Abstract: A polishing apparatus has a polishing table having a polishing surface, a carrier for carrying a plate-like member and bringing the plate-like member into contact with the polishing surface, and a dresser including a dressing tool adapted to be brought into contact with the polishing surface to dress or normalize the polishing surface. The carrier is movable along a first path between a work position for bringing into contact the plate-like member with the polishing surface and a rest position. The dresser is movable along a second path between a work position for bringing the dressing tool into contact with the polishing surface and a rest position. The first and second paths have a common overlapping area. A contact prevention device is provided to prevent the carrier and the dresser from coming into contact with each other.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top ring and having a plurality of stages positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces. The polishing apparatus further includes a plurality of support tables removably held by the respective stages of the rotary transporter for supporting the workpieces, and a pusher for transferring the workpiece between the support table and the top ring.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: The present invention provides a polishing apparatus comprising a polishing table having a polishing surface, a substrate carrier having an axis about which the substrate carrier is rotatable. The substrate carrier includes a plurality of substrate holders positioned around a circle about the axis of the substrate carrier and spaced apart from each other at equal angular distances, with each of the substrate holders being adapted to hold a substrate and bring it into contact with the polishing surface. The apparatus further comprises a substrate loading device laterally spaced apart from the polishing table, in which device a substrate is picked up by one of the substrate holders which is positioned at the substrate loading device, and a substrate unloading device laterally spaced apart from the polishing table, in which device one of the substrate holders which is positioned at the substrate unloading device releases a wafer onto the unloading device.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The transfer structure comprises a plurality of robots and is capable of changing transfer routes between the three cleaning apparatuses.

Abstract: In a process of forming a metal film, when metal wiring is formed on a diffusion layer (an electrode, etc.) of a circuit element formed on a silicon semiconductor wafer, a Ti film is deposited on a surface of a processed body by PECVD using TiCl.sub.4 gas and H.sub.2 gas as material gas. A Ti--Si--N film is formed on the diffusion layer surface by adding N.sub.2 gas to the material gas, and the Ti film is formed subsequently on the Ti--Si--N film. The Ti--Si--N film suppresses diffusion of silicon from the semiconductor wafer side.

Abstract: An input structure for a display device having opposed substrates an electrodes disposed on the inner surfaces of the substrates and a seal about the periphery thereof with a relay electrode crossing the seal to connect the electrodes on the opposed substrate to external circuitry. The electrical connection between the electrodes on the first substrate to the relay electrode is provided by a conductive adhesive electrode and a conductive synthetic resin thin film layer contacting the conductive adhesive electrode, the thin film layer formed of conductive material which is shorter than the conductive material of the conductive adhesive electrode to absorb shock and avoid separation of the electrodes from the opposed substrate.

Abstract: An electro-optical device including a pair of flexible substrates including transparent electrodes deposited on a phenoxy resin layer and separated by spacers is provided. The flexible substrates include a support substrate, a gas barrier layer laminated on each side of the support substrate and a phenoxy resin layer on the interior gas barrier layer. Spacers are embedded in an orientation film to maintain distance between the substrates. Improved bonding strength between substrates is provided by a sealing region free of orientation film.

Abstract: The evacuated and cooled Dewar 1 of an infrared detector has a window end in the shape of an elliptical spheroid, and an IR detection element 3 is mounted within the focal circle of the spheroid. The construction minimizes the sensing of spurious IR rays by the detection element, as well as the heat load for the coolant and the cool down time.