Abstract: A system for maintaining relative orientation of optical fibers in an array is provided. Fibers extend parallel and include a first fiber and an adjacent fiber. The system includes a fiber holder with alignment holes configured to receive stripped fiber sections. The alignment holes extend from the first surface to the second surface, and the alignment holes include a first alignment hole configured to receive a stripped fiber section of the first fiber and an adjacent alignment hole configured to receive a stripped fiber section of the adjacent fiber. The fiber holder has a wall separating the first alignment hole and the adjacent alignment hole that permits rotation of the stripped fiber section of the adjacent fiber in the adjacent alignment hole without causing rotation of the stripped fiber section of the first fiber in the first alignment hole.

Abstract: An endoscope add-on assembly adapted to be attached to a target endoscope. The assembly includes an ultrasound imaging sub-assembly, including a communications cable connected to an ultrasound imaging head and an imaging head movement sub-assembly, including a conduit, holding a tension member that is attached to the ultrasound imaging head. Further included are connective elements, adapted to permit the endoscope add-on assembly to be attached to the target endoscope. Finally, the imaging head movement sub-assembly is detachable from the ultrasound imaging sub-assembly, thereby permitting the imaging head movement subassembly to be processed separately from the ultrasound imaging sub-assembly, after use.

Abstract: A silicon carbide flow reactor fluidic module comprises a monolithic closed-porosity silicon carbide body, a tortuous fluid passage extending through the silicon carbide body, the tortuous fluid passage having an interior surface, and one or more thermal control fluid passages also extending through the silicon carbide body, the interior surface having a surface roughness of less than 10 ?m Ra. A process for forming such modules is also disclosed.

Abstract: Devices and methods for providing cooling to electronics equipment is provided herein. A cooling manifold includes a first substrate having a first hole. A layer of nano-particles is disposed between the first substrate and an electronics surface associated with the electronics equipment. The layer of nano-particles defines a seal between the first substrate and the electronics surface, and further defines a channel extending within the seal. After an application of heat, the layer of nano-particles forms the seal such that the device is fluid impermeable, so as to allow a coolant fluid to enter through the first hole to flow through the channel to reduce or remove the heat generated by the electronics equipment associated with the electronics surface.

Abstract: An optical assembly includes stacked first and second planar lightwave circuit (PLC) members each having a plurality of waveguides in respective first and second planes, to provide optical connections between a two-dimensional array and a one-dimensional array of external optical waveguides (e.g., optical fiber cores). Inner faces of first and second PLC members are arranged facing one another and with the first and second planes (corresponding to the pluralities of first and second waveguides, respectively) being non-parallel. An optical assembly may provide optical connections between arrays of cores having a different pitch to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

Abstract: A fiber optic assembly is provided including a support substrate having a substantially flat surface and a signal-fiber array supported on the support substrate. The signal-fiber array includes a plurality of optical fibers. At least some of the optical fiber of the plurality of optical fibers includes a first datum contact disposed between the optical fiber and an adjacent optical fiber and each of the optical fibers of the plurality of optical fibers includes a second datum contact disposed between each of the optical fibers of the plurality of optical fibers and the support substrate. A first datum surface is disposed at a top surface of each of the plurality of optical fibers opposite the support surface.

Abstract: A method for fabrication a multifiber cable assembly is provided. The method includes selecting a plurality of optical fibers that each have a respective cladding diameter, determining a maximum fiber core position error for the plurality of optical fibers in a plurality of configurations, and determining a desired order of the plurality of optical fibers that minimizes the maximum fiber position total error.

Abstract: A method of providing and processing an ultrasound capable endoscope assembly that uses an endoscope having a proximal and a distal end, and that has been used previously. The endoscope is cleansed to a level appropriate for re-use within a human body. The method also uses an unused ultrasound assembly, sealed in antiseptic packaging, and which includes a multiple signal pathway connector; an ultrasound transducer head including an ultrasound transducer; and a set of signal pathways, extending from the ultrasound transducer to the multiconductor electrical connector. In the method, the ultrasound assembly is to the endoscope, so that the set of signal pathways extends along the elongate body of the endoscope and the ultrasound transducer head is attached at the distal end. After use, the ultrasound assembly is detached from the endoscope and permanently disposed.

Abstract: An endoscope add-on assembly adapted to be attached to a target endoscope. The assembly includes an ultrasound imaging sub-assembly, including a communications cable connected to an ultrasound imaging head and an imaging head movement sub-assembly, including a conduit, holding a tension member that is attached to the ultrasound imaging head. Further included are connective elements, adapted to permit the endoscope add-on assembly to be attached to the target endoscope. Finally, the imaging head movement sub-assembly is detachable from the ultrasound imaging sub-assembly, thereby permitting the imaging head movement subassembly to be processed separately from the ultrasound imaging sub-assembly, after use.

Abstract: Fiber optic connectors and junctions between fiber optic connectors include ferrules terminating a plurality of optical fibers, the ferrules having a ferrule keying portion that rotationally aligns and constrains the ferrules with a guide keying portion of an annular guide tube. The ferrules may further aligned and constrained and aligned in a lateral direction with a ferrule sleeve in the junction of connectors. Each of the ferrule sleeve and the guide keying portion individually constrain movement of the ferrules in different dimensions, the guide keying portion rotationally aligning and constraining the ferrules, while allowing freedom of movement in a lateral direction, and the ferrule sleeve aligning and constraining the ferrules in the lateral direction, while allowing rotational freedom of movement.

Abstract: The present disclosure relates to lensed optical fiber connector ferrule end faces having molded contact surfaces. The contact surfaces reduce ferrule end face contact area and thereby reduce the influence of trapped dust and debris on lens angular misalignment.

Abstract: An optical assembly includes stacked planar lightwave circuit (PLC) members each having a plurality of waveguides in a respective plane, to provide optical connections to two-dimensional arrays of external optical waveguides (e.g., optical fiber cores), with one array including non-coplanar groups of waveguides having group members that are alternately arranged in a lateral direction. An optical assembly may provide optical connections between array of cores having a different pitch and/or orientation to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

Abstract: A module and a process for forming a monolithic substantially closed-porosity silicon carbide fluidic module having a tortuous fluid passage extending through the module, the tortuous fluid passage having an interior surface, the interior surface having a surface roughness in the range of from 0.1 to 10 ?m Ra. The process includes positioning a positive fluid passage mold within a volume of silicon carbide powder, the powder coated with a binder; pressing the volume of silicon carbide powder with the mold inside to form a pressed body; heating the pressed body to remove the mold; and sintering the pressed body.

Abstract: A passively aligned fan-out apparatus for a multicore fiber (MCF) includes a fan-out assembly that comprises a fan-out substrate, small-clad fibers (SCFs) supported in SCF V-grooves of the fan-out substrate, and alignment rods disposed outboard alignment V-grooves of the fan-out substrate. The SCFs have a distal-end pitch P2D at a distal end of the fan-out substrate greater than the proximal-end pitch P2P of the SCFs at a proximal end of the fan-out substrate. An MCF assembly and/or single mode fiber (SMF) assembly may also be provided as part of the fan-out apparatus.

Abstract: A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

Abstract: The disclosure relates to methods of fabricating of ceramic structures, and more particularly to methods of fabricating ceramic structures having profiled surfaces and more particularly to methods of fabrication of ceramic mirror blanks. In one embodiment, a method of forming a shaped ceramic article, includes: forming, via one of a cold-pressing process or pressure casting process, a green ceramic article comprising a first surface, an opposing second surface and at least one high aspect ratio feature shaped into at least one surface; heating the green featured ceramic part to form a debound featured ceramic part; and densifying the debound featured ceramic part via one of a pressureless sintering process or a hot-pressing process.

Abstract: Methods of reshaping ferrules used in optical fiber cables assemblies are disclosed. The reshaping methods reduce a core-to-ferrule concentricity error (E), which improves coupling efficiency and optical transmission. The methods include measuring a true center of the ferrule, wherein the true center is based on an outer surface of the ferrule; and reshaping at least a portion of the ferrule to change the true center of the ferrule, wherein the reshaping includes enlarging a portion of the ferrule. A variety of reshaping techniques are also disclosed.

Abstract: An endoscope add-on assembly adapted to be attached to a target endoscope. The assembly includes an ultrasound imaging sub-assembly, including a communications cable connected to an ultrasound imaging head and an imaging head movement sub-assembly, including a conduit, holding a tension member that is attached to the ultrasound imaging head. Further included are connective elements, adapted to permit the endoscope add-on assembly to be attached to the target endoscope. Finally, the imaging head movement sub-assembly is detachable from the ultrasound imaging sub-assembly, thereby permitting the imaging head movement subassembly to be processed separately from the ultrasound imaging sub-assembly, after use.

Abstract: Fiber array spacers, optical fiber assemblies, optical assemblies, and methods for fabricating optical assemblies are disclosed. In one embodiment, an optical fiber assembly includes a fiber array spacer and a fiber ribbon having an array of optical fibers. The fiber array spacer has an array of spacer fibers, wherein individual spacer fibers of the array of spacer fibers are bonded to one another, and a diameter of the individual spacer fibers determines a height of the fiber array spacer. Each optical fiber of the array of optical fibers has an glass portion. The glass portion of each optical fiber is bonded to the fiber array spacer such that a longitudinal axis of the individual spacer fibers is transverse to a longitudinal axis of individual optical fibers of the fiber ribbon.

Abstract: A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.