Abstract: A method for assembling an optoelectronic package assembly includes engaging a connector holder with a substrate, the connector holder defining an engagement feature and the substrate including optical waveguides, engaging a connector of a fiber array unit with the engagement feature the connector holder where the engagement feature retains the connector and where the fiber array unit includes the connector and optical fibers coupled to the connector, optically coupling the optical fibers to the optical waveguides of the substrate, heating the connector holder, the fiber array unit, the substrate, and a solder positioned between the substrate and a base substrate, where the heating is sufficient to melt the solder, and cooling the solder to couple the substrate to the base substrate.

Abstract: Waveguide substrates, waveguide substrate assemblies, and methods for fabricating waveguide substrates are disclosed. In one embodiment, a waveguide substrate includes an input edge, an output edge, and at least one waveguide within the waveguide substrate. The waveguide substrate further includes at least one input alignment feature within the input edge adjacent to the input end of the at least one waveguide, wherein the at least one input alignment feature is fabricated from a material of the waveguide substrate. The waveguide substrate may also include at least one output alignment feature within the input edge adjacent to the output end of the at least one waveguide, wherein the at least one output alignment feature is fabricated from the material of the waveguide substrate.

Abstract: Raman analysis systems are partitioned to provide for cost-effective flame resistance and explosion resistance, including relatively small enclosures associated with particular subsystems. One or more of an excitation source, spectrograph and/or controller are disposed in separate, flame-resistant or explosion-resistant enclosures. A remote optical measurement probe may also be disposed in a separate flame-resistant or explosion-resistant enclosure. A grating and a detector of the spectrograph may be disposed in separate enclosures, with sealed windows therebetween to deliver a Raman spectral signal from the optical grating to the detector. The sealed window of the detector enclosure may serve the dual purpose of maintaining flame resistance or explosion resistance while maintaining cooling within the enclosure. Wireless interfaces may be used for communications between the enclosures where practical to reduce or eliminate physical electrical feedthroughs.

Abstract: Waveguide connector assemblies having a clamshell shell housing and methods of assembling a waveguide module assembly are disclosed. In one embodiment, a waveguide module assembly includes a first shell housing, and a second shell housing coupled to the first shell housing. The first shell housing and the second shell housing define a cavity. The waveguide module assembly further includes a waveguide substrate including at least one waveguide, a first surface, and a second surface opposite the first surface. The waveguide substrate is at least partially disposed within the cavity such that at least a portion of the first surface and at least a portion of the second surface are covered by at least one of the first shell housing and the second shell housing.

Abstract: The invention is an automatic rod holder with a frame and two opposed clamping jaws pivotally connected to the frame by parallel axes of rotation such that the clamping jaws exhibit a range of motion between a closed configuration and an open configuration, wherein the closed configuration has a longitudinal opening defined by opposing concave portions of the clamping jaws configured to retain a rod.

Abstract: Optical fiber photonic integrated chip connector interfaces and photonic integrated chip assemblies utilizing low-profile optical fibers and methods thereof are disclosed. In one embodiment, an optical fiber photonic integrated chip (PIC) connector interface includes at least one low-profile optical fiber having an end face, at least one core, and a cladding layer, wherein the end face is non-rotationally symmetric with respect to the at least one core, and the cladding layer includes at least one minimum perimeter point that is a minimum distance from the at least one core as compared to remaining perimeter points of the cladding. The PIC connector interface further includes an interconnect substrate including a fiber mounting surface, and a mechanical coupling surface. The at least one low-profile optical fiber is disposed on the fiber mounting surface such that one or more surfaces of the cladding defining the at least one minimum perimeter point faces away from the fiber mounting surface.

Abstract: Waveguide substrate, waveguide substrate assemblies and methods of fabricating waveguide substrates having various waveguide routing schemes are disclosed. In one embodiment, a waveguide substrate includes a first surface and a second surface, and a plurality of waveguides within the waveguide substrate. The plurality of waveguides defines a plurality of inputs at the first surface. A subset of the plurality of waveguides extends to the second surface to at least partially define a plurality of outputs at the second surface. In one waveguide routing scheme, at least one branching waveguide extends between one of the first surface and the second surface to a surface other than the first surface and the second surface. Another waveguide routing scheme arranges the plurality of waveguides into optical receive-transmit pairs for duplex pairing of optical signals.

Abstract: Ferrule assemblies having a lens array are disclosed. In one embodiment, a ferrule assembly includes a ferrule body and a fiber array ferrule. The ferrule body includes a first end face and a second end face, at least one cavity for receiving one or more optical fibers disposed between the first end face and the second end face, and at least one body alignment feature at an outer surface of the body. The fiber array ferrule includes a first end face and a second end face, an array of alignment holes extending between the first end face and the second end face, and at least one ferrule alignment feature at an outer perimeter of the fiber array ferrule. The second end face of the fiber array ferrule is coupled to the first end face of the body.

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

Abstract: Optical fiber photonic integrated chip connector interfaces and photonic integrated chip assemblies utilizing low-profile optical fibers and methods thereof are disclosed. In one embodiment, an optical fiber photonic integrated chip (PIC) connector interface includes at least one low-profile optical fiber having an end face, at least one core, and a cladding layer, wherein the end face is non-rotationally symmetric with respect to the at least one core, and the cladding layer includes at least one minimum perimeter point that is a minimum distance from the at least one core as compared to remaining perimeter points of the cladding. The PIC connector interface further includes an interconnect substrate including a fiber mounting surface, and a mechanical coupling surface. The at least one low-profile optical fiber is disposed on the fiber mounting surface such that one or more surfaces of the cladding defining the at least one minimum perimeter point faces away from the fiber mounting surface.

Abstract: A passively aligned fan-out apparatus for a multicore fiber (MCF) includes a fan-out assembly that comprises a fan-out substrate, small-clad fibers (SCFs) supported in SCF V-grooves of the fan-out substrate, and alignment rods disposed outboard alignment V-grooves of the fan-out substrate. The SCFs have a distal-end pitch P2D at a distal end of the fan-out substrate greater than the proximal-end pitch P2P of the SCFs at a proximal end of the fan-out substrate. An MCF assembly and/or single mode fiber (SMF) assembly may also be provided as part of the fan-out apparatus.

Abstract: A fiber optic assembly is provided including a support substrate having a substantially flat surface and a signal-fiber array supported on the support substrate. The signal-fiber array includes a plurality of optical fibers. Al least some of the optical fiber of the plurality of optical fibers includes a first datum contact disposed between the optical fiber and an adjacent optical fiber and each of the optical fibers of the plurality of optical fibers includes a second datum contact disposed between each of the optical fibers of the plurality of optical fibers and the support substrate. A first datum surface is disposed at a top surface of each of the plurality of optical fibers opposite the support surface.

Abstract: A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

Abstract: A method for fabrication a multifiber cable assembly is provided. The method includes selecting a plurality of optical fibers that each have a respective cladding diameter, determining a maximum fiber core position error for the plurality of optical fibers in a plurality of configurations, and determining a desired order of the plurality of optical fibers that minimizes the maximum fiber position total error.

Abstract: A fiber optic assembly is provided including a support substrate having a substantially planar surface, a signal-fiber array supported on the planar surface of the support substrate. The signal-fiber array including a plurality of optical fibers and an adhesive disposed on the plurality of optical fibers and the support substrate. Each of the optical fibers is spaced from adjacent optical fibers of the plurality of optical fibers at a precise pitch.

Abstract: Lens-based optical connector assemblies and methods of fabricating the same are disclosed. In one embodiment, a lens-based connector assembly includes a glass-based optical substrate includes at least one optical element within the optical substrate, and at least one alignment feature positioned at an edge of the glass-based optical substrate, wherein the at least one alignment feature is located within 0.4 ?m of a predetermined position with respect to the at least one optical element along an x-direction and a y-direction. The lens-based connector assembly further includes a connector element including a recess having an interior surface, The interior surface has at least one connector alignment feature. The glass-based optical substrate is disposed within the recess such that the at least one alignment feature of the glass-based optical substrate engages the at least one connector alignment feature.

Abstract: Lens-based optical connector assemblies and methods of fabricating the same are disclosed. In one embodiment, a lens-based connector assembly includes a glass-based optical substrate includes at least one optical element within the optical substrate, and at least one alignment feature positioned at an edge of the glass-based optical substrate, wherein the at least one alignment feature is located within 0.4 ?m of a predetermined position with respect to the at least one optical element along an x-direction and a y-direction. The lens-based connector assembly further includes a connector element including a recess having an interior surface, The interior surface has at least one connector alignment feature. The glass-based optical substrate is disposed within the recess such that the at least one alignment feature of the glass-based optical substrate engages the at least one connector alignment feature.

Abstract: Fiber optic connectors and junctions between fiber optic connectors include ferrules terminating a plurality of optical fibers, the ferrules having a ferrule keying portion that rotationally aligns and constrains the ferrules with a guide keying portion of an annular guide tube. The ferrules may further aligned and constrained and aligned in a lateral direction with a ferrule sleeve in the junction of connectors. Each of the ferrule sleeve and the guide keying portion individually constrain movement of the ferrules in different dimensions, the guide keying portion rotationally aligning and constraining the ferrules, while allowing freedom of movement in a lateral direction, and the ferrule sleeve aligning and constraining the ferrules in the lateral direction, while allowing rotational freedom of movement.

Abstract: Lens-based optical connector assemblies and methods of fabricating the same are disclosed. In one embodiment, a lens-based connector assembly includes a glass-based optical substrate includes at least one optical element within the optical substrate, and at least one alignment feature positioned at an edge of the glass-based optical substrate, wherein the at least one alignment feature is located within 0.4 ?m of a predetermined position with respect to the at least one optical element along an x-direction and a y-direction. The lens-based connector assembly further includes a connector element including a recess having an interior surface, The interior surface has at least one connector alignment feature. The glass-based optical substrate is disposed within the recess such that the at least one alignment feature of the glass-based optical substrate engages the at least one connector alignment feature.

Abstract: Ferrule assemblies having a lens array are disclosed. In one embodiment, a ferrule assembly includes a ferrule body and a fiber array ferrule. The ferrule body includes a first end face and a second end face, at least one cavity for receiving one or more optical fibers disposed between the first end face and the second end face, and at least one body alignment feature at an outer surface of the body. The fiber array ferrule includes a first end face and a second end face, an array of alignment holes extending between the first end face and the second end face, and at least one ferrule alignment feature at an outer perimeter of the fiber array ferrule. The second end face of the fiber array ferrule is coupled to the first end face of the body.