Patents by Inventor Seiki Sakuyama

Seiki Sakuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11114418
    Abstract: An electronic device includes: a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components; and a second layer that is stacked over the first layer and includes second electronic components which are coupled to the first electronic components and a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: September 7, 2021
    Assignee: FUJITSU LIMITED
    Inventors: Taiki Uemura, Taiji Sakai, Seiki Sakuyama
  • Patent number: 11057996
    Abstract: A circuit board includes: a first substrate including a first through hole, a first metal layer formed over an inner wall of the first through hole, and a first conductive composite resin provided on an inner side of the first metal layer of the first through hole; and a second substrate stacked together with the first substrate and including a second through hole that faces the first through hole and has a first open end which is provided on a side of the first through hole and is located on the inner side of the first metal layer, and a second conductive composite resin that is provided in the second through hole and is coupled to the first conductive composite resin.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: July 6, 2021
    Assignee: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
    Inventors: Toshiki Iwai, Daisuke Mizutani, Seiki Sakuyama, Taiji Sakai
  • Publication number: 20190289715
    Abstract: A circuit board includes: a first substrate including a first through hole, a first metal layer formed over an inner wall of the first through hole, and a first conductive composite resin provided on an inner side of the first metal layer of the first through hole; and a second substrate stacked together with the first substrate and including a second through hole that faces the first through hole and has a first open end which is provided on a side of the first through hole and is located on the inner side of the first metal layer, and a second conductive composite resin that is provided in the second through hole and is coupled to the first conductive composite resin.
    Type: Application
    Filed: June 4, 2019
    Publication date: September 19, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Toshiki Iwai, Daisuke Mizutani, Seiki Sakuyama, Taiji Sakai
  • Publication number: 20190252357
    Abstract: An electronic device includes: a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components; and a second layer that is stacked over the first layer and includes second electronic components which are coupled to the first electronic components and a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Taiki Uemura, Taiji Sakai, Seiki Sakuyama
  • Patent number: 10283434
    Abstract: An electronic device includes: a first circuit board; a second circuit board located above a first region of the first circuit board; a first semiconductor element located above a second region of the first circuit board, which is different from the first region, and above a third region of the second circuit board; a first connection interposed between the first semiconductor element and the second region so as to electrically interconnect the first semiconductor element and the first circuit board; and a second connection interposed between the first semiconductor element and the third region so as to electrically interconnect the first semiconductor element and the second circuit board.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: May 7, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Taiji Sakai, Seiki Sakuyama, Nobuhiro Imaizumi, Aki Dote
  • Patent number: 10167537
    Abstract: An electronic apparatus includes: a first electronic component including a first electrode; solder on the first electrode; and a phase containing In, Ag, and Cu, the phase being dispersed and included in the solder. And a method for manufacturing an electronic apparatus, the method includes: forming solder on a first electrode of a first component, the solder including a phase containing In, Ag, and Cu, the phase being dispersed in the solder.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: January 1, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Taiki Uemura, Kozo Shimizu, Seiki Sakuyama
  • Patent number: 10062658
    Abstract: A surface of at least one of a connection terminal of an electronic component and a connection terminal of a circuit board is covered with a protection layer made of a AgSn alloy. The connection terminal of the electronic component is soldered to the connection terminal of the circuit board.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: August 28, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Seiki Sakuyama, Toshiya Akamatsu, Nobuhiro Imaizumi, Keisuke Uenishi, Kenichi Yasaka, Toru Sakai
  • Patent number: 10056342
    Abstract: A surface of at least one of a connection terminal of an electronic component and a connection terminal of a circuit board is covered with a protection layer made of a AgSn alloy. The connection terminal of the electronic component is soldered to the connection terminal of the circuit board.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: August 21, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Seiki Sakuyama, Toshiya Akamatsu, Nobuhiro Imaizumi, Keisuke Uenishi, Kenichi Yasaka, Toru Sakai
  • Patent number: 9831210
    Abstract: An electronic device includes an electrode including Cu, a solder including Sn and provided above the electrode, and a joining layer including In and Ag and provided along a boundary between the electrode and the solder. The joining layer including In and Ag prevents Cu—Sn alloy, such as Cu6Sn5, from being formed at the boundary between the electrode and the solder, and prevents generation of voids and cracks resulting from the Cu—Sn alloy. The electrode and the solder are joined with sufficient strength by the joining layer.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: November 28, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Taiki Uemura, Seiki Sakuyama
  • Patent number: 9831199
    Abstract: An electronic device includes a first electronic part, a second electronic part opposite the first electronic part, and a bonding portion between the first electronic part and the second electronic part. The bonding portion contains a solder containing a substance whose crystal structure reversibly changes in temperature rise and fall processes which accompany the operation of the electronic device or electronic equipment including the electronic device. A change in the crystal structure of the substance contained in the solder promotes recovery and recrystallization of the solder in the temperature rise and fall processes which accompany the operation of the electronic device or the electronic equipment. As a result, the coarsening of crystal grains in the solder is suppressed.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: November 28, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Taiki Uemura, Seiki Sakuyama
  • Patent number: 9812418
    Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: November 7, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Kozo Shimizu, Seiki Sakuyama
  • Patent number: 9761552
    Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: September 12, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Kozo Shimizu, Seiki Sakuyama
  • Publication number: 20170207186
    Abstract: An electronic device includes an electrode including Cu, a solder including Sn and provided above the electrode, and a joining layer including In and Ag and provided along a boundary between the electrode and the solder. The joining layer including In and Ag prevents Cu—Sn alloy, such as Cu6 Sn5, from being formed at the boundary between the electrode and the solder, and prevents generation of voids and cracks resulting from the Cu—Sn alloy. The electrode and the solder are joined with sufficient strength by the joining layer.
    Type: Application
    Filed: November 28, 2016
    Publication date: July 20, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Taiki Uemura, Seiki Sakuyama
  • Publication number: 20170125366
    Abstract: An electronic device includes a first electronic part, a second electronic part opposite the first electronic part, and a bonding portion between the first electronic part and the second electronic part. The bonding portion contains a solder containing a substance whose crystal structure reversibly changes in temperature rise and fall processes which accompany the operation of the electronic device or electronic equipment including the electronic device. A change in the crystal structure of the substance contained in the solder promotes recovery and recrystallization of the solder in the temperature rise and fall processes which accompany the operation of the electronic device or the electronic equipment. As a result, the coarsening of crystal grains in the solder is suppressed.
    Type: Application
    Filed: September 26, 2016
    Publication date: May 4, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Taiki Uemura, Seiki Sakuyama
  • Publication number: 20170125359
    Abstract: An electronic device includes: a first circuit board; a second circuit board located above a first region of the first circuit board; a first semiconductor element located above a second region of the first circuit board, which is different from the first region, and above a third region of the second circuit board; a first connection interposed between the first semiconductor element and the second region so as to electrically interconnect the first semiconductor element and the first circuit board; and a second connection interposed between the first semiconductor element and the third region so as to electrically interconnect the first semiconductor element and the second circuit board.
    Type: Application
    Filed: October 20, 2016
    Publication date: May 4, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Taiji Sakai, Seiki Sakuyama, Nobuhiro Imaizumi, Aki Dote
  • Patent number: 9640508
    Abstract: An electrical apparatus includes a first electrical component; a second electrical component; and an In—Sn—Ag alloy connecting the first electrical component and the second electrical component, the In—Sn—Ag alloy containing AgIn2 and Ag2In, a Ag2In content being lower than a AgIn2 content.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: May 2, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Taiki Uemura, Kozo Shimizu, Seiki Sakuyama
  • Patent number: 9620470
    Abstract: A method of manufacturing a semiconductor device includes forming a barrier metal film on a surface of at least one of a first electrode of a wiring board and a second electrode of a semiconductor element, providing a connection terminal between the first and second electrodes, the connection terminal being made of solder containing tin, bismuth and zinc, and bonding the connection terminal to the barrier metal film by heating the connection terminal and maintaining the temperature of the connection terminal at a constant temperature not lower than a melting point of the solder for a certain period of time.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: April 11, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Kozo Shimizu, Seiki Sakuyama, Toyoo Miyajima
  • Publication number: 20170062373
    Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.
    Type: Application
    Filed: November 15, 2016
    Publication date: March 2, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Kozo Shimizu, Seiki Sakuyama
  • Publication number: 20170012013
    Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.
    Type: Application
    Filed: September 21, 2016
    Publication date: January 12, 2017
    Applicant: FUJITSU LIMITED
    Inventors: KOZO SHIMIZU, Seiki Sakuyama
  • Patent number: 9530745
    Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: December 27, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Kozo Shimizu, Seiki Sakuyama