Patents by Inventor Sean King

Sean King has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12606030
    Abstract: A vehicle system for a vehicle that implements a line lock mode to vehicle wheels for creating a line lock includes a motor, an instrument panel and a controller. The motor provides drive torque to at least one wheel of the vehicle wheels for propelling the vehicle. The vehicle wheels include a left and right rear wheels and left and right front wheels. The instrument panel cluster is configured to display a user interface menu that includes a user selectable line lock mode. The controller initiates a line lock mode based on user selection of the line lock mode. The controller determines whether vehicle conditions are satisfied. The controller applies brakes to the left and right front wheels. The controller disables torque delivery to the left and right front wheels and sends drive torque to the left and right rear wheels.
    Type: Grant
    Filed: November 1, 2023
    Date of Patent: April 21, 2026
    Assignee: FCA US LLC
    Inventors: Paul E. Rodriguez, Jeremy J. Anker, Sean King, Dean Baker, Jon Strunk, Allison Singer, Jason Trombley, David Carr, Haley Lee, Kanishk Bakshi, Mark Platt, Brian Driscoll, Joe Nissen
  • Patent number: 12600193
    Abstract: A vehicle system for an electrified vehicle that implements a race preparation mode for preparing the electrified vehicle for a race event is provided. The vehicle system includes a motor, a battery system, an instrument panel cluster and a controller. The controller initiates the race preparation mode based on user selection of the race preparation mode. The controller determines whether a drag race mode is selected and determines whether a measured temperature of the battery system is below a warm temperature threshold. The temperature of the battery system is elevated based on the measured temperature being below the warm temperature threshold. The controller determines whether a track mode is selected and determines whether a measured temperature of the battery system is above a cold temperature threshold. The temperature of the battery system is reduced based on the measured temperature being above the cold temperature threshold.
    Type: Grant
    Filed: November 1, 2023
    Date of Patent: April 14, 2026
    Assignee: FCA US LLC
    Inventors: Paul E. Rodriguez, Jeremy J. Anker, Sean King, Dean Baker, Jon Strunk, Allison Singer, Jason Trombley, David Carr, Haley Lee, Kanishk Bakshi, Mark Platt, Brian Driscoll, Joe Nissen
  • Patent number: 12558966
    Abstract: A vehicle system and method for a vehicle implements a donut mode to vehicle wheels for creating a donut. A motor provides drive torque to at least one wheel of the vehicle wheels for propelling the vehicle. A steering wheel communicates a steering wheel signal indicative of a direction intended for the vehicle to travel. An instrument panel cluster displays a user interface menu that includes a user selectable donut mode. The controller initiates a donut mode based on user selection of the donut mode. The controller determines whether vehicle conditions are satisfied and enables torque to be delivered from the motor to the left and right rear wheels. Speed differential is enabled between the left and right rear wheels and the left and right front wheels. Based on a direction of the steering wheel, a desired torque input is determined to one of the left and right rear wheels.
    Type: Grant
    Filed: November 1, 2023
    Date of Patent: February 24, 2026
    Assignee: FCA US LLC
    Inventors: Paul E. Rodriguez, Jeremy J. Anker, Sean King, Dean Baker, Jon Strunk, Allison Singer, Jason Trombley, David Carr, Haley Lee, Kanishk Bakshi, Mark Platt, Brian Driscoll, Joe Nissen
  • Publication number: 20250382772
    Abstract: A working machine including: a ground engaging structure having front steerable wheels and rear steerable wheels; a front steering actuator for adjusting the steering angle of each of the front wheels; a rear steering actuator for adjusting the steering angle of each of the rear wheels; an operator steering device configured to provide a steering demand; and, an operator steering mode selector configured to select either a two wheel steer mode or a four wheel steer mode; wherein the front and rear steering actuators are selectively operable in accordance with the steering demand and selected two wheel steer mode or four wheel steer mode, wherein a steering ratio, which is the ratio of steering demand to turning angle of the front wheels and/or rear wheels is different in the two wheel and four wheel steer modes.
    Type: Application
    Filed: June 12, 2025
    Publication date: December 18, 2025
    Inventors: Sean King, Charlie George Small, James Davies
  • Publication number: 20250285917
    Abstract: Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.
    Type: Application
    Filed: April 10, 2025
    Publication date: September 11, 2025
    Inventors: Sean KING, Hui Jae YOO, Sreenivas KOSARAJU, Timothy GLASSMAN
  • Patent number: 12394716
    Abstract: Integrated circuitry interconnect structures comprising a first metal and a graphene cap over a top surface of the first metal. Within the interconnect structure an amount of a second metal, nitrogen, or silicon is greater proximal to an interface of the graphene cap. The presence of the second metal, nitrogen, or silicon may improve adhesion of the graphene to the first metal and/or otherwise improve electromigration resistance of a graphene capped interconnect structure. The second metal, nitrogen, or silicon may be introduced into the first metal during deposition of the first metal, or during a post-deposition treatment of the first metal. The second metal, nitrogen, or silicon may be introduced prior to, or after, capping the first metal with graphene.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: August 19, 2025
    Assignee: Intel Corporation
    Inventors: Carl Naylor, Jasmeet Chawla, Matthew Metz, Sean King, Ramanan Chebiam, Mauro Kobrinsky, Scott Clendenning, Sudarat Lee, Christopher Jezewski, Sunny Chugh, Jeffery Bielefeld
  • Patent number: 12300537
    Abstract: Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.
    Type: Grant
    Filed: April 29, 2024
    Date of Patent: May 13, 2025
    Assignee: Intel Corporation
    Inventors: Sean King, Hui Jae Yoo, Sreenivas Kosaraju, Timothy Glassman
  • Publication number: 20250135906
    Abstract: A vehicle system for a vehicle that implements a line lock mode to vehicle wheels for creating a line lock includes a motor, an instrument panel and a controller. The motor provides drive torque to at least one wheel of the vehicle wheels for propelling the vehicle. The vehicle wheels include a left and right rear wheels and left and right front wheels. The instrument panel cluster is configured to display a user interface menu that includes a user selectable line lock mode. The controller initiates a line lock mode based on user selection of the line lock mode. The controller determines whether vehicle conditions are satisfied. The controller applies brakes to the left and right front wheels. The controller disables torque delivery to the left and right front wheels and sends drive torque to the left and right rear wheels.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 1, 2025
    Inventors: Paul E. Rodriguez, Jeremy J. Anker, Sean King, Dean Baker, Jon Strunk, Allison Singer, Jason Trombley, David Carr, Haley Lee, Kanishk Bakshi, Mark Platt, Brian Driscoll, Joe Nissen
  • Publication number: 20250135903
    Abstract: A vehicle system and method for a vehicle implements a drift mode to vehicle wheels for creating a drift. A motor provides drive torque to at least one wheel of the vehicle wheels for propelling the vehicle. A steering wheel communicates a steering wheel signal indicative of a direction intended for the vehicle to travel. An instrument panel cluster displays a user interface menu that includes a user selectable drift mode. The controller initiates a drift mode based on user selection of the drift mode. The controller determines whether vehicle conditions are satisfied and enables torque to be delivered from the motor to the left and right rear wheels. Speed differential is enabled between the front and rear wheels. Based on a direction of the steering wheel, a desired torque input is determined to one of the left and right rear wheels.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 1, 2025
    Inventors: Paul E. Rodriguez, Jeremy J. Anker, Sean King, Dean Baker, Jon Strunk, Allison Singer, Jason Trombley, David Carr, Haley Lee, Kanishk Bakshi, Mark Platt, Brian Driscoll, Joe Nissen
  • Publication number: 20250135833
    Abstract: A vehicle system for an electrified vehicle that implements a race preparation mode for preparing the electrified vehicle for a race event is provided. The vehicle system includes a motor, a battery system, an instrument panel cluster and a controller. The controller initiates the race preparation mode based on user selection of the race preparation mode. The controller determines whether a drag race mode is selected and determines whether a measured temperature of the battery system is below a warm temperature threshold. The temperature of the battery system is elevated based on the measured temperature being below the warm temperature threshold. The controller determines whether a track mode is selected and determines whether a measured temperature of the battery system is above a cold temperature threshold. The temperature of the battery system is reduced based on the measured temperature being above the cold temperature threshold.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 1, 2025
    Inventors: Paul E. Rodriguez, Jeremy J. Anker, Sean King, Dean Baker, Jon Strunk, Allison Singer, Jason Trombley, David Carr, Haley Lee, Kanishk Bakshi, Mark Platt, Brian Driscoll, Joe Nissen
  • Publication number: 20250136080
    Abstract: A vehicle system for a vehicle that implements a launch control mode to vehicle wheels for creating a launch control includes a motor, an instrument panel and a controller. The motor provides drive torque to at least one wheel of the vehicle wheels for propelling the vehicle. The instrument panel cluster is configured to display a user interface menu that includes a user selectable launch control mode. The controller initiates a launch control mode based on user selection of the launch control mode. The controller determines whether vehicle conditions are satisfied and receives a launch intensity selected at the user interface menu. The controller enables torque to be delivered from the motor to all drive wheels based on the launch intensity. Wheel speeds are monitored and wheel slip is determined. Torque is sent to select wheels based on the determined wheel slip.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 1, 2025
    Inventors: Paul E. Rodriguez, Jeremy J. Anker, Sean King, Dean Baker, Jon Strunk, Allison Singer, Jason Trombley, David Carr, Haley Lee, Kanishk Bakshi, Mark Platt, Brian Driscoll, Joe Nissen
  • Publication number: 20250135902
    Abstract: A vehicle system and method for a vehicle implements a donut mode to vehicle wheels for creating a donut. A motor provides drive torque to at least one wheel of the vehicle wheels for propelling the vehicle. A steering wheel communicates a steering wheel signal indicative of a direction intended for the vehicle to travel. An instrument panel cluster displays a user interface menu that includes a user selectable donut mode. The controller initiates a donut mode based on user selection of the donut mode. The controller determines whether vehicle conditions are satisfied and enables torque to be delivered from the motor to the left and right rear wheels. Speed differential is enabled between the left and right rear wheels and the left and right front wheels. Based on a direction of the steering wheel, a desired torque input is determined to one of the left and right rear wheels.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 1, 2025
    Inventors: Paul E. Rodriguez, Jeremy J. Anker, Sean King, Dean Baker, Jon Strunk, Allison Singer, Jason Trombley, David Carr, Haley Lee, Kanishk Bakshi, Mark Platt, Brian Driscoll, Joe Nissen
  • Publication number: 20240282624
    Abstract: Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.
    Type: Application
    Filed: April 29, 2024
    Publication date: August 22, 2024
    Inventors: Sean KING, Hui Jae YOO, Sreenivas KOSARAJU, Timothy GLASSMAN
  • Patent number: 12040226
    Abstract: Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: July 16, 2024
    Assignee: Intel Corporation
    Inventors: Sean King, Hui Jae Yoo, Sreenivas Kosaraju, Timothy Glassman
  • Publication number: 20230260833
    Abstract: Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.
    Type: Application
    Filed: April 20, 2023
    Publication date: August 17, 2023
    Inventors: Sean KING, Hui Jae YOO, Sreenivas KOSARAJU, Timothy GLASSMAN
  • Patent number: 11670545
    Abstract: Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: June 6, 2023
    Assignee: Intel Corporation
    Inventors: Sean King, Hui Jae Yoo, Sreenivas Kosaraju, Timothy Glassman
  • Patent number: 11587827
    Abstract: Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: February 21, 2023
    Assignee: Intel Corporation
    Inventors: Sean King, Hui Jae Yoo, Sreenivas Kosaraju, Timothy Glassman
  • Publication number: 20220415818
    Abstract: Integrated circuitry interconnect structures comprising a first metal and a graphene cap over a top surface of the first metal. Within the interconnect structure an amount of a second metal, nitrogen, or silicon is greater proximal to an interface of the graphene cap. The presence of the second metal, nitrogen, or silicon may improve adhesion of the graphene to the first metal and/or otherwise improve electromigration resistance of a graphene capped interconnect structure. The second metal, nitrogen, or silicon may be introduced into the first metal during deposition of the first metal, or during a post-deposition treatment of the first metal. The second metal, nitrogen, or silicon may be introduced prior to, or after, capping the first metal with graphene.
    Type: Application
    Filed: June 25, 2021
    Publication date: December 29, 2022
    Applicant: Intel Corporation
    Inventors: Carl Naylor, Jasmeet Chawla, Matthew Metz, Sean King, Ramanan Chebiam, Mauro Kobrinsky, Scott Clendenning, Sudarat Lee, Christopher Jezewski, Sunny Chugh, Jeffery Bielefeld
  • Publication number: 20220344201
    Abstract: Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 27, 2022
    Inventors: Sean KING, Hui Jae YOO, Sreenivas KOSARAJU, Timothy GLASSMAN
  • Publication number: 20220122881
    Abstract: Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.
    Type: Application
    Filed: January 3, 2022
    Publication date: April 21, 2022
    Inventors: Sean KING, Hui Jae YOO, Sreenivas KOSARAJU, Timothy GLASSMAN