Abstract: An image sensor and a method of manufacturing the image sensor, wherein the image sensor can electrically connect a light receiving portion and a printed circuit board (PCB) including circuits by forming holes and filling the holes with a conductive material, without using a wire for the electrical connection between the light receiving portion and the PCB. The light receiving portion converts lights into electrical signals and the PCB electrically processes signals. That is, since a distance for a wire between a sealing structure and because a filter is unnecessary, a thickness may be reduced. Also, since a space for wire bonding is unnecessary on the outside of an image sensor, a fill factor may increase. Also, since a process that may cause contaminates is removed, average yield may increase and production cost may decrease. The manufacturing productivity may be improved.

Abstract: A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package are provided. The method of the micro-element package including: providing a substrate having a micro-element on its top surface and a transparent cover having a groove on its bottom surface; attaching the transparent cover on the substrate, wherein the bottom surface of the transparent cover where the groove is formed faces the micro-element; exposing the groove by selectively eliminating the transparent cover; and dicing the substrate along the exposed groove.

Abstract: An image pickup device includes a sensor substrate having image sensors arranged in its image pickup region in the form of a matrix. An interlayer insulating film layer is formed below a bottom of the sensor substrate. The interlayer insulating film layer includes wiring layers to construct an electric circuit. The wiring layer is electrically connected with the image sensors. A support substrate is attached on a bottom of the interlayer insulating film layer. The support substrate has contact electrodes formed in via holes. A lens layer is formed over the top surface of the sensor substrate to be opposite to the interlayer insulating film layer. A light-transmitting member is formed over the lens layer.

Abstract: A micro-element package which can reduce manufacturing costs and can be advantageous for mass production due to simplifying its structure and manufacturing process, and also can facilitate miniaturization and promote thinness, and a method of manufacturing the micro-element package. The micro-element package includes: a substrate having a micro-element on its top surface and a comparatively thin surrounding portion provided around the micro-element; and a circuit board that is electrically connected to the micro-element by utilizing the surrounding portion as a medium.

Abstract: An optical lens is provided. The optical lens provides miniaturization and thin size, and reduces the cost and improves productivity by simplifying the structure and manufacturing process. The optical lens includes a light-transmitting substrate with a lens chamber and a fluidic chamber that are connected with each other. The optical lens also includes a light-transmitting elastic film which seals the lens chamber, a buffer elastic film which seals the fluidic chamber, and an actuator on the buffer elastic film which corresponds to the fluidic chamber, and varies the volume of the fluidic chamber to vary a pressure acting on the light-transmitting elastic film.

Abstract: An emergency call system and a control method thereof are provided for notifying a third party of an emergency situation using a mobile communication terminal. The emergency call system includes a calling terminal, a base station (BS), and a management server. When recognizing the emergency situation of a registered subscriber, the management server notifies an emergency reception center of the emergency situation. The calling terminal generates and transmits first and second emergency messages. The first emergency message includes an emergency notification message, a phone number of at least one called terminal (recipient), and BS identification information, and the second emergency message includes the emergency notification message and the subscriber's phone number. The BS receives the first and second emergency messages, and transfers the received first and second emergency messages to the management server and the at least one called terminal.

Abstract: An image sensing apparatus with artificial ommatidia includes an imaging optical lens group forming a concave focal surface, an artificial ommatidia unit having a curved top surface corresponding to the concave focal surface and a flat bottom surface, and an image sensor disposed under the artificial ommatidia unit. The artificial ommatidia unit is disposed under the imaging optical lens group so that the curved top surface is coincided with the concave focal surface of the imaging optical lens group. The artificial ommatidia unit having a plurality of artificial ommatidia collects light emitting from the imaging optical lens group, and guides the light to the bottom surface thereof.

Abstract: An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.

Abstract: An electroactive polymer actuator and a method for manufacturing the electroactive polymer actuator are provided. The electroactive polymer actuator includes an actuator unit which is a laminate of a plurality of deformation layers; and a support layer which supports the actuator unit so that the actuator unit provides displacement corresponding to a voltage if the voltage is applied to the actuator unit. Therefore, it is possible to provide an electroactive polymer actuator suitable for a compact mobile device with a low driving voltage.

Abstract: An optical lens is provided. The optical lens provides miniaturization and thin size, and reduces the cost and improves productivity by simplifying the structure and manufacturing process. The optical lens includes a light-transmitting substrate with a lens chamber and a fluidic chamber that are connected with each other. The optical lens also includes a light-transmitting elastic film which seals the lens chamber, a buffer elastic film which seals the fluidic chamber, and an actuator on the buffer elastic film which corresponds to the fluidic chamber, and varies the volume of the fluidic chamber to vary a pressure acting on the light-transmitting elastic film.

Abstract: The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

Abstract: A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package substrate, a light emitting diode chip bonded to an upper surface of the package substrate, and a bonding material for bonding the light emitting diode chip to the package substrate. The package substrate has a recess formed in a bonding surface thereof to accommodate the bonding material.

Abstract: An image pickup device comprises: a sensor substrate having image sensors arranged in its image pickup region in the form of a matrix; an interlayer insulating film layer formed below a bottom of the sensor substrate, the interlayer insulating film layer including wiring layers formed therein to construct an electric circuit, the wiring layer being electrically connected with the image sensors; a support substrate attached on a bottom of the interlayer insulating film layer, the support substrate having contact electrodes formed in via holes; a lens layer formed over the top surface of the sensor substrate to be opposite to the interlayer insulating film layer; and a light-transmitting member formed over the lens layer.

Abstract: A micro-element package module which can reduce manufacturing costs and can be advantageous for mass production due to simplifying its structure and manufacturing process, and also can facilitate miniaturization and promote thinness, and a method of manufacturing the micro-element package module. The micro-element package module includes: an element substrate having a micro-element on a top surface of the element substrate; a circuit substrate that is provided around the element substrate; and an element housing that is provided above the element substrate and the circuit substrate, and includes a connecting section for electrically connecting the micro-element and the circuit substrate.

Abstract: A micro-element package which can reduce manufacturing costs and can be advantageous for mass production due to simplifying its structure and manufacturing process, and also can facilitate miniaturization and promote thinness, and a method of manufacturing the micro-element package. The micro-element package includes: a substrate having a micro-element on its top surface and a comparatively thin surrounding portion provided around the micro-element; and a circuit board that is electrically connected to the micro-element by utilizing the surrounding portion as a medium.

Abstract: A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package are provided. The method of the micro-element package including: providing a substrate having a micro-element on its top surface and a transparent cover having a groove on its bottom surface; attaching the transparent cover on the substrate, wherein the bottom surface of the transparent cover where the groove is formed faces the micro-element; exposing the groove by selectively eliminating the transparent cover; and dicing the substrate along the exposed groove.

Abstract: A method of manufacturing an LED package. The method includes dispensing a transparent resilient resin on an LED package body and overturning an entire structure to form an LED lens integrally provided to the LED package body. This prevents extra processes and costs incurring from forming intermediate layers and obviates degradation in reliability and light extraction efficiency due to additional interfaces.

Abstract: The invention relates to a method of manufacturing a high-sag micro lens and a high-sag lens manufactured thereby. According to the method, high viscosity photoresists are coated and baked for multiple times and undergo a reflow to obtain a micro lens structures having a high sag, thereby manufacturing high-sag micro lenses.

Abstract: The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and a lens structure disposed on an upper surface of the package body, apart from the light emitting diode chip. Phosphor is dispersed in at least a part of the lens structure.

Abstract: A mobile terminal includes a memory unit for storing a phonebook including at least one telephone number and registering emergency (SOS) phrases and SOS message recipients; a display unit for displaying a picture for SOS message transmission; an audio unit for converting voice data into an audio signal through a speaker and converting an audio signal received through a microphone into voice data; and a controller for constructing an SOS message using the SOS phrases when the SOS message transmission is required and transmitting the SOS message to predetermined telephone numbers registered in the phonebook when there do not exist the SOS message recipients registered in the memory unit.