Abstract: An image sensing apparatus with artificial ommatidia includes an imaging optical lens group forming a concave focal surface, an artificial ommatidia unit having a curved top surface corresponding to the concave focal surface and a flat bottom surface, and an image sensor disposed under the artificial ommatidia unit. The artificial ommatidia unit is disposed under the imaging optical lens group so that the curved top surface is coincided with the concave focal surface of the imaging optical lens group. The artificial ommatidia unit having a plurality of artificial ommatidia collects light emitting from the imaging optical lens group, and guides the light to the bottom surface thereof.

Abstract: A vari-focal fluidic lens is provided. The fluidic lens includes a frame, an first membrane, a second membrane, and an optical fluid. The frame defines an inner space of the fluidic lens including a driving portion and a lens portion that are connected to each other. The elastic membrane is attached to one side of the frame to cover at least the lens portion. The second membrane is attached to an opposite side of the frame to cover at least the driving portion and is deformable in response to temperature change to vary a volume of the inner space. Optical fluid is contained in the inner space.

Abstract: A Multi-Line Phase Shifter (MLPS) for a vertical beam tilt-controlled antenna is provided, in which a housing is shaped into an elongated rectangular box, a fixed plate is attached on an inner bottom surface of the housing and has transmission lines printed thereon, the transmission lines forming part of a plurality of phase shifting patterns and a plurality of signal division patterns, for dividing an input signal and shifting phases of divided signals, and a mobile plate is installed within the housing, movably along a length direction at a position where the mobile plate contacts a surface of the fixed plate, and has transmission lines printed thereon, the transmission lines forming a remaining part of the plurality of phase shifting patterns for phase shifting by forming variable lines through coupling with the part of the plurality of phase shifting patterns.

Abstract: Micro lens manufacturing apparatus, a micro lens manufacturing method, a micro lens, and a camera module employing the micro lens are provided. First mold is manufactured in correspondence with a first lens profile of a lens element. Second mold is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole of the lens substrate. First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.

Abstract: A multipurpose sensing apparatus and electronic equipment are provided. The sensing apparatus includes planar type compound eyes, each planar type compound eye including ommatidium arranged in a circular arc such that each ommatidium views a contact surface; three-dimensional (3D) compound eyes, each 3D compound eye including ommatidium arranged in an array such that each ommatidium views an area in front of the contact surface; and an image signal processor that is configured to determine a touch position on the contact surface based on image signals transmitted from the planar type compound eyes, and to recognize a motion of an object existing in front of the contact surface based on image signals transmitted from the 3D compound eyes.

Abstract: An imaging device with a plurality of imaging units is provided. The imaging device includes a supporting substrate, a flexible substrate and a movable unit. The supporting substrate is formed with a hard material, and the flexible substrate includes a plurality of imaging units positioned at least in a width direction. The flexible substrate is fixed at a first edge portion with the supporting substrate, while an opposite second edge portion of the flexible substrate is connected with the movable unit. The movable unit moves the opposite second edge portion of the flexible substrate in the width direction and bends or flattens the flexible substrate. A degree of curvature at which the flexible substrate is bent may vary based on a distance by which the movable unit moves in the width direction, so that a field of view (FOV) of the plurality of imaging units may be adjusted.

Abstract: A Base Station (BS) antenna in a mobile communication system is provided, in which a reflective plate has a frontal surface onto which radiation elements are attached, and at least one protector is attached onto the reflective plate, surrounding at least part of the reflective plate.

Abstract: A method for installing radiator elements arranged on different planes and an antenna having the radiator elements are provided, in which a first-position radiator element is placed on one plane, a second-position radiator element is placed on another plane, and power supply cables are connected to the first-position radiator element and the second-position radiator element. The power supply cables are designed to compensate for a phase difference between signals radiated in the air from the first-position radiator element and the second-position radiator element by a phase difference between signals propagated via the power supply cables.

Abstract: An image pickup device and a manufacturing method thereof are disclosed. The image pickup device includes a printed circuit board (PCB), an image sensor module, an optical lens module, a fluidic lens module, and a shutter module. The image sensor module is disposed over the printed circuit board and electrically connected to interconnection pads on the PCB. The optical lens module is disposed over the image sensor module and includes one or more lenses. The fluidic lens module is disposed over the optical lens module, has a variable focus and is electrically connected to interconnection pads on the PCB. The shutter module is disposed over the fluidic lens module, and is electrically connected to remaining interconnection pads on the PCB. The fluidic lens module and the shutter module may be connected to the interconnection pads through bumped plate springs.

Abstract: An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.

Abstract: A wafer level encapsulation chip and an encapsulation chip manufacturing method. The encapsulation chip includes a device substrate, a circuit module mounted on the device substrate, a bonding layer deposited on a predetermined area of the device substrate, a protection cap forming a cavity over the circuit module and bonded to the device substrate by the bonding layer and encapsulation portions formed on predetermined areas of the bonding layer and the protection cap. Thus, the present invention can minimize damages to a chip upon chip handling and prevent moisture from being introduced into the inside of the chip.

Abstract: Disclosed are a wafer-level lens module including a plurality of wafer-scale lenses that are stacked and an image pickup device including the wafer-level lens module and an image sensor. Each wafer-scale lens includes a substrate with a light-transmission part, and a lens element fixed on one side or both sides of the substrate. The lens element includes an optical zone, corresponding to the light-transmission part of the substrate, and an extended zone disposed outside the optical zone. A trench or protrusion is formed as an alignment guide on one or both sides of the substrate, adjacent to the light-transmission part, and a protrusion or trench, aligned with the trench or protrusion, is formed in the extended zone of the lens element. The lens element is aligned on the substrate such that an inclined portion of the protrusion contacts corners of the trench.

Abstract: Provided are a wafer-level lens module and an image pickup module including the same. The wafer lens module includes a plurality wafer-scale lenses. At least one of the plurality of wafer-scale lenses, such as a wafer-scale lens positioned toward an object side, includes a substrate and a glass lens element formed on one side of the substrate. The glass lens element may be a one-sided lens or a double-sided lens. When the glass lens is a double-sided lens, the substrate may have a through hole. The remaining wafer-scale lenses each include a substrate and polymer lens elements made of UV curable polymer and formed on both sides of the substrate. Also, spacers are interposed between the wafer-scale lenses, along the edge portions of the substrates, so as to maintain predetermined intervals between the wafer-scale lenses.

Abstract: A multi-sensing touch panel and a display apparatus using the same are provided. The multi-sensing touch panel includes: a touch pad including an input surface; at least one infrared ray source which irradiates infrared rays to the touch pad; and a camera array including a plurality of infrared ray cameras which are disposed below the touch pad and inclined with respect to a plane of the input surface.

Abstract: A packaging chip formed with plural wafers. The packaging chip includes plural wafers stacked in order and plural interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers. At least one or more of the plural wafers mounts a predetermined circuit device thereon. Further, at least one or more wafers of the plural wafers have a cavity of a predetermined size. Meanwhile, the packaging chip further includes plural pads independently arranged on the upper surface of the uppermost wafer one another and electrically connected to the plural interconnection electrodes respectively. Accordingly, the present invention can enhance the performance and reliability of a packaging chip and improve fabrication yield.

Abstract: Micro lens manufacturing apparatus, a micro lens manufacturing method, a micro lens, and a camera module employing the micro lens are provided. First mold is manufactured in correspondence with a first lens profile of a lens element. Second mold is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole of the lens substrate. First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.

Abstract: An electroactive polymer actuator and a method for manufacturing the electroactive polymer actuator are provided. The electroactive polymer actuator includes an actuator unit which is a laminate of a plurality of deformation layers; and a support layer which supports the actuator unit so that the actuator unit provides displacement corresponding to a voltage if the voltage is applied to the actuator unit. Therefore, it is possible to provide an electroactive polymer actuator suitable for a compact mobile device with a low driving voltage.

Abstract: A mirror package is provided which can reflect a laser to an external screen according to a video signal when the laser enters from outside, and a method of manufacturing the mirror package. The mirror is packaged with a glass to protect from external contamination, an inlet and an outlet are formed by, for example, an anisotropic etching on the glass and blocks a reflected light reflected from the glass. The mirror package is formed as a set, combined on a wafer using a wafer level package and diced to individual chips. Subsequently, a productivity is improved and a ghost image or phenomenon is removed.

Abstract: A part to be centered during an assembly process includes an effective portion which performs a function and is shaped for insertion into a hole, a reference portion extended from the effective portion and formed substantially perpendicular to a center axis of the effective portion, and an aligning portion extended from the effective portion and formed around the effective portion. When the effective portion of the part is inserted into the hole, a center of the effective portion is automatically aligned with a centerline of the hole.

Abstract: A flexible image photographing apparatus includes a plurality of image photographing units to photograph a photographing object. A flexible body receives the plurality of image photographing units and may be transformed when a force is applied. A control portion is disposed at the flexible body to control each of the plurality of image photographing units to photograph the photographing object. The control portion stores images of the photographing object and performs various kinds of photography.