an information processing system capable of displaying enormous data so as to be easily understood. The information processing device is provided with a data obtaining unit which obtains a predetermined number of data, and an output unit which outputs image control data which controls to display a particle stereoscopic image in which particles corresponding to the data are stereoscopically distributed with a particle size determined according to the number of data of the obtained data. The present technology is applicable to, for example, the information processing device which displays data and the like.
    Type: Application
    Filed: May 2, 2017
    Publication date: March 21, 2019
    Applicant: SONY CORPORATION
    Inventors: Junji OI, Takehisa SOURAKU, Hiroki GOHARA, Tetsuhiro UCHIDA, Satoshi ASAI, Emika ARAI
  • Patent number: 10180548
    Abstract: An optical transmission substrate of the disclosure includes a wiring substrate and an optical transmission line. The wiring substrate includes one main surface which includes a mounting area for a photoelectric conversion element. The optical transmission line includes a first cladding portion which is disposed on the one main surface of the wiring substrate and has a layer shape, at least one core portion which is disposed on the first cladding portion and has a strip shape, and a second cladding portion which is disposed on a part of the at least one core portion. The optical transmission line includes an end portion which is positioned in the mounting area. The end portion includes a part of the at least one core portion.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: January 15, 2019
    Assignee: Kyocera Corporation
    Inventor: Satoshi Asai
  • Patent number: 10141272
    Abstract: A semiconductor apparatus including a semiconductor device, an on-semiconductor-device metal pad and a metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second insulating layer, wherein the metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second insulating layer, and the metal interconnect penetrates the second insulating layer from its upper surface and is electrically connected to the through electrode at an lower surface of the second insulating layer. This semiconductor apparatus can be easily placed on a circuit board and stacked, and can reduce its warpage even with dense metal interconnects.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: November 27, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Michihiro Sugo, Hideto Kato
  • Publication number: 20180299774
    Abstract: A laminate comprising a thermoplastic film and a positive resist film is provided, the positive resist film comprising (A) a novolak resin-naphthoquinone diazide (NQD) base resin composition, (B) a polyester, and (C) 3-30 wt % of an organic solvent. The resist film may be transferred to a stepped support without forming voids.
    Type: Application
    Filed: April 11, 2018
    Publication date: October 18, 2018
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshinori Hirano, Satoshi Asai, Kazunori Kondo
  • Publication number: 20180205918
    Abstract: There is provided an image processing apparatus, an image processing method, and a program which can cause an image adapted to an object located between an operation unit and a drawing destination (30) to be drawn on the drawing destination, the image processing apparatus including: an image generating unit configured to generate a drawn image to be drawn on a drawing destination on a basis of a position of an operation unit. The image generating unit generates the drawn image on a basis of detected information of a stencil target (40) located between the operation unit and the drawing destination.
    Type: Application
    Filed: July 14, 2016
    Publication date: July 19, 2018
    Applicant: SONY CORPORATION
    Inventors: Satoshi ASAI, Hiroshi NAKAYAMA, Hiromi IIZUKA, Takumi SUZUKI, Tomoya NARITA
  • Patent number: 10007181
    Abstract: A chemically amplified positive resist dry film to be formed on a support film contains 5-40 wt % of a component having a boiling point of 55-250° C. under atmospheric pressure. The resist dry film having flexibility and dimensional stability can be prepared through simple steps. The resist dry film can be efficiently and briefly laid on an article and processed to form a pattern.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: June 26, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Hirano, Satoshi Asai, Hideyoshi Yanagisawa
  • Publication number: 20180143535
    Abstract: A laminate comprising a thermoplastic film and a chemically amplified positive resist film thereon is provided, the resist film comprising (A) a base polymer having a hydroxyphenyl group and a protective group, the polymer turning alkali soluble as a result of the protective group being eliminated under the action of acid, (B) a photoacid generator, (C) an organic solvent, and (D) a polymer having an ester bond in its backbone. The resist film may be transferred to a stepped support without forming voids.
    Type: Application
    Filed: November 21, 2017
    Publication date: May 24, 2018
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshinori Hirano, Satoshi Asai, Kazunori Kondo
  • Patent number: 9971242
    Abstract: The present invention is a photo-curable resin composition containing (A) a silicone polymer compound having repeating units shown by the formulae (1) and (2), (B) a photosensitive acid generator capable of generating an acid by decomposition with light having a wavelength of 190 to 500 nm, (C) one or more compounds selected from an amino condensate modified with formaldehyde or formaldehyde-alcohol, a phenol compound having on average two or more methylol groups or alkoxymethylol groups per molecule, and a polyhydric phenol compound whose phenolic hydroxyl group is substituted with a glycidoxy group, and (D) one or more compounds selected from polyhydric phenols having 3 or more hydroxyl groups. As a result, there is provided a photo-curable resin composition that can facilitate thick and fine patterning when the composition is used in patterning.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: May 15, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Satoshi Asai, Kyoko Soga, Hideto Kato
  • Patent number: D838277
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: January 15, 2019
    Assignee: SONY CORPORATION
    Inventor: Satoshi Asai