Abstract: A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

Abstract: The central position of each heating body 1 in the fluid flow direction is referred to as a heating body central position, the central position of a heat radiating section 33a located between the neighboring heating bodies 1 in the fluid flow direction is referred to as a heat radiating section central position, the end of a heat radiating section 33b connected to a pump 6 on the opposite side of a heat absorbing section is referred to as a heat radiating section front, the distances along the fluid flow from the heating body central position to the heat radiating section central position are referred to as heat transport distances and the distances from the heating body central position to the heat radiating section front are referred to as heat transport distances. S>=the maximum heat transport distance Lmax holds. Lmax is the longest of the heat transport distances.

Abstract: A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

Abstract: A watercraft has an engine that is controlled to reduce the likelihood of engine damage and rider discomfort when the watercraft engine speed is rapidly increased due to a lack of load on the propulsion unit. The engine is controlled by a method that detects engine speed and reduces the power output of the engine by varying degrees or restores the power output of the engine by varying degrees depending on the speed of the engine relative to plural predetermine speeds.

Abstract: The central position of each heating body 1 in the fluid flow direction is referred to as a heating body central position, the central position of a heat radiating section 33a located between the neighboring heating bodies 1 in the fluid flow direction is referred to as a heat radiating section central position, the end of a heat radiating section 33b connected to a pump 6 on the opposite side of a heat absorbing section is referred to as a heat radiating section front, the distances along the fluid flow from the heating body central position to the heat radiating section central position are referred to as heat transport distances and the distances from the heating body central position to the heat radiating section front are referred to as heat transport distances. S>=the maximum heat transport distance Lmax holds. Lmax is the longest of the heat transport distances.

Abstract: A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

Abstract: A counter-stream-mode oscillating-flow heat transport apparatus accommodates a change in volume of a liquid while preventing reduction in heat transport capability. A flow path and a buffer tank are placed in communication with each other via a throttle such as a capillary tube. This prevents a channel connecting the flow path and the buffer tank from having an excessively reduced channel resistance (flow path resistance). This prevents the fluid in a heat transport device assembly (the flow path) from only going back and forth between the heat transport device assembly and the buffer tank without experiencing liquid (pressure) oscillations in the heat transport device assembly. Accordingly, the liquid in the heat transport device assembly is prevented from being reduced in amplitude of oscillation, thereby preventing degradation in heat transport capability of the counter-stream-mode oscillating-flow heat transport apparatus.

Abstract: A watercraft has an engine that is controlled to reduce the likelihood of engine damage and rider discomfort when the watercraft engine speed is rapidly increased due to a lack of load on the propulsion unit. The engine is controlled by a method that detects engine speed and reduces the power output of the engine by varying degrees or restores the power output of the engine by varying degrees depending on the speed of the engine relative to plural predetermine speeds.

Abstract: The fluid drive unit includes a cylinder communicating with both end portions of a meandering passage formed in the heat transport device. In the cylinder, the piston is slidably arranged being capable of sliding in the axial direction. Fluid is charged in the spaces, which are provided on both sides of the piston, connected to the meandering passage. The solenoid coil, which is provided in the periphery of the side of the cylinder, periodically inverts the magnetic poles and reciprocates the piston in the cylinder. To drive the piston smoothly and reduce the amount of eccentricity, a pair of sliding members are provided at the end portions of the piston. When the fluid in the passage is vibrated by the movement of the piston, the apparent heat conductivity of the heat transport device is enhanced, and heat is quickly diffused from the heating body to the radiating portion.

Abstract: A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

Abstract: An adsorption heat pump is provided in which water vapor can be efficiently adsorbed and desorbed using a heat source having a lower temperature than ones heretofore in use because the pump employs an adsorbent which has a large difference in water adsorption amount in adsorption/desorption and can be regenerated (release the adsorbate) at a low temperature.

Abstract: A counter-stream-mode oscillating-flow heat transport apparatus improves heat transport capability by imparting oscillatory displacement to a fluid located near a heat-generating element such that the fluid is directed toward the heat-generating element. Turning portions of serpentine flow paths are disposed to face the heat-generating element. The flow paths are stacked in multiple layers in the direction from the heat-generating element to the flow paths, and a plurality of flow paths are disposed adjacent to the heat-generating element in the direction of fluid oscillation.

Abstract: An apparatus achieving an efficient air-conditioning without disturbing convection in a room having a heating device inside.

Abstract: A boiler incidental facility includes at least one jet nozzle, equipped in an air supply duct or an air exhaust duct connected with a furnace. During operation, steam is heated and supplied to the jet nozzle and spurted in a direction in alignment with an air flow in an air supply duct or in an air exhaust duct. Reactive and meditative chemicals may be injected into the air flow either through the net nozzles or adjacent to the net nozzles.

Abstract: In an adsorption-type refrigerating apparatus, an adsorber includes therein an adsorbent having a temperature-dependent characteristic in which an amount adsorbed in an adsorption step is larger than an amount adsorbed in a desorption step, even when a vapor pressure rate in the adsorption step is equal to or lower than a vapor pressure rate in the desorption step. Therefore, even when the cooling temperature of outside air for cooling the adsorbent increases, a sufficient cooling capacity can be obtained. In addition, a difference between the amount adsorbed in the adsorption step and the amount adsorbed in the desorption step can be made larger.

Abstract: A molded product which has a high strength and which is excellent in surface smoothness and freezing damage resistance. It comprises a fiber-reinforced cement molded OK product which has a bulk specific gravity of from 0.9 to 1.2, and which comprises, by mass, from 2 to 15% of hollow particles, from 1 to 40% of an inorganic admixture having pores which are open to the surface, from 5 to 70% in total of cement and/or lime, from 0 to 50% of slag, from 0 to 50% of gypsum, from 20 to 60% of a quartzite powder, from 0 to 20% of micro silica, from 0 to 30% of an inorganic aggregate other than the above components and from 2 to 30% of cellulose fibers.

Abstract: A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

Abstract: In an adsorption-type refrigerating apparatus, an adsorber includes therein an adsorbent having a temperature-dependent characteristic in which an amount adsorbed in an adsorption step is larger than an amount adsorbed in a desorption step, even when a vapor pressure rate in the adsorption step is equal to or lower than a vapor pressure rate in the desorption step. Therefore, even when the cooling temperature of outside air for cooling the adsorbent increases, a sufficient cooling capacity can be obtained. In addition, a difference between the amount adsorbed in the adsorption step and the amount adsorbed in the desorption step can be made larger.

Abstract: An apparatus for controlling a refrigeration cycle for circulating a refrigerant through a compressor 2, a heat exchanger for condensation 4, a flow rate control valve 5, and a heat exchanger for evaporation 6, connected each other, comprising: a first operation means for changing a heat exchanging capability of said heat exchanger for condensation 4, a second operation means for changing a heat exchanging capability of said heat exchanger for evaporation 6, a means for operating a running capacity for changing a running capacity of said compressor, and a control means for reducing a difference between a running condition on a high pressure side or a low pressure side of said refrigeration cycle and a target, wherein when a difference between a running condition on a high or low pressure side and its target is reduced, the control means 15 bring the running condition closer to the target, minimizes a consumption energy, and bring a temperature difference of a heat exchanging fluid between an inlet and an outl

Abstract: A boiler incidental facility includes at least one jet nozzle, equipped in an air supply duct or an air exhaust duct connected with a furnace. During operation, steam is heated and supplied to the jet nozzle and spurted in a direction in alignment with an air flow in an air supply duct or in an air exhaust duct. Reactive and meditative chemicals may be injected into the air flow either through the net nozzles or adjacent to the net nozzles.