Patents by Inventor Seiichi Watanabe

Seiichi Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210114810
    Abstract: A robot system includes a robot control device to link a plurality of transport robots having a function of traveling with a package being loaded. A task acquisition unit acquires a task to be performed. A notification unit notifies the transport robot of action details which are assigned regarding the task. The transport robot takes an action in link with another transport robot according to the notified action details.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 22, 2021
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tomohito MATSUOKA, Nobuyuki TOMATSU, Yasutaka ETOU, Masanobu OHMI, Manabu YAMAMOTO, Seiichi TSUNODA, Keima FUKUNAGA, Takuya WATABE, Makoto KAKUCHI, Kunihiro IWAMOTO, Daisuke SATO, Shunji INOUE, Kenta MIYAHARA, Satoshi OKAMOTO, Jiro GOTO, Terumi UKAI, Tetsuya TAIRA, Daisaku HONDA, Masato ENDO, Takashi HAYASHI, Suguru WATANABE, Yohei TANIGAWA
  • Patent number: 10927442
    Abstract: A nanocrystal production method includes a light irradiation step of applying light to a surface of a metal material immersed in water to form nanocrystals on the surface. In this nanocrystal production method, the metal material contains iron, the nanocrystal contains at least one of iron oxide and iron hydroxide, and in the spectrum of the light, a wavelength at which the intensity is maximum is not less than 360 nm and less than 620 nm.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: February 23, 2021
    Assignees: Showa Denko Materials Co., Ltd., NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY
    Inventors: Shuichiro Adachi, Masaki Kitagawa, Seiichi Watanabe, Lihua Zhang, Noriyuki Okinaka, Dai Takai
  • Publication number: 20210043461
    Abstract: There is provision of a method for etching a substrate above which a first underlying film, a second underlying film positioned deeper than the first underlying film, a silicon oxide film formed on the first and second underlying films, and a mask on the silicon oxide film are provided. In the mask, first and second openings are formed above the first and second underlying films respectively. After the first underlying film is exposed by etching the silicon oxide film using a first gas, the silicon oxide film is etched by using a second gas while depositing deposits on the first underlying film, and the silicon oxide film is etched by using a third gas while removing the deposits on the first underlying film. The etching using the second gas and the etching using the third gas are repeated multiple times.
    Type: Application
    Filed: August 3, 2020
    Publication date: February 11, 2021
    Inventors: Seiichi WATANABE, Hiroki YAMADA, Manabu SATO
  • Publication number: 20200380066
    Abstract: The present invention is a data processing apparatus including a data input/output device for receiving data, a storage for storing the data received by the data input/output device, a data processing program storage for storing a data processing program that includes the steps of calculating, using a double exponential smoothing method, a first predicted value that is a predicted value of smoothed data and a second predicted value that is a predicted value of the gradient of the smoothed data, and calculating, using a double exponential smoothing method in which the second predicted value is set as input data, a third predicted value that is a predicted value of smoothed data and a fourth predicted value that is a predicted value of the gradient of the smoothed data, and a data calculation processing apparatus for performing the data processing under the data processing program.
    Type: Application
    Filed: August 18, 2020
    Publication date: December 3, 2020
    Applicant: HITACHI HIGH-TECH CORPORATION
    Inventors: Seiichi Watanabe, Satomi Inoue, Shigeru Nakamoto, Kousuke Fukuchi
  • Patent number: 10783220
    Abstract: The present invention is a data processing apparatus including a data input/output device for receiving data, a storage for storing the data received by the data input/output device, a data processing program storage for storing a data processing program that includes the steps of calculating, using a double exponential smoothing method, a first predicted value that is a predicted value of smoothed data and a second predicted value that is a predicted value of the gradient of the smoothed data, and calculating, using a double exponential smoothing method in which the second predicted value is set as input data, a third predicted value that is a predicted value of smoothed data and a fourth predicted value that is a predicted value of the gradient of the smoothed data, and a data calculation processing apparatus for performing the data processing under the data processing program.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: September 22, 2020
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Seiichi Watanabe, Satomi Inoue, Shigeru Nakamoto, Kousuke Fukuchi
  • Publication number: 20200203133
    Abstract: According to an embodiment of the present invention, a plasma processing apparatus includes: a processing chamber in which plasma processing is performed to a sample; a radio frequency power source that supplies radio frequency power for generating plasma in the processing chamber; and a data processing apparatus that performs processing to light emission data of the plasma. The data processing apparatus performs the processing to the light emission by using an adaptive double exponential smoothing method for varying a smoothing parameter based on an error between input data and a predicted value of smoothed data. A response coefficient of the smoothing parameter is derived by a probability density function including the error as a parameter.
    Type: Application
    Filed: February 27, 2020
    Publication date: June 25, 2020
    Inventors: Seiichi WATANABE, Satomi INOUE, Shigeru NAKAMOTO, Kousuke FUKUCHI
  • Patent number: 10615010
    Abstract: According to an embodiment of the present invention, a plasma processing apparatus includes: a processing chamber in which plasma processing is performed to a sample; a radio frequency power source that supplies radio frequency power for generating plasma in the processing chamber; and a data processing apparatus that performs processing to light emission data of the plasma. The data processing apparatus performs the processing to the light emission by using an adaptive double exponential smoothing method for varying a smoothing parameter based on an error between input data and a predicted value of smoothed data. A response coefficient of the smoothing parameter is derived by a probability density function including the error as a parameter.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: April 7, 2020
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Seiichi Watanabe, Satomi Inoue, Shigeru Nakamoto, Kousuke Fukuchi
  • Patent number: 10446453
    Abstract: A method is disclosed for monitoring and controlling a process of plasma-assisted surface modification of a layer formed on a substrate. The method includes flowing a surface modification gas into a plasma processing chamber of a plasma processing system, igniting a plasma in the plasma processing chamber to initiate a surface modification process for a layer formed on a substrate, and acquiring optical emission spectra from an optical emission spectroscopy system attached to the plasma processing chamber, during the surface modification process for the layer. For one embodiment, the method includes altering at least one parameter of the surface modification process based on the acquired optical emission spectra. For one embodiment, the acquired optical emission spectra can include an intensity of a spectral line, a slope of a spectral line, or both to enable endpoint control of the surface modification process. Additional methods and related systems are also disclosed.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: October 15, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Brian J. Coppa, Viswas Purohit, Seiichi Watanabe, Kenji Komatsu
  • Patent number: 10401715
    Abstract: The invention provides a dome cover, a camera device, an injection molding die, and an injection molding method in which generation of a weldline is suppressed and deterioration of an acquired image is suppressed. In one aspect of the invention, a dome cover is a dome cover that covers a camera. The dome cover includes a curved section having a curved shape and a skirt section having a cylinder shape and has a top section at the curved section and an opening end section at the skirt section. The thickness of the dome cover is largest at the top section and smallest at the opening end section, and continuously decreases from the top section toward the opening end section. The inner diameter and the outer diameter of the dome cover continuously increase from the top section toward the opening end section.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: September 3, 2019
    Assignee: FUJIFILM Corporation
    Inventor: Seiichi Watanabe
  • Publication number: 20190249288
    Abstract: A nanocrystal production method includes a light irradiation step of applying light to a surface of a metal material immersed in water to form nanocrystals on the surface. In this nanocrystal production method, the metal material contains iron, the nanocrystal contains at least one of iron oxide and iron hydroxide, and in the spectrum of the light, a wavelength at which the intensity is maximum is not less than 360 nm and less than 620 nm.
    Type: Application
    Filed: August 25, 2017
    Publication date: August 15, 2019
    Inventors: Shuichiro ADACHI, Masaki KITAGAWA, Seiichi WATANABE, Lihua ZHANG, Noriyuki OKINAKA, Dai TAKAI
  • Publication number: 20190202692
    Abstract: A hydrogen gas production method includes a light irradiation step of applying light to a surface of a metal material immersed in water to produce gas containing hydrogen. In this hydrogen gas production method, the metal material contains iron, in the spectrum of the light, a wavelength at which the intensity is maximum is not less than 360 nm and less than 620 nm, and as the gas is produced, at least one of iron oxide and iron hydroxide is formed on the surface.
    Type: Application
    Filed: August 25, 2017
    Publication date: July 4, 2019
    Inventors: Shuichiro ADACHI, Masaki KITAGAWA, Seiichi WATANABE, Lihua ZHANG, Noriyuki OKINAKA
  • Patent number: 10221435
    Abstract: This invention relates to DNA encoding a novel enzyme having activity of synthesizing D-serine from formaldehyde and glycine, recombinant DNA constructed by integrating such DNA into a vector, a transformant transformed with the recombinant DNA, and a method for producing D-serine from formaldehyde and glycine with the use of the enzyme.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: March 5, 2019
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Tadashi Araki, Tomonori Hidesaki, Seiichi Watanabe, Keita Nishida, Kiyoteru Nagahara, Mitsuo Koito
  • Publication number: 20190047049
    Abstract: An object of the invention is to provide: an alloy article that has excellent homogeneity in the alloy composition and microstructure as well as significant shape controllability, using an HEA with significant mechanical strength and high corrosion resistance; a method for manufacturing the alloy article; and a product using the alloy article. There is provided an alloy article comprising: Co, Cr, Fe, Ni, and Ti elements, each element in content of 5 to 35 atomic %; more than 0 atomic % to 8 atomic % of Mo %; and remainder substances of unavoidable impurities. And, ultrafine particles with an average diameter of 40 nm or less are dispersedly precipitated in matrix phase crystals of the alloy article.
    Type: Application
    Filed: October 25, 2016
    Publication date: February 14, 2019
    Applicant: HITACHI METALS, LTD.
    Inventors: Tadashi FUJIEDA, Mamoru HIROTA, Kosuke KUWABARA, Kinya AOTA, Takahiko KATO, Akihiko CHIBA, Yuichiro KOIZUMI, Kenta YAMANAKA, Seiichi WATANABE
  • Publication number: 20180341625
    Abstract: The present invention is a data processing apparatus including a data input/output device for receiving data, a storage for storing the data received by the data input/output device, a data processing program storage for storing a data processing program that includes the steps of calculating, using a double exponential smoothing method, a first predicted value that is a predicted value of smoothed data and a second predicted value that is a predicted value of the gradient of the smoothed data, and calculating, using a double exponential smoothing method in which the second predicted value is set as input data, a third predicted value that is a predicted value of smoothed data and a fourth predicted value that is a predicted value of the gradient of the smoothed data, and a data calculation processing apparatus for performing the data processing under the data processing program.
    Type: Application
    Filed: August 2, 2018
    Publication date: November 29, 2018
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Seiichi Watanabe, Satomi Inoue, Shigeru Nakamoto, Kousuke Fukuchi
  • Patent number: 10073818
    Abstract: The present invention is a data processing apparatus including a data input/output device for receiving data, a storage for storing the data received by the data input/output device, a data processing program storage for storing a data processing program that includes the steps of calculating, using a double exponential smoothing method, a first predicted value that is a predicted value of smoothed data and a second predicted value that is a predicted value of the gradient of the smoothed data, and calculating, using a double exponential smoothing method in which the second predicted value is set as input data, a third predicted value that is a predicted value of smoothed data and a fourth predicted value that is a predicted value of the gradient of the smoothed data, and a data calculation processing apparatus for performing the data processing under the data processing program.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: September 11, 2018
    Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Seiichi Watanabe, Satomi Inoue, Shigeru Nakamoto, Kousuke Fukuchi
  • Patent number: D856398
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: August 13, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Hidekane Ito, Seiichi Watanabe, Atsushi Misawa, Kazumi Koike
  • Patent number: D857782
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: August 27, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Hidekane Ito, Seiichi Watanabe
  • Patent number: D863303
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: October 15, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Seiichi Watanabe, Yasuyuki Tanaka
  • Patent number: D863304
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: October 15, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Seiichi Watanabe, Yasuyuki Tanaka
  • Patent number: D909469
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: February 2, 2021
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Seiichi Watanabe, Ryota Minami