Patents by Inventor Satoshi Hayashi

Satoshi Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060108222
    Abstract: A gas sensor such as an O2 sensor or NOx sensor used in measuring an air-fuel ratio of a mixture supplied to an automotive internal combustion engine. The gas sensor is equipped with a sensor element and a cover assembly. The cover assembly is coated with a hydrophilic film having a water wettability of 70° or less, as expressed by a water contact angle, or reformed to have a surface having a water wettability of 70° or less. This minimizes exposure of the sensor element to water without sacrificing the response of the gas sensor to avoid water-caused cracks in the sensor element.
    Type: Application
    Filed: November 25, 2005
    Publication date: May 25, 2006
    Applicant: Denso Corporation
    Inventors: Kohei Yamada, Tomofumi Fujii, Katsuhiko Nakabayashi, Satoshi Hayashi, Masato Ozawa, Takashi Kojima
  • Publication number: 20060057271
    Abstract: A process for preparing butter milk and/or butter serum, which comprises decreasing the dissolved oxygen concentration of at least one selected from the group consisting of milk, a milk product, butter milk and butter serum, followed by heating, and optionally fractionizing the heated product.
    Type: Application
    Filed: December 10, 2003
    Publication date: March 16, 2006
    Inventors: Yasushi Kubota, Yukinari Takeuchi, Satoshi Hayashi, Naoki Orii, Tadashi Nakatsubo
  • Publication number: 20060016764
    Abstract: A TOC component removing apparatus of the present invention is for removing TOC components contained in ultrapure water or pure water, including a treatment tank 2 into which the ultrapure water or the pure water is introduced, a plurality of spherical catalyst particles 3 of which surfaces are photocatalyst, a tabular translucent holding body 4 which holds the catalyst particles 3 on one surface 31a, and an ultraviolet-ray light source 5 which is arranged near the translucent holding body 4 and radiates ultraviolet rays with a wavelength of 254 nm.
    Type: Application
    Filed: July 15, 2005
    Publication date: January 26, 2006
    Applicant: KOMATSU ELECTRONIC CO., LTD.
    Inventor: Satoshi Hayashi
  • Patent number: 6939741
    Abstract: It is an object of the invention to provide a method for manufacturing an IC chip wherein a wafer is prevented from being damaged and the ease of handling thereof is improved so that the wafer can be appropriately processed into IC chips, even if a thickness of the wafer is extremely reduced to approximately 50 ?m.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: September 6, 2005
    Assignees: Sekisui Chemical Co., Ltd., Disco Corporation
    Inventors: Masateru Fukuoka, Yasuhiko Oyama, Munehiro Hatai, Satoshi Hayashi, Shigeru Danjo, Masahiko Kitamura, Koichi Yajima
  • Publication number: 20050173051
    Abstract: An object of the present invention is to provide an adhesive substance capable of being easily peeled off without damaging an adherend by giving stimulation thereto, a tape employing this adhesive substance, and a method for peeling off the adhesive substance. An adhesive substance, which contains a gas-generating agent for generating gas by stimulation, gas generated from said gas-generating agent being discharged to the outside of said adhesive substance so as not to foam said adhesive substance, and gas generated from said gas-generating agent peeling at least part of an adhesive surface of said adhesive substance off an adherend so as to decrease adhesive strength.
    Type: Application
    Filed: June 3, 2002
    Publication date: August 11, 2005
    Inventors: Munehiro Hatai, Masateru Fukuoka, Satoshi Hayashi, Shigeru Danjo, Yasuhiko Oyama, Kazuhiro Shimomura, Tsuyoshi Hasegawa
  • Publication number: 20050077394
    Abstract: A supplying unit supplies energy to an actuator so that the supplied energy is kept therein, making displacement the actuator. An interrupting unit interrupts the supply of energy to cause the actuator to discharge the kept energy, making displacement the actuator. A converting unit is adapted to convert the displacement of the actuator corresponding to the kept energy into hydraulic pressure applied to the valve member, moving the valve member to open the low pressure port and close the high pressure port. The convert unit converts the displacement of the actuator corresponding to the discharged energy into hydraulic pressure applied to the valve member, moving the valve member to open the high pressure port and close the low pressure port. Energy which the actuator requires to move the valve member so as to close the high pressure port is larger than energy which the actuator requires to move the valve member so as to open the low pressure port.
    Type: Application
    Filed: August 25, 2004
    Publication date: April 14, 2005
    Inventors: Toshihiko Igashira, Satoshi Hayashi
  • Publication number: 20050054758
    Abstract: It is an object of the present invention to provide an adhesive substance capable of being easily peeled off without damaging an adherend by means of irradiation with light, an adhesive product, and a connected structure. The present invention relates to an adhesive substance containing an azo compound generating gas by means of irradiation with light, at least part of gas generated from said azo compound being discharged to the outside of said adhesive substance.
    Type: Application
    Filed: June 3, 2002
    Publication date: March 10, 2005
    Inventors: Munehiro Hatai, Masateru Fukuoka, Satoshi Hayashi, Shigeru Danjo, Yasuhiko Oyama
  • Patent number: 6840466
    Abstract: A hydraulic control valve for a fuel injector for an automotive engine, which includes a piezoelectric actuator and a hydraulic valve mechanism. The hydraulic valve mechanism converts a mechanical deformation of the piezoelectric actuator produced as a result of application of a voltage into a hydraulic pressure to move a valve member for opening and closing a fluid port. The hydraulic valve mechanism is so designed that the piezoelectric actuator produces a maximum output force which works to develop the hydraulic pressure when opening the fluid port through the valve member and decreases after the fluid port is opened and which is set smaller than one-half of a maximum possible output force of the piezoelectric actuator under application of a maximum working voltage to said piezoelectric actuator, thereby ensuring a maximum movement of the valve member at high energy efficiency under application of the voltage within a working voltage range.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: January 11, 2005
    Assignee: Denso Corporation
    Inventors: Toshihiko Igashira, Satoshi Hayashi
  • Publication number: 20040261943
    Abstract: An object of the present invention is to provide an adhesive substance capable of being easily peeled off without using light and damaging an adherend, a method for peeling off the adhesive substance, and a connected structure.
    Type: Application
    Filed: August 18, 2004
    Publication date: December 30, 2004
    Inventors: Masateru Fukuoka, Munehiro Hatai, Yasuhiko Oyama, Shigeru Danjo, Satoshi Hayashi, Kazuhiro Shimomura, Tsuyoshi Hasegawa
  • Publication number: 20040259332
    Abstract: A semiconductor wafer (W) where circuits are formed in the area formed in the area divided by streets is split into semiconductor chips having an individual circuit. By interposing an adhesive sheet whose adhesive force is lowered by stimulation between the semiconductor wafer (W) and the support plate (13), the front side of the semiconductor wafer (W) is adhered to the support plate (13), exposing the rear face (10) of the semiconductor wafer (W). The rear face (10) of the semiconductor wafer (W) with the support plate (13) is ground. After the grinding is finished, the semiconductor wafer (W) is held with the rear face (10) up is diced into semiconductor chips (C). The adhesive sheet is given stimulus to lower the adhesive force and the semiconductor chips (C) are removed from the support plate (13). The semiconductor wafer and semiconductor chips are always supported by the support plate, avoiding damaging or deforming.
    Type: Application
    Filed: March 23, 2004
    Publication date: December 23, 2004
    Inventors: Masateru Fukuoka, Munehiro Hatai, Satoshi Hayashi, Yasuhiko Oyama, Shigeru Danjo, Masahiko Kitamura, Koichi Yajima
  • Publication number: 20040248382
    Abstract: The purpose of the invention is to provide a double-sided adhesive tape which prevents a wafer from damaging even when the wafer has a considerably thin thickness of about 50 &mgr;m, which has improved handlability, which is favorably used for processing of an IC chip and which facilitates its peeling, and a method for manufacturing an IC chip using it.
    Type: Application
    Filed: June 23, 2004
    Publication date: December 9, 2004
    Inventors: Munehiro Hatai, Masateru Fukuoka, Satoshi Hayashi, Shigeru Danjo, Yasuhiko Oyama, Kazuhiro Shimomura, Tsuyoshi Hasegawa
  • Publication number: 20040233404
    Abstract: An exposure device that sequentially projects and repeatedly transfers a predetermined pattern formed on a reticule onto wafers via an optical projection system, the exposure device including movement means that positions a current shot region on a wafer in the focal position of the optical projection system, detection means that detects tilting on an exposure surface of the current shot region with respect to an image plane of the optical projection system, and a plurality of first piezoelectric elements that correct the tilting on the current shot region with respect to the optical axis, based upon the detection results of the detection means, so that the exposure surface of the current shot region will substantially match the image plane.
    Type: Application
    Filed: May 10, 2004
    Publication date: November 25, 2004
    Applicant: ROHM CO. LTD.
    Inventor: Satoshi Hayashi
  • Publication number: 20040185639
    Abstract: It is an object of the invention to provide a method for manufacturing an IC chip wherein a wafer is prevented from being damaged and the ease of handling thereof is improved so that the wafer can be appropriately processed into IC chips, even if a thickness of the wafer is extremely reduced to approximately 50 &mgr;m.
    Type: Application
    Filed: May 3, 2004
    Publication date: September 23, 2004
    Inventors: Masateru Fukuoka, Yasuhiko Oyama, Munehiro Hatai, Satoshi Hayashi, Shigeru Danjo, Masahiko Kitamura, Koichi Yajima
  • Patent number: 6729554
    Abstract: A fuel injector is provided which is designed to suppress unwanted vibrations of a nozzle needle-actuating piston, thereby avoiding the injection of an excess quantity of fuel. The fuel injector comprises an actuator and a displacement amplifying chamber filled with fluid to which a large-diameter piston and a small-diameter piston working as the nozzle needle-actuating piston are exposed. The displacement amplifying chamber works to amplify and transmit displacement of the large-diameter piston by the actuator to the small-diameter piston. The fuel injector also includes a stopper which restricts movement of the small-diameter piston toward the displacement amplifying chamber to a given range, thereby suppressing the unwanted vibrations of the small-diameter piston.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: May 4, 2004
    Assignee: Denso Corporation
    Inventors: Ryo Katsura, Kenji Funai, Toshihiko Igashira, Satoshi Hayashi
  • Patent number: 6679440
    Abstract: A valve actuating device is provided which may be employed in fuel injectors for automotive internal combustion engines. The valve actuating device includes an actuator, a large-diameter piston displaced by said actuator, a small-diameter piston operating a valve, a displacement amplifying chamber filled with working fluid to amplify and transmit displacement of the large-diameter piston to the small-diameter piston, and a drain passage. The drain passage communicates with the displacement amplifying chamber through a pinhole for draining the working fluid within the displacement amplifying chamber, thereby enabling the pressure in the displacement amplifying chamber to be released in order to ensure the movement of the small-diameter piston when the valve actuating device is started.
    Type: Grant
    Filed: October 18, 2001
    Date of Patent: January 20, 2004
    Assignee: Denso Corporation
    Inventors: Toshihiko Igashira, Masatoshi Kuroyanagi, Satoshi Hayashi
  • Patent number: 6604255
    Abstract: This soldering iron cleaning apparatus comprises a main body having an introduction hole, a motor, a sensor mechanism which detects the insertion of the soldering head to the introduction hole and drives the motor, a cleaning member which removes solder remaining on the soldering head, a power transmission mechanism which drives the cleaning member by the driving force from the motor. The power transmission mechanism rotates the cleaning member, by the driving force of the motor, in such a way that the cleaning member scrapes the external surface of the soldering head from the base side to the tip side of the soldering head while turning the cleaning member around the soldering head.
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: August 12, 2003
    Assignee: Komatsu Electronic Co., Ltd.
    Inventor: Satoshi Hayashi
  • Patent number: 6563687
    Abstract: A stacked-type piezoelectric device 1 to be built in an injector includes a metal case 41 outside its side surfaces. An insulating member 45 having an electric insulation property is interposed between the side surfaces 101, 102 of the piezoelectric device 1 and an inner surface 410 of the case 41. The insulating member 45 is bonded to either the side surfaces 101, 102 of the piezoelectric device 1 or the inner surface 410 of the case, and at least a part of the insulating member 45 is in contact with the other surface.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: May 13, 2003
    Assignee: Denso Corporation
    Inventors: Naoyuki Kawazoe, Satoshi Hayashi
  • Publication number: 20020117149
    Abstract: A supplying unit supplies energy to an actuator so that the supplied energy is kept therein, making displacement the actuator. An interrupting unit interrupts the supply of energy to cause the actuator to discharge the kept energy, making displacement the actuator. A converting unit is adapted to convert the displacement of the actuator corresponding to the kept energy into hydraulic pressure applied to the valve member, moving the valve member to open the low pressure port and close the high pressure port. The convert unit converts the displacement of the actuator corresponding to the discharged energy into hydraulic pressure applied to the valve member, moving the valve member to open the high pressure port and close the low pressure port. Energy which the actuator requires to move the valve member so as to close the high pressure port is larger than energy which the actuator requires to move the valve member so as to open the low pressure port.
    Type: Application
    Filed: December 28, 2001
    Publication date: August 29, 2002
    Inventors: Toshihiko Igashira, Satoshi Hayashi
  • Publication number: 20020117560
    Abstract: An improved structure of a hydraulic control valve is provided which may be employed in a fuel injector for an automotive engine. The hydraulic control valve includes a piezoelectric actuator and a hydraulic valve mechanism. The hydraulic valve mechanism works to convert a mechanical deformation of the piezoelectric actuator produced as a result of application of a voltage into a hydraulic pressure to move a valve member hydraulically for opening and closing a fluid port selectively.
    Type: Application
    Filed: December 27, 2001
    Publication date: August 29, 2002
    Inventors: Toshihiko Igashira, Satoshi Hayashi
  • Publication number: 20020084350
    Abstract: A stacked-type piezoelectric device 1 to be built in an injector includes a metal case 41 outside its side surfaces. An insulating member 45 having an electric insulation property is interposed between the side surfaces 101, 102 of the piezoelectric device 1 and an inner surface 410 of the case 41. The insulating member 45 is bonded to either the side surfaces 101, 102 of the piezoelectric device 1 or the inner surface 410 of the case, and at least a part of the insulating member 45 is in contact with the other surface.
    Type: Application
    Filed: December 13, 2001
    Publication date: July 4, 2002
    Inventors: Naoyuki Kawazoe, Satoshi Hayashi