Abstract: An object is to provide a low-temperature storage capable of further dividing a medium storage chamber divided by a medium partition into upper/lower small sections (small storage chambers) by adding of an optional component and changing of an inner door, and the storage comprising; a thermal insulation box main body having an opening in a front surface thereof; a thermal insulating door openably/closably attached to the thermal insulation box main body; a medium partition which divides the opening into upper/lower medium openings; a shelf which divides a storage chamber formed by the thermal insulating door and the main body into upper/lower chambers in a position of the medium partition; a cooling device which cools the storage chamber; a metallic optional partition member which further divides the medium openings into upper/lower openings; a frame member formed of a resin and attached to a front part of the partition member to support an optional gasket; and a plurality of inner doors which openably close

Abstract: A magenta ink for ink-jet recording contains a coloring agent, water and a water soluble organic solvent. Different types of dyes are employed as the coloring agent. In particular, a dye (1) represented by the general formula (1) is used together with at least one dye selected from the group consisting of a dye (2) represented by the general formula (2) in a free acid form, C. I. Acid Red 289 and C. I. Acid Red 52.

Abstract: An ink set for ink-jet recording is formed from a yellow ink in which C. I. Direct Yellow 132 and C. I. Direct Yellow 86 are employed, a magenta ink in which a specific pyrazolylazopyridine-based (or pyrazolylazopyrazine-based) dye and another specific dye are employed, and a cyan ink in which two specific types of copper phthalocyanine-based dyes are employed.

Abstract: In one embodiment, the disclosure relates to an ink-jet head including an ink chamber, a pressure chamber in communication with the ink chamber, a nozzle for ejecting an ink in communication with the pressure chamber, a piezoelectric actuator for applying an ejection pressure to an ink in the pressure chamber, and an ink passage extending from a boundary of the ink chamber to a tip of the nozzle. The tip of the nozzle has an aperture diameter of from about 15 to about 25 ?m, and the ink passage is configured such that when an ink having a viscosity of from about 2.5 to about 3 mPa·s is passed therethrough, a passage resistance value of the ink passage is from about 50 to about 100 kPa·s/mm3. Another embodiment of the disclosure relates to an ink-jet recording device containing such an ink-jet head.

Abstract: A water base ink for ink-jet recording contains 0.1% by weight to 4.0% by weight of C.I. Direct Yellow 132; not less than 0.5% by weight of glycol ether having a melting point of not more than ?45°C.; and a water-soluble organic solvent in which a solubility of C.I. Direct Yellow 132 at 20° C. is not less than 5%. The ink satisfies 0.2?B/A and 3?C/A. B/A represents a weight ratio of the glycol ether to the C.I. Direct Yellow 132 contained in the ink, and C/A represents a weight ratio of the water-soluble organic solvent to the C.I. Direct Yellow 132 contained in the ink. The stability in long-term storage after the evaporation of water or at low temperatures can be obtained even when C.I. Direct Yellow 132 is used in the water-base ink for the ink-jet recording.

Abstract: A water-based ink for ink-jet recording includes a reactive dye which forms chloride ions in the ink, benzotriazole, carboxybenzotriazole, water and a water soluble organic solvent. Examples of the reactive dye which forms chloride ions in the ink include triazine based reactive dyes and the like.

Abstract: Provision of a compound having an anti-HIV activity, particularly an integrase inhibitory activity. A 4-oxoquinoline compound represented by the following formula [I] or a pharmaceutically acceptable salt thereof: wherein each symbol is as defined in the specification.

Abstract: A water base ink for ink-jet recording contains 0.1% by weight to 4.0% by weight of C.I. Direct Yellow 132; not less than 0.5% by weight of glycol ether having a melting point of not more than ?45°C.; and a water-soluble organic solvent in which a solubility of C.I. Direct Yellow 132 at 20° C. is not less than 5%. The ink satisfies 0.2?B/A and 3?C/A. B/A represents a weight ratio of the glycol ether to the C.I. Direct Yellow 132 contained in the ink, and C/A represents a weight ratio of the water-soluble organic solvent to the C.I. Direct Yellow 132 contained in the ink. The stability in long-term storage after the evaporation of water or at low temperatures can be obtained even when C.I. Direct Yellow 132 is used in the water-base ink for the ink-jet recording.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 ?m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 ?m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 ?m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: An object is to provide a low-temperature storage capable of further dividing a medium storage chamber divided by a medium partition into upper/lower small sections (small storage chambers) by adding of an optional component and changing of an inner door, and the storage comprising; a thermal insulation box main body having an opening in a front surface thereof; a thermal insulating.

Abstract: An object is to provide a low-temperature storage cooled/maintained in an ultra low temperature range, in which door lowering is automatically modified (corrected) by an opening/closing operation of a thermal insulating door, and a concave/convex portion which is a contact portion with respect to a door switch disposed on the door can be secured, and there is provided a low-temperature storage comprising: a thermal insulation box main body having an opening in a front surface thereof; a thermal insulating door openably/closably attached to the thermal insulation box main body by a plurality of hinges to close the opening; and a cooling device which cools a storage chamber formed by the door and the main body, wherein a spacer having a guide surface to forcibly correct door lowering by a closing operation of the thermal insulating door is disposed on a side on which any hinge is not disposed.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;M or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more; and (D) a silicone oil having at least one amino group per molecule. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: An epoxy resin composition for encapsulating a photosemi-conductor element excellent in releasing property from a mold in forming and in adhesion to the photosemi conductor element is provided. The epoxy resin composition comprises element comprising the following components (A) to (D): (A) an epoxy resin; (B) a hardener; (C) a silane coupling agent having an epoxy group, a mercapto group or an amino group; and (D) a releasing agent in which a molecule thereof has structure moieties represented by the following general formulas (1) and (2) and in which the weight ratio of the structure moiety represented by general formula (2) is 25% to 95% by weight based on the whole molecule, &Parenopenst;CH2CH2&Parenclosest;m  (1)  wherein m is a positive integer of 8 to 100 and &Parenopenst;CH2CH2O&Parenclosest;n  (2)  wherein n is a positive integer.