Abstract: An adsorption heat pump is provided in which water vapor can be efficiently adsorbed and desorbed using a heat source having a lower temperature than ones heretofore in use because the pump employs an adsorbent which has a large difference in water adsorption amount in adsorption/desorption and can be regenerated (release the adsorbate) at a low temperature. The invention provides an adsorption heat pump which comprises an adsorbate, an adsorption/desorption part having an adsorbent for adsorbate adsorption/desorption, a vaporization part for adsorbate vaporization which has been connected to the adsorption/desorption part, and a condensation part for adsorbate condensation which has been connected to the adsorption/desorption part, wherein the adsorbent, when examined at 25° C., gives a water vapor adsorption isotherm which, in the relative vapor pressure range of from 0.05 to 0.30, has a relative vapor pressure region in which a change in relative vapor pressure of 0.

Abstract: A counter-stream-mode oscillating-flow heat transport apparatus improves heat transport capability by imparting oscillatory displacement to a fluid located near a heat-generating element such that the fluid is directed toward the heat-generating element. Turning portions of serpentine flow paths are disposed to face the heat-generating element. The flow paths are stacked in multiple layers in the direction from the heat-generating element to the flow paths, and a plurality of flow paths are disposed adjacent to the heat-generating element in the direction of fluid oscillation.

Abstract: An exhaust heat recovery device includes an evaporator for evaporating working medium sealed thereinto by exhaust heat from an internal combustion engine, a condenser for cooling the working medium evaporated at the evaporator, and a communication portion for communicating the evaporator with the condenser in an annular shape. The exhaust heat recovery device further includes an internal pressure operating valve adapted to be closed when a pressure of the working medium is equal to or more than a predetermined pressure, and a temperature operating valve adapted to be closed when a temperature of the coolant is equal to or more than a predetermined temperature. The internal pressure operating valve and the temperature operating valve are disposed between a downstream side of the condenser and an upstream side of the evaporator.

Abstract: A cooling device for cooling an electronic component (semiconductor module) includes a cooling tube adapted to be disposed in contact with the electronic component and having an internal coolant flow channel for the passage therethrough of a cooling medium, and a high-pressure tube disposed adjacent to a surface of the cooling tube that faces away from the electronic component, the high-pressure tube having a hollow interior that can be filled with a high-pressure fluid having a pressure higher than that of the cooling medium. An electric power conversion device comprised of a plurality of semiconductor modules and the cooling device as means for cooling the semiconductor modules is also disclosed.

Abstract: An exhaust heat recovery apparatus includes an evaporation unit, a condensation unit, an evaporation-side communication part and a condensation-side communication part. The evaporation unit is disposed in an exhaust gas passage through which an exhaust gas flows and performs heat exchange between the exhaust gas and an operation fluid flowing therein, thereby evaporating the operation fluid. The condensation unit is disposed in a coolant passage through which an engine coolant flows and performs heat exchange between the operation fluid and the engine coolant, thereby condensing the operation fluid. The evaporation-side communication part connects the evaporation unit and the condensation unit for introducing evaporated operation fluid to the condensation unit. The condensation-side communication part connects the condensation unit and the evaporation unit for introducing condensed operation fluid to the evaporation unit. The condensation-side communication part is provided with a throttle part.

Abstract: A waste heat recovery system having a heat pipe provided with a heat switch function limiting an amount of heat transported to a condenser in accordance with the increase in the amount of heating of the evaporator, having the evaporator arranged at an exhaust pipe for carrying exhaust gas of the internal combustion engine, and having the condenser arranged in a cooling water passage for carrying cooling water of the internal combustion engine and using the heat pipe to transport waste heat of exhaust gas to cooling water, characterized in that an insulating part formed between the evaporator and condenser is provided with a wall part for preventing heat transmission from an external fluid.

Abstract: An adsorption module has heat medium pipes through which a fluid flows, a porous heat transferring member, and adsorbent. The porous heat transferring member is a sintered body formed by sintering a metallic material that is in a form of one of powders, particles and fibers, and has pores for allowing an adsorbed medium to pass through. The porous heat transferring member is disposed on peripheries of the heat medium pipes and bonded to outer surfaces of the heat medium pipes by sintering. The adsorbent is disposed in the pores. The porous heat transferring member further has an adsorbed medium passage for allowing the adsorbed medium to pass through. The adsorbed medium passage is located between the heat medium pipes, and extends straight and parallel to axes of the heat medium pipes.

Abstract: An adsorption type heat exchanger includes a heat exchange part, in which a thermal medium circulates, and adsorbents made of particles. The adsorbents are fixed on an outer surface of the heat exchange part, to adsorb refrigerant vapor when a temperature of the thermal medium is low, and to desorb the adsorbed refrigerant vapor when the temperature of the thermal medium is high. In addition, percents of the adsorbents having particle sizes about in a range from 0 to 42 ?m are about 90% and over of the whole adsorbents.

Abstract: An exhaust heat recovery device able to secure heat exchange performance even when tilted, provided with an evaporator exchanging heat between an exhaust gas and an evaporable and condensable working fluid sealed inside it and thereby evaporating the working fluid and a condenser exchanging heat between the working fluid evaporated by the evaporator and the cooling water and thereby condensing the working fluid, wherein the evaporator and condenser are arranged in a closed loop channel through which the working fluid circulates, the evaporator and condenser are arranged adjoining each other in the substantially horizontal direction, the evaporator is provided with a plurality of evaporation side heat pipes arranged in parallel and is provided with a first evaporation side header communicating one ends of the plurality of evaporation side heat pipe and a second evaporation side header communicating the other ends, and, when mounted in a vehicle in a horizontal state, the second evaporation side header arranged

Abstract: A loop type heat pipe includes an evaporator located to evaporate a refrigerant by heat-exchanging with a first fluid as a heat source, and a condenser located to liquefy and condense the evaporated vapor refrigerant by heat-exchanging with a second fluid to be heated. The condenser has a refrigerant condensation side on which the condensed liquid refrigerant flows, and a refrigerant un-condensation side on which the vapor refrigerant before being condensed flows. In addition, the loop type heat pipe is provided with a flow limitation portion for flowing the second fluid from the refrigerant condensation side toward the refrigerant un-condensation side. For example, the loop type heat pipe is suitably used for a waste heat recovery device.

Abstract: A waste heat recovery device includes a heat pipe in which a working fluid for transporting heat is enclosed, and a mode-switching valve for switching a heat recovery mode and a heat insulation mode. The heat pipe has a heating part for heating and evaporating the working fluid and a cooling part for cooling and condensing the evaporated working fluid. The heating part is made of a steel through which hydrogen gas permeates about at 500° C. and higher. In the heat recovery mode, the waste heat recovery device recovers heat of exhaust gas by using the heat pipe. Furthermore, in the heat insulation mode, a heat transport from the heating part to the cooling part is stopped.

Abstract: A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

Abstract: A semiconductor device includes a cooling unit in which coolant flows, a semiconductor chip having two main surfaces press-pinched by the cooling unit, and an electronic member different from the semiconductor chip. The electronic member is located to contact the cooling unit.

Abstract: A waste heat collecting apparatus has a loop-type heat pipe, which has a vaporizing portion arranged in an area for exhaust gas passage and a condensing portion provided in a water tank, through which coolant foran engine flows. Working fluid is circulated from the vaporizing portion to the condensing portion and back to the vaporizing portion. A valve device is provided at a downstream side of the condensing portion, wherein the valve device is operated to open or close a fluid passage for the working fluid depending on an inner pressure of the heat pipe.

Abstract: A heat exchanger having an adsorbing core is advantageously applied to a refrigerating system mounted on an automotive vehicle. The adsorbing core absorbs heat from coolant and gives heat to the coolant thereby to perform heat-exchanging operation. The adsorbing core is composed of a heat exchanging member such as tubes or fins of the heat exchanger and a attracting layer connected to the surface of the heat exchanging member. A seed crystal retaining layer is firmly connected to the surface of the heat exchanging member, and the attractant crystals forming the attractant layer are grown on the seed crystals by a hydrothermal crystal growth method. Since the attracting layer is uniformly formed and firmly connected to the surface of the heat exchanging member, heat is quickly transferred between the attractant layer and the heat exchanging member.

Abstract: In an image communication system for compositing and generating an image for enhancing the communication, a composite image generator in a communication terminal analyzes voice data and image data, and an analyzer analyzes voice data to detect an emotion parameter. Basic emotion data are generated by a movement controller, an emotion movement pattern storage and a basic emotion generator, based on the emotion parameter. An expression compositor composites the basic emotion data with expression data, extracted from image data, to generate composite expression data. An image compositor composites the composite expression data with character data to generate a composite character image.

Abstract: A counter-stream-mode oscillating-flow heat transport apparatus improves heat transport capability by imparting oscillatory displacement to a fluid located near a heat-generating element such that the fluid is directed toward the heat-generating element. Turning portions of serpentine flow paths are disposed to face the heat-generating element. The flow paths are stacked in multiple layers in the direction from the heat-generating element to the flow paths, and a plurality of flow paths are disposed adjacent to the heat-generating element in the direction of fluid oscillation.

Abstract: A heat pipe able to switch between operation and suspension of heat transport when used for a bottom heat type and able to prevent the condensed working medium from dropping to the evaporator side and a waste heat recovery system using the same are provided. A heat pipe having an evaporator set at one end of a tubular closed container and using heat of an outside high temperature part to cause the inside working medium to evaporate and a condenser set at the other end side of the closed container and radiating heat to an outside low temperature part to cause the evaporated working medium to condense, wherein the evaporator is arranged below the condenser and has a holding means holding the liquefied working medium condensed by the condenser along with an increase in the amount of heat received by the evaporator to prevent return to the evaporator.

Abstract: A semiconductor device includes a cooling unit in which coolant flows, a semiconductor chip having two main surfaces press-pinched by the cooling unit, and an electronic member different from the semiconductor chip. The electronic member is located to contact the cooling unit.

Abstract: A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.