Abstract: A module for electrical components is proposed in which connection surfaces that can be bonded are provided on a multi-layer substrate with integrated wiring; a component chip is bonded on the top that has bond pads on its surface pointing upward and that contacts the substrate by means of bonding wires. Here, the wire guide of the bonding wires is so that they are each bonded with a ball on a connection surface and with the wedge directly on one of the bond pads.

Abstract: An electrical multilayer component includes a base body having stacked ceramic dielectric and metallization layers that are formed into component structures among the dielectric layers. Solder contacts are on the underside of the base body. Plated through-holes connect the component structures to the solder contacts. The plated through-holes have at least cross section that widens upward away from the solder contact.

Abstract: An electrical component includes a base body made using ceramic, metallization surfaces that at least partly define component structures on the base body, a passivation layer that is electrically insulating and over a surface of the base body, solder contacts on the passivation layer, and through-hole contacts inside the base body that are electrically connected to corresponding metallization surfaces. The solder contacts are electrically connected to corresponding through-hole contacts through the passivation layer.

Abstract: An electrical multilayer component (1) is suggested which has a main body (5) constructed from stacked dielectric layers. Electrode areas, in which electrodes (10A, 15A) are realized, are arranged at intervals between the dielectric layers. These electrodes (10A, 15A) are contacted in an electrically conductive way by at least two bumps (10, 15) for the electrical contact of the component. A component of this type displays an especially high integration density of passive components and may be mounted especially simply on a substrate using flip chip construction.

Abstract: Electrical component and switching mechanism with the component The invention relates to an electrical component with a sequence of ceramic layers (1, 11, 12) stacked one on top of the other that form a base body with electrode layers (21, 22, 23, 24, 25) arranged between the ceramic layers (1, 11, 12) that form at least one capacitor (32, 33, 34, 35), along with at least one phase gate (41, 42, 43, 44) that is applied to the surface of the base body of its ceramic layer (1, 11, 12), and in which the electrode layers (21, 22, 23, 24, 25) are connected in a electrically conductive manner to contact surfaces (61, 62, 63, 64, 65) by means of through contacts (71, 72, 73, 74, 75) running inside the base body. At the same time, the side surfaces of the base body are free of metal plating. In addition, the invention relates to a switching mechanism with the component. The invention has the advantage that very space-efficient filters can be produced in the “flip chip” style.