Abstract: An example method comprising requesting authorization to reprocess a replaceable supply component using an interface and original manufacturing data stored in memory of the replaceable supply component. The method further comprises, in response to the request, receiving configuration data using the interface, and appending the original manufacturing data with the configuration data to designate the replaceable supply component as reprocessed, wherein the configuration data is to cause reconfiguration of an end-user device in response to attachment of the replaceable supply component to the end-user device and execution by the end-user device.

Abstract: A method of providing and processing an ultrasound capable endoscope assembly that uses an endoscope having a proximal and a distal end, and that has been used previously. The endoscope is cleansed to a level appropriate for re-use within a human body. The method also uses an unused ultrasound assembly, sealed in antiseptic packaging, and which includes a multiple signal pathway connector; an ultrasound transducer head including an ultrasound transducer; and a set of signal pathways, extending from the ultrasound transducer to the multiconductor electrical connector. In the method, the ultrasound assembly is to the endoscope, so that the set of signal pathways extends along the elongate body of the endoscope and the ultrasound transducer head is attached at the distal end. After use, the ultrasound assembly is detached from the endoscope and permanently disposed.

Abstract: A fiber optic assembly is provided including a support substrate having a substantially planar surface, a signal-fiber array supported on the planar surface of the support substrate. The signal-fiber array including a plurality of optical fibers and an adhesive disposed on the plurality of optical fibers and the support substrate. Each of the optical fibers is spaced from adjacent optical fibers of the plurality of optical fibers at a precise pitch.

Abstract: Methods and systems for joining photonic components. A method includes suspending nano-particles in a medium, wherein the nano-particles include metal nano-particles. The method further includes applying a layer of the nano-particle medium to a first substrate, and exposing the layer of nano-particle medium to a thermal process to remove at least a portion of the medium and expose the nano-particles. A second substrate is placed on the nano-particles in alignment with the first substrate, and a heat is applied to the nano-particles to cause connection of contact points between adjacent nano-particles to cause a secure alignment of the first and second substrates. The heat applied to the layer of nano-particles is less than 300° C.

Abstract: An optical assembly includes stacked planar lightwave circuit (PLC) members each having a plurality of waveguides in a respective plane, to provide optical connections to two-dimensional arrays of external optical waveguides (e.g., optical fiber cores), with one array including non-coplanar groups of waveguides having group members that are alternately arranged in a lateral direction. An optical assembly may provide optical connections between array of cores having a different pitch and/or orientation to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

Abstract: Lens-based optical connector assemblies and methods of fabricating the same are disclosed. In one embodiment, a lens-based connector assembly includes a glass-based optical substrate includes at least one optical element within the optical substrate, and at least one alignment feature positioned at an edge of the glass-based optical substrate, wherein the at least one alignment feature is located within 0.4 ?m of a predetermined position with respect to the at least one optical element along an x-direction and a y-direction. The lens-based connector assembly further includes a connector element including a recess having an interior surface, The interior surface has at least one connector alignment feature. The glass-based optical substrate is disposed within the recess such that the at least one alignment feature of the glass-based optical substrate engages the at least one connector alignment feature.

Abstract: A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

Abstract: A flow reactor or flow reactor component includes a base plate, a first fluid module having first and second major surfaces, an internal process fluid passage, and a heat exchange channel in the first major surface, the first major surface stacked on the base plate; a second fluid module having first and second major surfaces, an internal process fluid passage and a heat exchange channel in the first major surface, the first major surface stacked on the second major surface of the first fluid module, optional additional fluid modules of the same configuration as the first and second fluid modules stacked successively on the second fluid module, and a top plate having a heat exchange channel in a bottom major surface thereof with the bottom major surface stacked on an uppermost fluid module of (1) the second fluid module and (2) the optional additional fluid modules.

Abstract: An optical assembly includes stacked first and second planar lightwave circuit (PLC) members each having a plurality of waveguides in respective first and second planes, to provide optical connections between a two-dimensional array and a one-dimensional array of external optical waveguides (e.g., optical fiber cores). Inner faces of first and second PLC members are arranged facing one another and with the first and second planes (corresponding to the pluralities of first and second waveguides, respectively) being non-parallel. An optical assembly may provide optical connections between arrays of cores having a different pitch to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

Abstract: A process (10) of forming an internal mold (IM) and using the internal mold (IM) to press-mold an internal passage or an internal cavity within a ceramic body includes making or obtaining first and second flexible mold halves (102,104); molding a positive internal mold (IM) of a meltable or sublimable or otherwise heat-removeable material; pressing a volume of binder-coated ceramic powder with the positive internal mold (IM) inside the volume of powder to form a pressed body; heating the pressed body to remove the positive internal mold from the pressed body; and sintering the pressed body to form a monolithic ceramic body having an internal passage or an internal cavity.

Abstract: Multi-fiber interface apparatuses providing a double reflection expanded beam arrangement include one or more substrates being configured to mountably receive a photonic integrated circuit (PIC), a fiber array coupling member mounted to a substrate, optical elements associated with the substrate and/or the fiber array coupling member, and one or more additional features. An additional feature according to certain implementations includes one or more passive substrate alignment features for aligning substrates to promote optical coupling between optical fibers and the PIC. In certain implementations configured for interfacing with printed circuit boards (PCBs), an additional feature includes a recess defined in an optically transmissive substrate in which a PIC is mounted, or includes a recess defined in a PCB into which the PIC is mounted. Various embodiments provide relaxed fiber alignment tolerances with simplified fabrication and system integration capabilities.

Abstract: Optical fiber photonic integrated chip connector interfaces and photonic integrated chip assemblies utilizing low-profile optical fibers and methods thereof are disclosed. In one embodiment, an optical fiber photonic integrated chip (PIC) connector interface includes at least one low-profile optical fiber having an end face, at least one core, and a cladding layer, wherein the end face is non-rotationally symmetric with respect to the at least one core, and the cladding layer includes at least one minimum perimeter point that is a minimum distance from the at least one core as compared to remaining perimeter points of the cladding. The PIC connector interface further includes an interconnect substrate including a fiber mounting surface, and a mechanical coupling surface. The at least one low-profile optical fiber is disposed on the fiber mounting surface such that one or more surfaces of the cladding defining the at least one minimum perimeter point faces away from the fiber mounting surface.

Abstract: Raman analysis systems are partitioned to provide for cost-effective flame resistance and explosion resistance, including relatively small enclosures associated with particular subsystems. One or more of an excitation source, spectrograph and/or controller are disposed in separate, flame-resistant or explosion-resistant enclosures. A remote optical measurement probe may also be disposed in a separate flame-resistant or explosion-resistant enclosure. A grating and a detector of the spectrograph may be disposed in separate enclosures, with sealed windows therebetween to deliver a Raman spectral signal from the optical grating to the detector. The sealed window of the detector enclosure may serve the dual purpose of maintaining flame resistance or explosion resistance while maintaining cooling within the enclosure. Wireless interfaces may be used for communications between the enclosures where practical to reduce or eliminate physical electrical feedthroughs.

Abstract: A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

Abstract: Lens-based optical connector assemblies and methods of fabricating the same are disclosed. In one embodiment, a lens-based connector assembly includes a glass-based optical substrate includes at least one optical element within the optical substrate, and at least one alignment feature positioned at an edge of the glass-based optical substrate, wherein the at least one alignment feature is located within 0.4 ?m of a predetermined position with respect to the at least one optical element along an x-direction and a y-direction. The lens-based connector assembly further includes a connector element including a recess having an interior surface, The interior surface has at least one connector alignment feature. The glass-based optical substrate is disposed within the recess such that the at least one alignment feature of the glass-based optical substrate engages the at least one connector alignment feature.

Abstract: Multi-fiber interface apparatuses providing a double reflection expanded beam arrangement include one or more substrates being configured to mountably receive a photonic integrated circuit (PIC), a fiber array coupling member mounted to a substrate, optical elements associated with the substrate and/or the fiber array coupling member, and one or more additional features. An additional feature according to certain implementations includes one or more passive substrate alignment features for aligning substrates to promote optical coupling between optical fibers and the PIC. In certain implementations configured for interfacing with printed circuit boards (PCBs), an additional feature includes a recess defined in an optically transmissive substrate in which a PIC is mounted, or includes a recess defined in a PCB into which the PIC is mounted. Various embodiments provide relaxed fiber alignment tolerances with simplified fabrication and system integration capabilities.

Abstract: Disclosed is an optical interconnection device that includes an alignment ferrule assembly formed from an alignment substrate and optical fibers. The optical interconnection device also has an alignment assembly formed by a planar support member with guide features. A receiving region resides between the guide features in which the alignment substrate is secured. An evanescent optical coupler can be formed using the optical interconnection device as a first device and another optical interconnection device as a second device. The second device is constituted by a planar lightwave circuit that operably supports waveguides and an adapter. The adapter of the second device is configured to engage the alignment assembly of the first device to place the optical fibers and the optical waveguides of the respective devices in evanescent optical communication.

Abstract: A silicon carbide flow reactor fluidic module comprises a monolithic closed-porosity silicon carbide body and a tortuous fluid passage extending through the silicon carbide body, the tortuous fluid passage lying within two or more layers with the silicon carbide body, the tortuous passage having an interior surface, the interior surface having a surface roughness of less than 10 ?m Ra. A method of forming the fluidic module is also disclosed.

Abstract: The present disclosure relates to lensed optical fiber connector ferrule end faces having molded contact surfaces. The contact surfaces reduce ferrule end face contact area and thereby reduce the influence of trapped dust and debris on lens angular misalignment.

Abstract: A method of providing and processing an ultrasound capable endoscope assembly that uses an endoscope having a proximal and a distal end, and that has been used previously. The endoscope is cleansed to a level appropriate for re-use within a human body. The method also uses an unused ultrasound assembly, sealed in antiseptic packaging, and which includes a multiple signal pathway connector; an ultrasound transducer head including an ultrasound transducer; and a set of signal pathways, extending from the ultrasound transducer to the multiconductor electrical connector. In the method, the ultrasound assembly is to the endoscope, so that the set of signal pathways extends along the elongate body of the endoscope and the ultrasound transducer head is attached at the distal end. After use, the ultrasound assembly is detached from the endoscope and permanently disposed.