Patents by Inventor Scott Weber

Scott Weber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12647489
    Abstract: A multitenancy system that includes a host provider, a programmable device, and multiple tenants is provided. The host provider may publish a multitenancy mode sharing and allocation policy that includes a list of terms to which the programmable device and tenants can adhere. The programmable device may include a secure device manager configured to operate in a multitenancy mode to load a tenant persona into a given partial reconfiguration (PR) sandbox region on the programmable device. The secure device manager may be used to enforce spatial isolation between different PR sandbox regions and temporal isolation between successive tenants in one PR sandbox region.
    Type: Grant
    Filed: January 11, 2024
    Date of Patent: June 2, 2026
    Assignee: Intel Corporation
    Inventors: Steffen Schulz, Patrick Koeberl, Alpa Narendra Trivedi, Scott Weber
  • Publication number: 20260133922
    Abstract: A configurable integrated circuit includes a network-on-chip and a response buffer circuit coupled to the network-on-chip. The response buffer circuit includes a direct memory access circuit and a controller circuit. The direct memory access circuit generates read requests and write requests to access memory circuits. The controller circuit provides the read requests and the write requests to the memory circuits through the network-on-chip. The controller circuit exchanges data with the memory circuits for the read requests and the write requests.
    Type: Application
    Filed: November 12, 2024
    Publication date: May 14, 2026
    Applicant: Altera Corporation
    Inventors: Tara Shirvaikar, Scott Weber, Zhi-Hern Loh, Jarrod Blackburn, Ian Hansen
  • Publication number: 20250321922
    Abstract: An integrated circuit includes logic circuits and a network-on-chip in a region of the integrated circuit. The network-on-chip is configurable to transmit at least two of user data, configuration data, and emulation data to the logic circuits. The network-on-chip is configurable to transmit the user data to and from the logic circuits during a user mode of the integrated circuit. The network-on-chip is configurable to transmit the configuration data to the logic circuits for configuring the logic circuits during a configuration mode of the integrated circuit. The network-on-chip is configurable to transmit the emulation data to and from the logic circuits during an emulation mode of the integrated circuit.
    Type: Application
    Filed: June 27, 2025
    Publication date: October 16, 2025
    Applicant: Altera Corporation
    Inventors: Scott Weber, Jun Pin Tan, Rajiv Kumar, Kiun Kiet Jong, Yi Peng, Tara Shirvaikar
  • Publication number: 20250322127
    Abstract: Systems or methods of the present disclosure may provide a compiler that generates a package layout for a multi-die package based on a common specification provided by a Flexible Scaffold Chiplet Interconnect (FlexSCI). The compiler may generate a scaffold interconnect network formed by a subset of interconnects provided by integrated circuits within the multi-die package. The compiler may also identify and/or assign a functionality to nodes of the scaffold interconnect network. The nodes may route data, verify and/or validate, and/or debug dies within the multi-die package. Then, the compiler may identify a position of each die within the scaffold interconnect network. The compiler may instruct a display to display the package layout and/or automatically implement the package layout on a multi-die package via a system design configuration. As such, the systems and methods of the present disclosure may simplify the design process for multi-die packages.
    Type: Application
    Filed: June 26, 2025
    Publication date: October 16, 2025
    Inventors: Farhana Sheikh, Harrison Liew, Scott Weber
  • Publication number: 20250225092
    Abstract: An integrated circuit includes a central region having logic circuits and networks-on-chip. Each of the networks-on-chip traverses the central region. The integrated circuit also includes an interface region having input and output buffer circuits. The networks-on-chip are configurable to exchange data between the logic circuits and the input and output buffer circuits. One of the networks-on-chip is configurable to place each source that receives the data from one of the logic circuits at one of multiple locations in the one of the networks-on-chip. The one of the networks-on-chip is also configurable to place each sink that provides the data to one of the logic circuits at one of the multiple locations in the one of the networks-on-chip. The input and output buffer circuits are coupled to exchange the data with an external device.
    Type: Application
    Filed: March 28, 2025
    Publication date: July 10, 2025
    Applicant: Altera Corporation
    Inventors: Scott Weber, Rajiv Kumar, Tara Shirvaikar, Ilya Ganusov
  • Publication number: 20250215075
    Abstract: Modified T-cells have paratopes against human TK1 epitopes, are made by producing monoclonal antibodies that are specific to TK1, creating chimeric antigen receptors (CARs) by fusion of the single-chain variable fragments (scFv) of the monoclonal antibodies to T-cell signalling domains, and transducing the CARs to the T-cells.
    Type: Application
    Filed: August 30, 2024
    Publication date: July 3, 2025
    Inventors: Kim Leslie O'Neill, Scott Weber
  • Patent number: 12347783
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.
    Type: Grant
    Filed: January 5, 2024
    Date of Patent: July 1, 2025
    Assignee: Intel Corporation
    Inventors: Md Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan, Debendra Mallik, Ram S. Viswanath, Sandeep B. Sane, Sriram Srinivasan, Rajat Agarwal, Aravind Dasu, Scott Weber, Ravi Gutala
  • Patent number: 12346489
    Abstract: An apparatus to facilitate enabling secure state-clean during configuration of partial reconfiguration bitstreams on accelerator devices is disclosed. The apparatus includes a security engine to perform, as part of a PR configuration sequence for a new partial reconfiguration (PR) persona corresponding to a PR bitstream, a first clear operation to clear previously-set persona configuration bits in the region; perform, as part of the PR configuration sequence subsequent to the first clear operation, a set operation to set new persona configuration bits in the region; and perform, as part of the PR configuration sequence, a second clear operation to clear memory blocks of the region that became unfrozen subsequent to the set operation.
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: July 1, 2025
    Assignee: Intel Corporation
    Inventors: Alpa Trivedi, Scott Weber, Steffen Schulz, Patrick Koeberl
  • Patent number: 12326749
    Abstract: A circuit system includes a power control circuit that generates multiple voltage identifiers. Multiple voltage regulator circuits generate multiple supply voltages based on the voltage identifiers. The supply voltages are provided to multiple integrated circuit dies. The power control circuit varies the voltage identifiers based on changes in metrics associated with the integrated circuit dies to cause the voltage regulator circuits to vary the supply voltages. Integrated circuit dies receive supply voltages from voltage regulator circuits through power delivery networks. The integrated circuit dies provide voltage sense signals that indicates the supply voltages. The voltage regulator circuits adjust the supply voltages based on the voltage sense signals to compensate for voltage drops in the power delivery networks.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: June 10, 2025
    Assignee: Altera Corporation
    Inventors: Archanna Srinivasan, Ravi Gutala, Scott Weber, Aravind Dasu, Mahesh Iyer, Eriko Nurvitadhi
  • Patent number: 12265772
    Abstract: Methods and apparatus for extracting a setting of configuration bits to create an exclusion configuration for providing protection against peek and poke attacks in a multi-tenant usage model of a configurable device is provided. The device may host multiple parties that do not trust each other. Peek and poke attacks are orchestrated by tapping (peeking) and driving (poking) wires associated with other parties. Such attacks may be disabled by excluding the settings of configuration bits that would allow these attacks by other parties. This set of configuration bits that should be excluded for preventing all peek and poke attacks creates the exclusion configuration. Methods are described that disable a particular class of peek and/or poke attacks through the use of partial reconfiguration. Methods and apparatus are described to dynamically detect peek and/or poke attacks.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: April 1, 2025
    Assignee: Altera Corporation
    Inventors: Scott Weber, Sean R. Atsatt, David Goldman
  • Patent number: 12253870
    Abstract: A circuit system includes a first voltage regulator circuit that generates a first supply voltage for an integrated circuit die based on a first control signal. The first voltage regulator circuit generates a first feedback signal based on the first supply voltage. The circuit system also includes a second voltage regulator circuit that generates a second supply voltage for an integrated circuit die based on a second control signal. The second voltage regulator circuit generates a second feedback signal based on the second supply voltage. The circuit system also includes a third voltage regulator circuit that generates the first control signal based on the first feedback signal and the second control signal based on the second feedback signal. The circuit system may include fully integrated, on-board, and on-package voltage regulator circuits.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: March 18, 2025
    Assignee: Altera Corporation
    Inventors: Archanna Srinivasan, Ravi Gutala, Scott Weber, Aravind Dasu, Mahesh Iyer, Eriko Nurvitadhi
  • Patent number: 12255648
    Abstract: A circuit system includes a first integrated circuit die having a first group of circuits configured to perform a first set of operations. The circuit system also includes a second integrated circuit die having a second group of circuits configured to start performing a second set of operations with a delay after the first group of circuits starts performing the first set of operations to reduce power supply voltage droop. The operations performed by the first and second groups of circuits can be interleaved with a fixed or a variable delay. Logic circuits can be partitioned into the first and the second groups of circuits based on predicted switching activity of the logic circuits. Decoupling capacitors in integrated circuit dies can be coupled together to reduce droop in a supply voltage during a high current event.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: March 18, 2025
    Assignee: Altera Corporation
    Inventors: Archanna Srinivasan, Ravi Gutala, Scott Weber, Aravind Dasu, Mahesh Iyer, Eriko Nurvitadhi
  • Publication number: 20250061257
    Abstract: A system includes a hard network-on-chip (NOC) and lookup table random access memory (LUTRAM) circuits usable as logic gates in a user design for an integrated circuit and reprogrammable in a user mode of the integrated circuit through the hard NOC. The LUTRAM circuits are reconfigurable during the user mode of the integrated circuit by providing a bit through the hard NOC for storage in the one of the LUTRAM circuits.
    Type: Application
    Filed: November 4, 2024
    Publication date: February 20, 2025
    Applicant: Altera Corporation
    Inventors: Bee Yee Ng, Gaik Ming Chan, Sergey Gribok, Scott Weber
  • Publication number: 20250032613
    Abstract: A novel treatment for Graves' Disease (GD) is disclosed and described. Chimeric autoantigen receptor (CAAR) T cells are engineered using a CAAR construct causing thyroid stimulating hormone receptor (TSHR) epitope expression such that the engineered CAAR T cells serve as bait for autoreactive B cells. The engineered CAAR T cells specifically eliminate the autoreactive B cells, thus eliminating the causative factor for GD. Certain CAAR T cells are further engineered to incorporate bispecific LINK CAR technology to further require the presence of CD19 or BCMA to further increase CAAR T cell targeting specificity to autoreactive B cells and plasma cells.
    Type: Application
    Filed: June 17, 2024
    Publication date: January 30, 2025
    Applicant: Brigham Young University
    Inventors: Scott Weber, Abigail Cheever, Kim O'Neill
  • Patent number: 12175288
    Abstract: Methods and systems for processing requests with load-dependent throttling. The system compares a count of active job requests being currently processed for a user associated with a new job request with an active job cap number for that user. When the count of active job requests being currently processed for that user does not exceed the active job cap number specific to that user, the job request is added to an active job queue for processing. However, when the count of active job requests being currently processed for that user exceeds the active job cap number, the job request is placed on a throttled queue to await later processing when an updated count of active job requests being currently processed for that user is below the active job cap number. Once the count is below the cap, the throttle request is moved to the active job queue for processing.
    Type: Grant
    Filed: October 13, 2023
    Date of Patent: December 24, 2024
    Assignee: Shopify Inc.
    Inventors: Robert Mic, Aline Fatima Manera, Timothy Willard, Nicole Simone, Scott Weber
  • Publication number: 20240337692
    Abstract: A flip-flop circuit includes first and second storage circuits. The flip-flop circuit is configurable to store first values of a data signal in the first storage circuit in response to rising edges of a clock signal and to store second values of the data signal in the second storage circuit in response to falling edges of the clock signal during a double edge triggered mode. The flip-flop circuit is configurable to store third values of the data signal in the first storage circuit and to output the third values from the first storage circuit in response to the clock signal during a single edge triggered mode.
    Type: Application
    Filed: June 18, 2024
    Publication date: October 10, 2024
    Applicant: Intel Corporation
    Inventors: Rajiv Kumar, Amit Agarwal, Steven Hsu, Scott Weber
  • Publication number: 20240314213
    Abstract: A multitenancy system that includes a host provider, a programmable device, and multiple tenants is provided. The host provider may publish a multitenancy mode sharing and allocation policy that includes a list of terms to which the programmable device and tenants can adhere. The programmable device may include a secure device manager configured to operate in a multitenancy mode to load a tenant persona into a given partial reconfiguration (PR) sandbox region on the programmable device. The secure device manager may be used to enforce spatial isolation between different PR sandbox regions and temporal isolation between successive tenants in one PR sandbox region.
    Type: Application
    Filed: January 11, 2024
    Publication date: September 19, 2024
    Inventors: Steffen Schulz, Patrick Koeberl, Alpa Narendra Trivedi, Scott Weber
  • Patent number: 12076378
    Abstract: Modified T-cells have paratopes against human TK1 epitopes, are made by producing monoclonal antibodies that are specific to TK1, creating chimeric antigen receptors (CARs) by fusion of the single-chain variable fragments (scFv) of the monoclonal antibodies to T-cell signalling domains, and transducing the CARs to the T-cells.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: September 3, 2024
    Inventors: Kim Leslie O'Neill, Scott Weber
  • Publication number: 20240186676
    Abstract: An adjustable antenna positioning system feed is disclosed herein. The adjustable antenna positioning system feed includes a feed base, a splash plate assembly, and a feed insert. The feed base is configured to be coupled to a reflector. The splash plate assembly is configured to be removably coupled to the feed base. The adjustable antenna positioning system feed is in a primary arrangement when directly coupled. The feed insert is positioned between the feed base and the splash plate. The adjustable antenna positioning system feed is in a secondary arrangement when the feed insert is coupled with the feed base and the splash plate.
    Type: Application
    Filed: February 12, 2024
    Publication date: June 6, 2024
    Applicant: Antenna Research Associates, Inc.
    Inventors: Keith Ayotte, Sandeep Palreddy, Scott Weber, Tyler McSorley, Nicholas Keith
  • Publication number: 20240145395
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: MD Altaf HOSSAIN, Ankireddy NALAMALPU, Dheeraj SUBBAREDDY, Robert SANKMAN, Ravindranath V. MAHAJAN, Debendra MALLIK, Ram S. VISWANATH, Sandeep B. SANE, Sriram SRINIVASAN, Rajat AGARWAL, Aravind DASU, Scott WEBER, Ravi GUTALA