Patents by Inventor Satoshi Goto

Satoshi Goto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220290990
    Abstract: A measurement method includes: a data acquisition step of acquiring position data output from a measurement device configured to move round-trip on a movement route and measure a position of an object in a periphery of the movement route, the measurement device using a plane having a depression angle or an elevation angle with respect to a plane that is orthogonal to a forward direction as a measurement target; and a point group data generation step of generating point group data for an object in the periphery of the movement path using the position data obtained during movement of the measurement device on an outbound trip and position data obtained during movement of the measurement device on a return trip.
    Type: Application
    Filed: July 10, 2019
    Publication date: September 15, 2022
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Hideyuki TSUBOI, Hideki TOSHINAGA, Kazuto GOTO, Satoshi KUROSAKI, Mizuki SUGA, Kota ITO, Naoki KITA
  • Publication number: 20220293847
    Abstract: [Object] An actuator includes an actuator body that includes a first surface and a second surface that face each other; a first constraining member that is provided on the first surface, and constrains the first surface from expanding and contracting; and a second constraining member that is provided on the second surface, and constrains the second surface from expanding and contracting. The actuator body includes a first electrode, a second electrode that faces the first electrode, and an elastomer layer that is provided between the first electrode and the second electrode. The first electrode is a pattern electrode. The first constraining member and the second constraining member are provided correspondingly to the first electrode.
    Type: Application
    Filed: August 20, 2020
    Publication date: September 15, 2022
    Inventors: AKIHIRO NAKATA, SATOSHI NAKAMARU, YOSHIO GOTO, MICHIKO NAKAO, KAZUHIKO MIYAHARA
  • Patent number: 11444555
    Abstract: An actuator includes a stack including: an elastomer layer; and an elastic electrode disposed on each surface of the elastomer layer, in which the stack is subjected to a pre-strain of 50% or more at least in one direction. The stack may have a round tubular shape with the elastic electrodes disposed on opposite surfaces of the elastomer layer in a radial direction of the stack.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: September 13, 2022
    Assignee: Sony Corporation
    Inventors: Satoshi Nakamaru, Hiroichi Ishikawa, Kentarou Sakai, Akihiro Nakata, Kazuhito Wakana, Yoshio Goto
  • Patent number: 11433425
    Abstract: An actuator includes a laminate including an elastomer layer and an electrode, in which the laminate has a spiral or concentric shape, pre-distortion is applied to at least one member out of the elastomer layer and the electrode, and area distortion of the at least one member is 10% or larger.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: September 6, 2022
    Assignee: Sony Corporation
    Inventors: Akihiro Nakata, Satoshi Nakamaru, Yoshio Goto, Hiroichi Ishikawa, Kentarou Sakai, Kazuhito Wakana
  • Publication number: 20220260719
    Abstract: A measurement device configured to move along a movement path and measure the position of an object in surroundings of the movement path includes: a measurement unit configured to measure the position of the object with a plurality of surfaces as measurement targets, the plurality of surfaces facing in directions different from each other; and a point group data generation unit configured to generate point group data of the object in surroundings of the movement path by using positional data representing the position of the object measured by the measurement unit.
    Type: Application
    Filed: July 24, 2019
    Publication date: August 18, 2022
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Hideyuki TSUBOI, Hideki TOSHINAGA, Kazuto GOTO, Satoshi KUROSAKI, Kota ITO, Mizuki SUGA, Naoki KITA
  • Patent number: 11406236
    Abstract: An electric vacuum cleaning apparatus includes a station and an electric vacuum cleaner connectable/disconnectable from the station. The electric vacuum cleaner includes: a coarse-dust collecting chamber that accumulates coarse dust separated with a first separator; a filter chamber that accumulates fine dust separated with a filter; a coarse-dust waste-outlet that discharges the coarse dust from the coarse-dust collecting chamber; a fine-dust waste-outlet adjacent to the coarse-dust waste-outlet and discharges the fine dust from the filter chamber; and a waste-outlet lid that opens/closes both the coarse-dust waste-outlet and fine-dust waste-outlet together.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: August 9, 2022
    Assignee: TOSHIBA LIFESTYLE PRODUCTS & SERVICES CORPORATION
    Inventors: Masatoshi Tanaka, Satoshi Goto, Yukio Machida
  • Patent number: 11411586
    Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: August 9, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hidetaka Takahashi, Satoshi Goto, Yoshiki Yasutomo, Daerok Oh, Yuuto Aoki, Yoshihiro Daimon, Naoya Matsumoto
  • Patent number: 11371635
    Abstract: To provide a connector that facilitates assembly while having a great axial-direction engagement force, a male joint member to be connected to a first member has a plurality of outer protrusions, and a female joint member to be connected to a second member has a plurality of inner protrusions. A circumferential-direction gap between adjacent two inner protrusions allows the outer protrusion to pass therethrough. The female joint member has, in an area opposed to inner protrusion back surfaces, a circular space that allows the plurality of outer protrusions to relatively rotate therein. The inner protrusion back surfaces of the plurality of inner protrusions are engaged in the axial direction with outer protrusion back surfaces of the plurality of outer protrusions that have passed through the circumferential-direction gaps between the plurality of inner protrusions.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: June 28, 2022
    Assignee: SUMITOMO RIKO HOSETEX, LTD.
    Inventors: Takaki Fukuyama, Satoshi Senda, Shota Maeda, Shimpei Goto, Yuji Tokuda, Katsuji Miyata
  • Publication number: 20220200548
    Abstract: A second member is joined in surface contact with a first surface of a first member including a semiconductor region made from an elemental semiconductor. The second member includes a radio-frequency amplifier circuit made from a compound semiconductor. A conductive protrusion projects from the second member toward a side opposite to the first member. The first member includes a temperature measurement element that detects a temperature.
    Type: Application
    Filed: December 9, 2021
    Publication date: June 23, 2022
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Mikiko FUKASAWA, Satoshi GOTO, Shunji YOSHIMI, Yuji TAKEMATSU, Mitsunori SAMATA
  • Publication number: 20220199557
    Abstract: In a semiconductor device, a first member having a first surface includes a plurality of circuit blocks disposed in an inner region of the first surface when the first surface is viewed in plan. The second member is joined to the first surface of the first member in surface contact with the first surface. The second member includes a plurality of first transistors that are connected in parallel to each other and form a first amplifier circuit. A conductive protrusion protrudes from the second member on an opposite side to the first member. The first transistors are disposed in a region not overlapping any of the circuit blocks in the first member in a plan view.
    Type: Application
    Filed: December 13, 2021
    Publication date: June 23, 2022
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Shunji YOSHIMI, Satoshi GOTO, Mikiko FUKASAWA
  • Publication number: 20220199484
    Abstract: In a semiconductor device, when a first surface of a first member is viewed in plan, a plurality of circuit blocks are disposed in an inner region of the first surface. The second member is joined to the first surface of the first member in surface contact with the first surface. The second member includes one or more circuit blocks. A conductive protrusion protrudes from the second member on an opposite side to the first member. One of the circuit blocks in the second member constitutes a first amplifier circuit including a plurality of first transistors that are connected in parallel to each other. At least one of the circuit blocks in the first member overlaps at least one circuit block in the second member in a plan view.
    Type: Application
    Filed: December 17, 2021
    Publication date: June 23, 2022
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Mikiko FUKASAWA, Satoshi GOTO, Shunji YOSHIMI
  • Publication number: 20220199548
    Abstract: A semiconductor device includes first and second members. In the first member, a first electronic circuit including a semiconductor element is formed. The second member is joined to an area of part of a first surface of the first member, and includes a second electronic circuit including a semiconductor element formed of a semiconductor material different from that of the semiconductor element of the first electronic circuit. An interlayer insulating film covers the second member and an area of the first surface of the first member to which the second member is not joined. An inter-member connection wire on the interlayer insulating film couples the first and second electronic circuits through an opening in the interlayer insulating film. A shield structure including a first metal pattern disposed on the interlayer insulating film shields a shielded circuit, which is part of the first electronic circuit, in terms of radio frequencies.
    Type: Application
    Filed: December 13, 2021
    Publication date: June 23, 2022
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Satoshi GOTO, Masayuki Aoike, Mikiko Fukasawa
  • Publication number: 20220199558
    Abstract: In a semiconductor device, when a first surface of a first member is viewed in plan, at least one switch circuit including a switch is disposed within the first surface. A second member is joined to the first surface of the first member in surface contact with the first surface. The second member includes a plurality of transistors that are made of a compound semiconductor and form a radio-frequency amplifier circuit. A first conductive protrusion protrudes from the second member on an opposite side to the first member. The first member includes a circuit element disposed between the radio-frequency amplifier circuit and the at least one switch circuit in a plan view, the circuit element not forming the switch circuit.
    Type: Application
    Filed: December 13, 2021
    Publication date: June 23, 2022
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Satoshi GOTO, Shunji YOSHIMI, Mikiko FUKASAWA
  • Publication number: 20220190847
    Abstract: A semiconductor device including a radio-frequency amplifier circuit and a band selection switch are mounted on or in a module substrate. An output matching circuit includes at least one passive element disposed on or in the module substrate. The output matching circuit is coupled between the radio-frequency amplifier circuit and the band selection switch. The semiconductor device includes a first member having a semiconductor portion made of an elemental semiconductor and a second member joined to the first member in surface contact with the first member. The radio-frequency amplifier circuit including a semiconductor element made of a compound semiconductor is formed at the second member. The semiconductor device is disposed in close proximity to the output matching circuit in plan view. The output matching circuit is disposed in close proximity to the band selection switch.
    Type: Application
    Filed: December 9, 2021
    Publication date: June 16, 2022
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Satoshi GOTO, Shunji YOSHIMI, Mitsunori SAMATA
  • Publication number: 20220189665
    Abstract: A chip varistor includes an element body exhibiting varistor characteristics, internal electrodes containing a first electrically conductive material, and an intermediate conductor containing a second electrically conductive material. The intermediate conductor is separated from the internal electrodes in a direction in which the internal electrodes oppose each other, and is disposed between the internal electrodes. At least a part of the intermediate conductor overlaps the internal electrodes in the direction in which the internal electrodes oppose each other. The element body includes a low resistance region in which the second electrically conductive material is diffused. The low resistance region is located between the first and second internal electrodes in the direction in which the first and second internal electrodes oppose each other.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 16, 2022
    Applicant: TDK CORPORATION
    Inventors: Satoshi GOTO, Naoyoshi YOSHIDA, Takeshi YANATA, Takeshi OYANAGI, Daiki SUZUKI, Shin KAGAYA, Masayuki UCHIDA, Yusuke IMAI
  • Publication number: 20220170555
    Abstract: In a flow path switching valve, when a valve rod is shifted toward a first back pressure chamber, a first valve chamber is separated from the first back pressure chamber by a first valve element, and a second valve chamber is separated from an intermediate chamber by a second valve element. When the valve rod is shifted toward a second back pressure chamber, the first valve chamber is separated from the intermediate chamber by the first valve element, and the second valve chamber is separated from the second back pressure chamber by the second valve element. The valve rod has a pressure equalizing path through which the first back pressure chamber and the second back pressure chamber are connected.
    Type: Application
    Filed: June 25, 2020
    Publication date: June 2, 2022
    Inventors: Daisuke KONDO, Kenichi MOCHIZUKI, Satoshi GOTO
  • Publication number: 20220165460
    Abstract: A multilayer chip varistor includes an element body, first and second external electrodes, and first and second electrical conductor groups. The first electrical conductor group includes a first internal electrode connected to the first external electrode, and a first intermediate electrical conductor opposed to the first internal electrode. The second electrical conductor group includes a second internal electrode including a first electrically conductive material and connected to the second external electrode, and a second intermediate electrical conductor opposed to the second internal electrode. At least one of the first and second intermediate electrical conductors includes the second electrically conductive material. The element body includes a low electrical resistance region between the first and second internal electrodes. The second electrically conductive material is diffused in the low electrical resistance region.
    Type: Application
    Filed: November 23, 2021
    Publication date: May 26, 2022
    Applicant: TDK CORPORATION
    Inventors: Shin KAGAYA, Masayuki UCHIDA, Naoyoshi YOSHIDA, Takeshi YANATA, Satoshi GOTO, Takeshi OYANAGI, Yusuke IMAI, Daiki SUZUKI, Kaname UEDA
  • Patent number: 11329676
    Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying element; a second amplifying element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying element, another end of the primary coil is connected to an output terminal of the second amplifying element, an end of the secondary coil is connected to an output terminal of the power amplifier, the first amplifying element and the second amplifying element are disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: May 10, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuhito Nakai, Satoshi Goto, Hidetaka Takahashi, Daerok Oh
  • Publication number: 20220123698
    Abstract: A power amplifier circuit includes a differential amplifier circuit configured to amplify a radio-frequency signal, a transformer disposed on an output side with respect to the differential amplifier circuit and including a primary winding and a secondary winding, and a dispersion circuit coupled to a midpoint of the primary winding of the transformer and configured to operate as an adjustment circuit. The dispersion circuit is configured to adjust, based on a supply voltage controlled in accordance with the envelope of the radio-frequency signal, a bias (bias current or bias voltage) to be supplied to the differential amplifier circuit.
    Type: Application
    Filed: October 18, 2021
    Publication date: April 21, 2022
    Inventors: Satoshi GOTO, Yuri HONDA, Yoshiki KOGUSHI
  • Patent number: D955443
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: June 21, 2022
    Assignee: KOBELCO CONSTRUCTION MACHINERY CO., LTD.
    Inventors: Hironori Tsukamoto, Tetsumi Fukumoto, Satoshi Goto, Takashi Tazoe