Patents by Inventor Scott A. Linn

Scott A. Linn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FIRE PULSE WIDTH ADJUSTMENT
    Publication number: 20190030888
    Abstract: First electronics may determine a count of bubble jet resistors to be fired by a fire pulse group. A fire pulse generator may generate a fire pulse train for bubble jet resistors, the fire pulse train comprising a precursor pulse and a firing pulse separated by a dead time. Second electronics may adjust a width of the fire pulse for the bubble jet resistors of the fire pulse group by maintaining a first edge of the fire pulse relative to the precursor pulse and adjusting a second edge of the fire pulse relative to the precursor pulse based upon the determined count for the fire pulse group.
    Type: Application
    Filed: April 14, 2016
    Publication date: January 31, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Vincent C. Korthuis, Eric T Martin, Michael W. Cumbie, Scott A Linn, Pere Esterri
  • FLUIDIC DIE
    Publication number: 20190016127
    Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.
    Type: Application
    Filed: April 9, 2018
    Publication date: January 17, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Scott A. Linn, George H. Corrigan III, Michael W. Cumbie
  • Crack sensing for printhead having multiple printhead die
    Patent number: 10124579
    Abstract: An inkjet printhead including a plurality of printhead dies, each printhead die including at least one crack sense resistor, at least one analog bus connected to each printhead die, and a controller separate from the plurality of printhead dies. The controller is configured to provide a known current to the at least one crack sense resistor of each printhead die in a selectable pattern via the at least one analog bus and to determine whether the printhead dies are cracked based on resulting voltages produced on the at least one analog bus.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: November 13, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daryl E Anderson, George H Corrigan, Scott A Linn
  • Piezoelectric fluid ejection assembly
    Patent number: 10112390
    Abstract: In some examples, a piezoelectric fluid ejection assembly includes a micro-electro mechanical system (MEMS) die including a plurality of nozzles, a first application-specific integrated circuit (ASIC) die electrically connected to the MEMS die, and a second ASIC die electrically connected to the MEMS die. The first ASIC die includes a plurality of driver amplifiers for respective nozzles of a first number of the plurality of nozzles, and a plurality of unique waveform data generators to generate respective different waveforms for activating the nozzles of the first number of the plurality of nozzles.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: October 30, 2018
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Peter J. Fricke, Andrew L. Van Brocklin, Scott A. Linn
  • WIDE ARRAY PRINTHEAD MODULE
    Publication number: 20180304624
    Abstract: A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.
    Type: Application
    Filed: June 29, 2018
    Publication date: October 25, 2018
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Peter James Fricke, Michael W. Cumbie, Scott A. Linn
  • PRINTHEADS WITH SENSOR PLATE IMPEDANCE MEASUREMENT
    Publication number: 20180297370
    Abstract: In an implementation, a printhead includes a nozzle and a fluid channel. A sensor plate is located within the fluid channel. An impedance measurement circuit is coupled to the sensor plate to measure impedance of fluid within the channel during a fluid movement event that moves fluid past the sensor plate.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 18, 2018
    Inventors: Adam L. Ghozeil, Scott A. Linn, David Maxfield, Andrew Van Brocklin
  • Piezoelectric printhead assembly with multiplier to scale multiple nozzles
    Patent number: 10099475
    Abstract: In an example, a piezoelectric printhead assembly includes a micro-electro mechanical system (MEMS) die including a plurality of nozzles. An application-specific integrated circuit (ASIC) die is coupled to the MEMS die by a plurality of wire bonds, wherein each of the wire bonds corresponds to a respective nozzle of the plurality of nozzles. An arbitrary data generator (ADG) on the ASIC is to provide a digital data sequence, and a multiplier is to scale multiple nozzles of the plurality of nozzles.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: October 16, 2018
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY L.P.
    Inventors: Peter James Fricke, Scott A Linn, Luca Molinari
  • Wide array printhead module
    Patent number: 10046562
    Abstract: A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: August 14, 2018
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Peter James Fricke, Michael W Cumbie, Scott A Linn
  • Wide array printhead module
    Patent number: 10040281
    Abstract: A wide array printhead module includes a plurality of printhead die. Each of the printhead die includes a number of sensors to measure properties of a number of elements associated with the printhead die. The wide array printhead module further includes an application specific integrated circuit (ASIC) to command and control each of the printhead die. The ASIC is located off any of the printhead die.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: August 7, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daryl E Anderson, George H Corrigan, Scott A Linn
  • PRINTING SYSTEM WITH A FLUID CIRCULATING ELEMENT
    Publication number: 20180215150
    Abstract: According to an example, a printing system may include a drop ejecting element and a fluid circulating element corresponding to the drop ejecting element. The printing system may also include a logic device that is to receive a data stream addressed to the drop ejecting element, determine whether the data stream indicates that the drop ejecting element is to be energized, and in response to a determination that the data stream does not indicate that the drop ejecting element is to be energized, energize the fluid circulating element.
    Type: Application
    Filed: October 30, 2015
    Publication date: August 2, 2018
    Inventors: Vincent C. KORTHUIS, Eric T. MARTIN, Michael W. CUMBIE, Scott A. LINN
  • Fluidic die
    Patent number: 10022962
    Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: July 17, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, George H. Corrigan, III, Michael W. Cumbie
  • FLUID LEVEL SENSOR AND RELATED METHODS
    Publication number: 20180162137
    Abstract: In an embodiment, a fluid level sensor includes a sensor plate and a current source. The fluid level sensor also includes an algorithm to bias the current source such that current applied to the sensor plate induces a maximum difference in response voltage between a dry sensor plate condition and a wet sensor plate condition.
    Type: Application
    Filed: February 8, 2018
    Publication date: June 14, 2018
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Andrew L. Van Brocklin, Paul A. Liebert, Adam L. Ghozeil, Scott A. Linn
  • Fluidic die
    Patent number: 9969157
    Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: May 15, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, George H. Corrigan, III, Michael W. Cumbie
  • Printheads with sensor plate impedance measurement
    Patent number: 9962949
    Abstract: In an implementation, a printhead includes a nozzle and a fluid channel. A sensor plate is located within the fluid channel. An impedance measurement circuit is coupled to the sensor plate to measure impedance of fluid within the channel during a fluid movement event that moves fluid past the sensor plate.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: May 8, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Adam L. Ghozeil, Scott A. Linn, David Maxfield, Andrew Van Brocklin
  • Fluid level sensor and related methods
    Patent number: 9925787
    Abstract: In an embodiment, a fluid level sensor includes a sensor plate and a current source. The fluid level sensor also includes an algorithm to bias the current source such that current applied to the sensor plate induces a maximum difference in response voltage between a dry sensor plate condition and a wet sensor plate condition.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: March 27, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andrew L. Van Brocklin, Paul A. Liebert, Adam L. Ghozeil, Scott A. Linn
  • PIEZOELECTRIC FLUID EJECTION ASSEMBLY
    Publication number: 20180072059
    Abstract: In some examples, a piezoelectric fluid ejection assembly includes a micro-electro mechanical system (MEMS) die including a plurality of nozzles, a first application-specific integrated circuit (ASIC) die electrically connected to the MEMS die, and a second ASIC die electrically connected to the MEMS die. The first ASIC die includes a plurality of driver amplifiers for respective nozzles of a first number of the plurality of nozzles, and a plurality of unique waveform data generators to generate respective different waveforms for activating the nozzles of the first number of the plurality of nozzles.
    Type: Application
    Filed: November 27, 2017
    Publication date: March 15, 2018
    Inventors: Peter J. Fricke, Andrew L. Van Brocklin, Scott A. Linn
  • CRACK SENSING FOR PRINTHEAD HAVING MULTIPLE PRINTHEAD DIE
    Publication number: 20180001618
    Abstract: An inkjet printhead including a plurality of printhead dies, each printhead die including at least one crack sense resistor, at least one analog bus connected to each printhead die, and a controller separate from the plurality of printhead dies. The controller is configured to provide a known current to the at least one crack sense resistor of each printhead die in a selectable pattern via the at least one analog bus and to determine whether the printhead dies are cracked based on resulting voltages produced on the at least one analog bus.
    Type: Application
    Filed: January 30, 2015
    Publication date: January 4, 2018
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Daryl E Anderson, George H Corrigan, Scott A Linn
  • Piezoelectric printhead assembly
    Patent number: 9855746
    Abstract: A piezoelectric printhead assembly can include a micro-electro mechanical system (MEMS) die including a plurality of nozzles and a first application-specific integrated circuit (ASIC) die coupled to the MEMS die by a first plurality of wire bonds.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: January 2, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Peter J Fricke, Andrew L Van Brocklin, Scott A Linn
  • CRACK SENSING FOR PRINTHEAD HAVING MULTIPLE PRINTHEAD DIE
    Publication number: 20170355185
    Abstract: One example provides a printhead including a plurality of printhead dies, each printhead die including at least one crack sense resistor. At least one analog bus is connected to each printhead die, the at least one analog bus to output voltages to facilitate a printer controller to determine whether at least one of the printhead dies is cracked.
    Type: Application
    Filed: August 28, 2017
    Publication date: December 14, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Darryl E. Anderson, George H. Corrigan, Scott A. Linn
  • FLUIDIC DIE
    Publication number: 20170355188
    Abstract: A fluidic die includes a number of sensors to measure properties of a number of property control elements associated with the printhead die, a pass gate to communicate a number of signals to an application specific integrated circuit (ASIC) via an analog bus using control logic associated with the pass gate, and a bi-directional configuration bus coupled to the fluidic die to transmit a number of control signals to property control elements located on the fluidic die.
    Type: Application
    Filed: August 28, 2017
    Publication date: December 14, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Daryl E. Anderson, George H. Corrigan, Scott A. Linn