Abstract: A power machine can include a control device and a hydraulic circuit that can include a hydraulic pump in communication with a hydraulic motor that is configured to operate with infinitely variable displacement. The control device can be configured to determine a control value based on a commanded travel speed for the power machine and a pressure in the hydraulic circuit, and control a run-time displacement of the hydraulic motor based upon the determined control value.

Abstract: A hydraulic work system can include a continuously variable displacement hydraulic pump that is powered by an engine and is in communication with a hydraulic actuator. A run-time displacement of the hydraulic pump for movement of the hydraulic actuator can be controlled based on a speed of the engine.

Abstract: A power machine can include a hydraulic drive system that includes an infinitely variable hydraulic drive motor. A run-time displacement of the hydraulic motor can be adjusted based on commanded travel speed or based on a output torque. In some case, the run-time displacement can be selected from one of a plurality of displacement ranges, such as a high range and a low range.

Abstract: A hydraulic work system can include a continuously variable displacement hydraulic pump that is powered by an engine and is in communication with a hydraulic actuator. A run-time displacement of the hydraulic pump for movement of the hydraulic actuator can be controlled based on a speed of the engine.

Abstract: A hydraulic work system can include a continuously variable displacement hydraulic pump that is powered by an engine and is in communication with a hydraulic actuator. A run-time displacement of the hydraulic pump for movement of the hydraulic actuator can be controlled based on a speed of the engine.

Abstract: A hydraulic work system can include a continuously variable displacement hydraulic pump that is powered by an engine and is in communication with a hydraulic actuator. A run-time displacement of the hydraulic pump for movement of the hydraulic actuator can be controlled based on a speed of the engine.

Abstract: Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray and may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. In one embodiment, a two-stage gas nozzle may be used to expand a fluid mixture with a liquid phase concentration of greater than 10% by weight.

Abstract: Disclosed herein is an insole or footbed for a shoe. The insole includes a forefoot portion having a first thickness at a latitudinal midpoint thereof, a midfoot portion attached to the forefoot portion, and a hindfoot portion attached to the midfoot portion. An energy plug is attached to the midfoot portion and hindfoot portion and covering lateral portions thereof. The hindfoot portion has a second thickness at a latitudinal midpoint thereof, the second thickness being less than a first thickness. The hindfoot portion includes a support stabilizer at an outside lateral portion thereof.

Abstract: Disclosed herein is an insole or footbed for a shoe. The insole includes a forefoot portion having a first thickness at a latitudinal midpoint thereof, a midfoot portion attached to the forefoot portion, and a hindfoot portion attached to the midfoot portion. An energy plug is attached to the midfoot portion and hindfoot portion and covering lateral portions of the dominant foot thereof. The hindfoot portion has a second thickness at a latitudinal midpoint thereof, the second thickness being less than a first thickness. The hindfoot portion includes a support stabilizer at an outside lateral portion of the dominant foot thereof.

Abstract: A power machine can include a hydraulic drive system that includes an infinitely variable hydraulic drive motor. A run-time displacement of the hydraulic motor can be adjusted based on commanded travel speed or based on a output torque. In some case, the run-time displacement can be selected from one of a plurality of displacement ranges, such as a high range and a low range.

Abstract: A hydraulic work system can include a continuously variable displacement hydraulic pump that is powered by an engine and is in communication with a hydraulic actuator. A run-time displacement of the hydraulic pump for movement of the hydraulic actuator can be controlled based on a speed of the engine.

Abstract: Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. In one embodiment, the fluid mixture may be maintained to prevent liquid formation within the fluid mixture prior to passing the fluid mixture through the nozzle. The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbon dioxide, or any combination thereof.

Abstract: Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. In one embodiment, the fluid mixture may be maintained to prevent liquid formation within the fluid mixture prior to passing the fluid mixture through the nozzle. The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbon dioxide, or any combination thereof.

Abstract: A lid assembly and a knife adapted to be attached to a jar, the lid assembly including: a cylindrical jar sleeve adapted to be secured to the open end of the jar and having a jar sleeve circumferential portion at the upper end thereof. The lid assembly also includes a lid adapted to be removably attached to the jar sleeve and having a lid circumferential portion, one of the lid and jar sleeve having a groove adapted to receive the circumferential portion of the other of the lid and jar sleeve.

Abstract: A lid assembly and a knife adapted to be attached to a jar, the lid assembly including: a cylindrical jar sleeve adapted to be secured to the open end of the jar and having a jar sleeve circumferential portion at the upper end thereof. The lid assembly also includes a lid adapted to be removably attached to the jar sleeve and having a lid circumferential portion, one of the lid and jar sleeve having a groove adapted to receive the circumferential portion of the other of the lid and jar sleeve.

Abstract: Disclosed herein is an insole or footbed for a shoe. The insole includes a forefoot portion having a first thickness at a latitudinal midpoint thereof, a midfoot portion attached to the forefoot portion, and a hindfoot portion attached to the midfoot portion. An energy plug is attached to the midfoot portion and hindfoot portion and covering lateral portions of the dominant foot thereof. The hindfoot portion has a second thickness at a latitudinal midpoint thereof, the second thickness being less than a first thickness. The hindfoot portion includes a support stabilizer at an outside lateral portion of the dominant foot thereof.

Abstract: Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. In one embodiment, the fluid mixture may be maintained to prevent liquid formation within the fluid mixture prior to passing the fluid mixture through the nozzle. The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbon dioxide, or any combination thereof.

Abstract: Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. In one embodiment, the fluid mixture may be maintained to prevent liquid formation within the fluid mixture prior to passing the fluid mixture through the nozzle. The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbon dioxide, or any combination thereof.

Abstract: Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, using a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbon dioxide, or any combination thereof. The incoming fluid mixture may be maintained pressure greater than atmospheric pressure and at a temperature greater than the condensation temperature of the fluid mixture. The fluid mixture may be expanded into the treatment chamber to form an aerosol or gas cluster spray. In this embodiment, the nozzle may be positioned within 50 mm of the microelectronic substrate during the treatment, more preferably within 10 mm of the microelectronic substrate.

Abstract: Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. In one embodiment, the fluid mixture may be maintained to prevent liquid formation within the fluid mixture prior to passing the fluid mixture through the nozzle. The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbon dioxide, or any combination thereof.