Abstract: In a power conversion apparatus including first to fourth semiconductor switching elements connected in series across both terminals of a high voltage-side capacitor, the third and fourth semiconductor switching elements are connected across both terminals of a low voltage-side capacitor via a reactor, and both terminals of the second and third semiconductor switching elements are connected across a charging-discharging capacitor. This charging-discharging capacitor includes a plurality of capacitor elements connected in parallel via a first wiring and a second wiring. Inductance components or capacitance components of the plurality of capacitor elements when viewed from an outflow-inflow portion of the first wiring and an outflow-inflow portion of the second wiring are different from each other such that the charging-discharging capacitor does not have a parallel resonance point in a driving frequency band but has a parallel resonance point in a noise frequency band.

Abstract: A liquid coolant supplying header is configured on a central portion in the width direction between an upper portion heatsink and a partitioning plate, a liquid coolant discharging header is configured on a central portion in the width direction between a lower portion heatsink and the partitioning plate so as to be parallel to the liquid coolant supplying header, vertical flow channels are formed so as to pass through the partitioning plate vertically on two sides in the width direction so as to be parallel to the liquid coolant supplying header, a liquid coolant distributing structural body is disposed inside the liquid coolant supplying header, and an external shape of the liquid coolant distributing structural body is formed such that flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end.

Abstract: Provided is a method of producing “a ceramic green bonded compact in which a ceramic green film is bonded on each bonding surface of a ceramic green substrate having hole portions,” the method imparting good adhesiveness to a thin green film while suppressing the green substrate from having deformation. In this method, first, a layer of a paste for bonding is formed on each bonding surface of green sheets prepared. Next, each bonding surface of the green sheets on which the paste layer is formed is brought into contact, in a state in which the paste layer is wet, with each bonding surface of a porous ceramic green substrate prepared. While this state is maintained, pores in the green substrate absorb a dispersion medium in the paste layer in the wet state. As a result, the paste layer is dried, thereby completely bonding the green substrate and the green sheets.

Abstract: The passage from a cooling medium inlet to a cooling medium outlet of a cooler includes: an upstream cooling portion and a downstream cooling portion for cooling heat generating bodies; an upstream distribution portion located on the cooling medium inlet side; a downstream distribution portion located on the cooling medium outlet side; a connecting portion for connecting the upstream cooling portion and the downstream cooling portion; and a partition portion for partitioning the upstream cooling portion and the downstream cooling portion, and the upstream distribution portion and the downstream distribution portion. The passage is connected so that the cooling medium flows in order of the upstream distribution portion, the upstream cooling portion, the connecting portion, the downstream cooling portion, and the downstream distribution portion.

Abstract: The electrode includes an insulator having a hollow portion (first hollow portion and second hollow portion) and a conductor provided in the hollow portion of the insulator. An edge portion of one end surface of at least the conductor is covered with the insulator.

Abstract: A power converter has one set of two semiconductor switches performing switching actions, each of which is formed of an FET and a free wheel diode connected in anti-parallel to the FET, and a smoothing capacitor, and convers power by complementary switching actions of the FETs in the semiconductor switches. The power converter is provided with a current sensor that detects a direction of a current flowing through the semiconductor switches and a gate generation portion that skips ON signals of PWM gate signals of the semiconductor switches when the direction of the current flowing through the semiconductor switches is negative.

Abstract: The present invention provides a ceramic green sheet with a thin flat plate shape obtained by molding and solidifying a ceramic slurry, which contains a ceramic powder, dispersion medium, and gelling agent, into a thin flat plate. The ceramic green sheet partially includes a body that is obtained by molding and solidifying a conductor paste, which becomes a conductor later, and the body is exposed on a part of each of the both surfaces of the sheet. Plural ceramic green sheets described above are produced. The plural ceramic green sheets are successively stacked and press-bonded in the thickness direction in such a manner that the bodies included in the respective sheets are connected to each other for all combinations of the adjacent two sheets. As a result, a ceramic green sheet laminate is formed, which includes one body that is obtained by connecting the bodies included in the respective sheets.

Abstract: A liquid coolant supplying header is configured on a central portion in the width direction between an upper portion heatsink and a partitioning plate, a liquid coolant discharging header is configured on a central portion in the width direction between a lower portion heatsink and the partitioning plate so as to be parallel to the liquid coolant supplying header, vertical flow channels are formed so as to pass through the partitioning plate vertically on two sides in the width direction so as to be parallel to the liquid coolant supplying header, a liquid coolant distributing structural body is disposed inside the liquid coolant supplying header, and an external shape of the liquid coolant distributing structural body is formed such that flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end.

Abstract: The passage from a cooling medium inlet to a cooling medium outlet of a cooler includes: an upstream cooling portion and a downstream cooling portion for cooling heat generating bodies; an upstream distribution portion located on the cooling medium inlet side; a downstream distribution portion located on the cooling medium outlet side; a connecting portion for connecting the upstream cooling portion and the downstream cooling portion; and a partition portion for partitioning the upstream cooling portion and the downstream cooling portion, and the upstream distribution portion and the downstream distribution portion. The passage is connected so that the cooling medium flows in order of the upstream distribution portion, the upstream cooling portion, the connecting portion, the downstream cooling portion, and the downstream distribution portion.

Abstract: In a power converter in which semiconductor modules are arranged on both surfaces of a cooler for downsizing, an excellent connection between control boards and a low inductance connection between smoothing capacitors and the semiconductor modules are performed at the same time. The semiconductor modules are disposed on both surfaces of the cooler, and control boards that control the semiconductor modules are arranged opposite to the respective semiconductor modules. The semiconductor modules and the cooler are held between the control boards. A current detector or a terminal block is disposed at a position perpendicular to a surface on which the cooler and the semiconductor modules contact each other, opposite to the cooler. The respective control boards disposed on both surfaces of the cooler are electrically connected by using wirings provided in the current detector or the terminal block.

Abstract: A fluid observation apparatus for performing a method for observing a fluid by PIV. The method for observing a fluid includes capturing an image of inorganic particles in a fluid for flow observation by irradiating the fluid for flow observation passing through a flow channel with light, the fluid for flow observation containing inorganic particles to be observed each having a planar surface, a dispersion medium to be observed, and a viscosity modifier. The fluid for flow observation is high-viscosity non-Newtonian slurry containing inorganic particles. The fluid for flow observation may be a simulated fluid for a fluid for flow analysis. The simulated fluid closely resembles the particle size of inorganic particles to be analyzed and the viscosity of the fluid for flow analysis. The fluid for flow analysis contains the inorganic particles to be analyzed and a dispersion medium to be analyzed.

Abstract: A power conversion apparatus for vehicle use having a small size and a light weight is obtained. The power conversion apparatus is provided with: a plurality of semiconductor modules in which semiconductor devices are molded with a resin, and each of which has a module body, an input terminal, and an output terminal; a heat sink of a rectangular parallelepiped shape which has cooling principal planes on opposite surfaces thereof, respectively, for cooling these semiconductor modules; and a plurality of control boards which control the driving of the semiconductor modules. Each of the semiconductor modules is arranged such that its module body has a principal plane in surface contact with one of the cooling principal planes of the heat sink, and each of the control boards is arranged in opposition to a surface of the module body at an opposed side of the principal plane thereof.

Abstract: Provided is a method of producing “a ceramic green bonded compact in which a ceramic green film is bonded on each bonding surface of a ceramic green substrate having hole portions,” the method imparting good adhesiveness to a thin green film while suppressing the green substrate from having deformation. In this method, first, a layer of a paste for bonding is formed on each bonding surface of green sheets prepared. Next, each bonding surface of the green sheets on which the paste layer is formed is brought into contact, in a state in which the paste layer is wet, with each bonding surface of a porous ceramic green substrate prepared. While this state is maintained, pores in the green substrate absorb a dispersion medium in the paste layer in the wet state. As a result, the paste layer is dried, thereby completely bonding the green substrate and the green sheets.

Abstract: A game apparatus has an upper housing and a lower housing which are foldable. A first part, a second part, and a third part constitute the upper housing. A fourth part, a fifth part, and a sixth part constitute the lower housing. By assembling the parts, the game apparatus comes to have a three-layered structure when folded, thereby enhancing operability, a degree of freedom of design, and the like.

Abstract: In the present invention, when a power module is soldered to a heatsink, steam which is temperature-adjusted to at least the melting point of a solder is introduced from a steam generating tank into the flow path provided in the heatsink, the heatsink is heated and the solder is melted. Inert gas is introduced into a soldering tank from another route so as not to mix with the steam supplied to the heatsink. Voids in the solder are reduced and condensed by pressure regulation and as a result the negative impact of voids is eliminated.

Abstract: A power converter has one set of two semiconductor switches performing switching actions, each of which is formed of an FET and a free wheel diode connected in anti-parallel to the FET, and a smoothing capacitor, and convers power by complementary switching actions of the FETs in the semiconductor switches. The power converter is provided with a current sensor that detects a direction of a current flowing through the semiconductor switches and a gate generation portion that skips ON signals of PWM gate signals of the semiconductor switches when the direction of the current flowing through the semiconductor switches is negative.

Abstract: The present invention provides a ceramic green sheet with a thin flat plate shape obtained by molding and solidifying a ceramic slurry, which contains a ceramic powder, dispersion medium, and gelling agent, into a thin flat plate. The ceramic green sheet partially includes a body that is obtained by molding and solidifying a conductor paste, which becomes a conductor later, and the body is exposed on a part of each of the both surfaces of the sheet. Plural ceramic green sheets described above are produced. The plural ceramic green sheets are successively stacked and press-bonded in the thickness direction in such a manner that the bodies included in the respective sheets are connected to each other for all combinations of the adjacent two sheets. As a result, a ceramic green sheet laminate is formed, which includes one body that is obtained by connecting the bodies included in the respective sheets.