Abstract: Methods, systems, and devices for performing memory command verification are described. A system may include a memory device and a memory controller, which may be external (e.g., a host device). The memory device may receive, from the memory controller, a command indicating a type of operation and an address. The memory device may decode the command and execute an operation (e.g., the operation corresponding to the decoded command) at an execution location on the memory device. The system (e.g., the memory device or the memory controller) may determine whether the executed operation and execution location match the type of operation and address indicated in the command, and the system may thereby determine an error associated with the decoding, the execution, or both of the command.

Abstract: Implementations described herein relate to single-bit error indication for a memory built-in self-test. A memory device may read one or more bits, associated with a memory built-in self-test, that are stored in a mode register of the memory device. The memory device may perform the memory built-in self-test for one or more memory sections of the memory device based on reading the one or more bits that are stored in the mode register of the memory device. The memory device may identify a number of single-bit errors associated with the one or more memory sections of the memory device based on performing the memory built-in self-test. The memory device may transmit an indication of the number of single-bit errors based on repairing one or more of the single-bit errors associated with the one or more memory sections of the memory device.

Abstract: Implementations described herein relate to resource allocation for a memory built-in self-test. A memory device may read one or more bits, associated with a memory built-in self-test, that are stored in a mode register of the memory device. The memory device may identify one or more memory resources of the memory device, based on reading the one or more bits, that are to be used for performing the memory built-in self-test. The one or more memory resources of the memory device may be addressable memory resources configured for performing standard memory operations of the memory device. The memory device may perform the memory built-in self-test for the memory device using the one or more memory resources of the memory device.

Abstract: Methods, systems, and devices are described herein for using codewords to detect or correct errors in data (e.g., data stored in a memory device). A host device may generate one or more codewords associated with data to be stored in the memory device. In some cases, the host device may generate one or more codewords for error detection and correction (e.g., corresponding to data transmitted by the host device to the memory device). In some cases, the host device may transmit the codewords and the associated data using an extended (e.g., adjustable) burst length such that the one or more codewords may be included in the burst along with the data. Additionally or alternatively, the host device may transmit one or more of the codewords over one or more channels different than the one or more channels used to transmit the data.

Abstract: Methods, systems, and devices for command block management are described. A memory device may receive a command (e.g., from a host device). The memory device may determine whether the command is defined by determining if the command is included within a set of defined commands. In the case that a received command is absent from the set of defined commands (e.g., the command is undefined), the memory device may block the command from being decoded for execution by the memory device. In some cases, the memory device may switch from a first operation mode to a second operation mode based on receiving an undefined command. The second operation mode may restrict an operation of the memory device, while the first mode may be less restrictive, in some cases. Additionally or alternatively, the memory device may indicate the undefined command to another device (e.g., the host device).

Abstract: Implementations described herein relate to indicating a status of the memory built-in self-test for multiple memory device ranks. A memory device may read one or more bits, associated with a memory built-in self-test, that are stored in a mode register of the memory device. The memory device may identify a first data mask inversion (DMI) bit of the memory device that is associated with a first rank of the memory device and a second DMI bit of the memory device that is associated with a second rank of the memory device. The memory device may set the first DMI bit to a first value based on determining to perform the memory built-in self-test for the first rank of the memory device. The memory device may perform the memory built-in self-test for the first rank of the memory device based on setting the first DMI bit to the first value.

Abstract: Implementations described herein relate to memory section selection for a memory built-in self-test. A memory device may read a first set of bits stored in a test control mode register. The memory device may identify a test mode, for performing a memory built-in self-test, based on the first set of bits. The memory device may read a second set of bits stored in a section identifier mode register. The memory device may identify one or more memory sections of the memory device, for which the memory built-in self-test is to be performed, based on the second set of bits. The one or more memory sections may be a subset of a plurality of memory sections into which the memory device is divided. The memory device may perform the memory built-in self-test for the one or more memory sections of the memory device based on the test mode.

Abstract: Implementations described herein relate to performing a memory built-in self-test and indicating a status of the memory built-in self-test using a data mask inversion (DMI) bit. A memory device may read one or more bits, associated with a memory built-in self-test, that are stored in a mode register of the memory device. The memory device may identify a first DMI bit of the memory device that is associated with indicating a status of the memory built-in self-test and a second DMI bit of the memory device that is not associated with indicating the status of the memory built-in self-test. The memory device may set the first DMI bit to a first value based on the one or more bits indicating that the memory built-in self-test is enabled. The memory device may perform the memory built-in self-test based on setting the first DMI bit to the first value.

Abstract: Methods, systems, and devices for monitoring and reporting a status of a memory device are described. A memory device may include monitoring circuitry that may be configured to monitor health and wear information for the memory device. A host device may write to a dedicated register of the memory device, to configure the memory device with health status information reporting parameters. The memory device may monitor and report the health status information of the memory device based on the received reporting configuration or based on a default configuration, and may write one or more values indicative of the health status information to a dedicated register. The host device may perform a read on the readout register to obtain the health status information, as indicated by the one or more values, and may adjust operating procedures or take other actions based on the received health status information.

Abstract: Methods, systems, and devices for memory fault notification are described. A memory device may receive a configuration corresponding to a circuit node of the memory device, where the circuit node may be selectively coupled with a set of resistors. The memory device may determine a fault condition and couple the circuit node to at least a first resistor based on determining the fault condition. The memory device may bias the circuit node to a first voltage value that satisfies a voltage threshold based on coupling the circuit node to the first resistor. The memory device may output an indication of a fault state to notify a host device that a fault has been detected.

Abstract: Methods, systems, and devices for a memory device with status feedback for error correction are described. For example, during a read operation, a memory device may perform an error correction operation on first data read from a memory array of the memory device. The error correction operation may generate second data and an indicator of a state of error corresponding to the second data. In one example, the indicator may indicate one of multiple possible states of error. In another example, the indicator may indicate a corrected error or no detectable error. The memory device may output the first or second data and the indicator of the state of error during a same burst interval. The memory device may output the data on a first channel and the indicator of the state of error on a second channel.

Abstract: Implementations described herein relate to performing a memory built-in self-test and indicating a status of the memory built-in self-test. A memory device may read one or more bits, associated with a memory built-in self-test, that are stored in a mode register of the memory device. The memory device may identify, based on the one or more bits, that the memory built-in self-test is enabled. The memory device may set a DMI bit of the memory device to a first value and perform the memory built-in self-test based on identifying that the memory built-in self-test is enabled. The memory device may set the DMI bit of the memory device to a second value based on a completion of the memory built-in self-test.

Abstract: Methods, systems, and devices for memory device health evaluation at a host device are described. The health evaluation relates to a host device that is associated with a memory device that monitors and reports health information, such as one or more parameters associated with a status of the memory device. The memory device may transmit the health information to the host device, which may perform one or more operations and may transmit the health information to a device of another entity of a system (e.g., ecosystem) including the host device. The host device may include one or more circuits for transmitting and processing the health information, such as a system health engine, a safety engine, a communication component, or a combination thereof. Based on a determination by the host device or information received from an external device, the host device may transmit a command to the memory device.

Abstract: Methods, systems, and devices for evaluation of memory device health monitoring logic are described. For example, a memory device may include health monitoring logic operable to activate certain internal health monitors of a set of multiple monitors and to communicate an output associated with the activated monitors. In a first mode of operation, the health monitoring logic may provide a single output that is generated from multiple outputs of the set of monitors. In a second mode of operation, the health monitoring logic may cycle through certain monitors (e.g., in a test mode), and may generate an output corresponding to respective active monitors as it cycles through the set of monitors. The health monitoring logic may communicate an output specific to each monitor to a host device such that the host device may evaluate an output from each monitor of the set of monitors.

Abstract: Methods, systems, and devices for differential strobe fault indication are described. A memory device may be configured to indicate a fault using a read strobe signal. The read strobe signal may be a read data strobe (RDQS) signal, such as a true RDQS (RDQS_t) signal or a complement RDQS (RDQS_c) signal. In some examples, the memory device may indicate the fault based on a characteristic of the read strobe signal, such as a pattern of the read strobe signal, a voltage level of the read strobe signal, a difference between a first read strobe signal and a second read strobe signal, or any combination thereof. In some examples, a host device may indicate to the memory device which characteristic of the read strobe signal the memory device is to use to indicate the fault.

Abstract: Implementations described herein relate to interrupting a memory built-in self-test. A memory device may read one or more bits, associated with a memory built-in self-test, that are stored in a mode register of the memory device. The memory device may identify, based on the one or more bits, that the memory built-in self-test is to be interrupted while the memory built-in self-test is being performed using a test mode. The memory device may be permitted to interrupt the memory built-in self-test while the memory built-in self-test is being performed using the test mode but may not be permitted to interrupt the memory built-in self-test while the memory built-in self-test is being performed using a repair mode. The memory device may interrupt the memory built-in self-test while the memory built-in self-test is being performed using the test mode.

Abstract: Implementations described herein relate to refresh rate selection for a memory built-in self-test. A memory device may read one or more bits, associated with the memory built-in self-test, that are stored in a mode register of the memory device. The memory device may identify, based on the one or more bits, a refresh rate to be used while performing the memory built-in self-test. The refresh rate may indicate a rate at which memory cells, to be tested by the memory built-in self-test, are to be refreshed while the memory built-in self-test is being performed. The memory device may perform the memory built-in self-test while refreshing the memory cells according to the refresh rate.

Abstract: Implementations described herein relate to enabling or disabling on-die error-correcting code for a memory built-in self-test. A memory device may read one or more bits, associated with a memory built-in self-test, that are stored in a mode register of the memory device. The memory device may identify, based on the one or more bits, whether the memory built-in self-test is to be performed with on-die error-correcting code (ECC) disabled or with on-die ECC enabled. The memory device may perform the memory built-in self-test, and selectively test for one or more single-bit errors, based on identifying whether the memory built-in self-test is to be performed with the on-die ECC disabled or with the on-die ECC enabled.

Abstract: Implementations described herein relate to memory section selection for a memory built-in self-test. A memory device may read a first set of bits stored in a test control mode register. The memory device may identify a test mode, for performing a memory built-in self-test, based on the first set of bits. The memory device may read a second set of bits stored in a section identifier mode register. The memory device may identify one or more memory sections of the memory device, for which the memory built-in self-test is to be performed, based on the second set of bits. The one or more memory sections may be a subset of a plurality of memory sections into which the memory device is divided. The memory device may perform the memory built-in self-test for the one or more memory sections of the memory device based on the test mode.

Abstract: Methods, systems, and devices for selectable error control for memory device are described. An apparatus may include a memory array and a circuit configurable to perform a first error control operation and a second error control operation on data stored by the memory array. The circuit may include a first plurality of gates enabled during the first error control operation and configured to generate a first set of bits associated with a first matrix of the first error control operation. The circuit may also include a second plurality of gates enabled during the second error control operation and configured to generate a second set of bits associated with the second matrix of the second error control operation. The circuit may further include a third plurality of gates configured to generate a third set of bits that are common to both the first matrix and the second matrix.