Abstract: A wafer-to-wafer bonding structure includes a first wafer including a first conductive pad in a first insulating layer and a first barrier layer surrounding a lower surface and side surfaces of the first conductive pad, a second wafer including a second conductive pad in a second insulating layer and a second barrier layer surrounding a lower surface and side surfaces of the second conductive pad, the second insulating layer being bonded to the first insulating layer, and at least a portion of an upper surface of the second conductive pad being partially or entirely bonded to at least a portion of an upper surface of the first conductive pad, and a third barrier layer between portions of the first and second wafers where the first and second conductive pads are not bonded to each other.

Abstract: An image acquisition apparatus includes a main body having a stage on which an object to be scanned is supported; a camera module that acquires partial images by photographing a part of the object to be scanned; a rotational body in which the camera module is installed and which is rotatably provided; a driving unit that controls a rotational motion of the rotational body; and an image processing unit that forms a synthesized image by synthesizing the partial images acquired by the camera module, the image acquisition apparatus capable of acquiring an image with high resolution.

Abstract: A multi-stacked device includes a lower device having a lower substrate, a first insulating layer on the lower substrate, and a through-silicon-via (TSV) pad on the first insulating layer, an intermediate device having an intermediate substrate, a second insulating layer on the intermediate substrate, and a first TSV bump on the second insulating layer, an upper device having an upper substrate, a third insulating layer on the upper substrate, a second TSV bump on the third insulating layer, and a TSV structure passing through the upper substrate, the third insulating layer, the second insulating layer, and the intermediate substrate to be connected to the first TSV bump, the second TSV bump, and the TSV pad. An insulating first TSV spacer between the intermediate substrate and the TSV structure and an insulating second TSV spacer between the upper substrate and the TSV structure are spaced apart along a stacking direction.

Abstract: The present disclosure provides a method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate for transfer printing includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate.

Abstract: The present invention relates to a lithium battery and, more particularly, to a lithium battery, in which the structure of a battery module contained in the lithium battery is simplified, thus reducing the size of the entire lithium battery, and which includes a connector by which two or more lithium batteries are mechanically coupled to each other so that in response to a required amount of power, an appropriate number of lithium batteries can be easily connected to each other.

Abstract: Semiconductor devices are provided. A semiconductor device includes a substrate, a first conductive structure on the substrate, and a second conductive structure on the first conductive structure. The semiconductor device includes first and second metal-diffusion-blocking layers on respective sidewalls of the first and second conductive structures. The semiconductor device includes an insulating layer between the first and second metal-diffusion-blocking layers. Moreover, the semiconductor device includes a metal-diffusion-shield pattern in the insulating layer and spaced apart from the first conductive structure.

Abstract: The present invention relates to a lithium battery and, more particularly, to a lithium battery, in which the structure of a battery module contained in the lithium battery is simplified, thus reducing the size of the entire lithium battery, and which includes a connector by which two or more lithium batteries are mechanically coupled to each other so that in response to a required amount of power, an appropriate number of lithium batteries can be easily connected to each other.

Abstract: A first insulating layer is formed on a substrate. An opening is formed in the first insulating layer. A barrier layer is formed on the first insulating layer and conforming to sidewalls of the first insulating layer in the opening, and a conductive layer is formed on the barrier layer. Chemical mechanical polishing is performed to expose the first insulating layer and leave a barrier layer pattern in the opening and a conductive layer pattern on the barrier layer pattern in the opening, wherein a portion of the conductive layer pattern protrudes above an upper surface of the insulating layer and an upper surface of the barrier layer pattern. A second insulating layer is formed on the first insulating layer, the barrier layer pattern and the conductive layer pattern and planarized to expose the conductive layer pattern. A second substrate may be bonded to the exposed conductive layer pattern.

Abstract: Semiconductor devices are provided. A semiconductor device includes a substrate, a first conductive structure on the substrate, and a second conductive structure on the first conductive structure. The semiconductor device includes first and second metal-diffusion-blocking layers on respective sidewalls of the first and second conductive structures. The semiconductor device includes an insulating layer between the first and second metal-diffusion-blocking layers. Moreover, the semiconductor device includes a metal-diffusion-shield pattern in the insulating layer and spaced apart from the first conductive structure.

Abstract: The present invention relates to a lithium battery and, more particularly, to a lithium battery, in which the structure of a battery module contained in the lithium battery is simplified, thus reducing the size of the entire lithium battery, and which includes a connector by which two or more lithium batteries are mechanically coupled to each other so that in response to a required amount of power, an appropriate number of lithium batteries can be easily connected to each other.

Abstract: In a method, a first opening is formed in a first insulating interlayer on a first substrate. A first conductive pattern structure contacting a first diffusion prevention insulation pattern and having a planarized top surface is formed in the first opening. Likewise, a second conductive pattern structure contacting a second diffusion prevention insulation pattern is formed in a second insulating interlayer on a second substrate. A plasma treatment process is performed on at least one of the first and second substrates having the first and second conductive pattern structures thereon, respectively. The first and second conductive pattern structures are contacted to each other to bond the first and second substrates.

Abstract: In a method, a first opening is formed in a first insulating interlayer on a first substrate. A first conductive pattern structure contacting a first diffusion prevention insulation pattern and having a planarized top surface is formed in the first opening. Likewise, a second conductive pattern structure contacting a second diffusion prevention insulation pattern is formed in a second insulating interlayer on a second substrate, plasma treatment process is performed on at least one of the first and second substrates having the first and second conductive pattern structures thereon, respectively. The first and second conductive pattern structures are contacted to each other to bond the first and second substrates.

Abstract: Disclosed herein is a battery cell case. The battery cell case includes a front case plate and a rear case plate which are separably coupled to each other. The structures of the front and rear case plates are symmetrical structures, so that the battery cell case can be easily assembled in such a way that the front and rear case plates are coupled to each other with the battery cell disposed therebetween and are fastened to each other by holders fitted over the opposite ends of the case plates. In another embodiment, the structures of the front and rear case plates may be asymmetrical structures so that the front and rear case plates can be coupled with each other in an insert coupling manner without using a separate tool or fastening means.

Abstract: Disclosed herein is a battery cell case. The battery cell case includes a front case plate and a rear case plate which are separably coupled to each other. The structures of the front and rear case plates are symmetrical structures, so that the battery cell case can be easily assembled in such a way that the front and rear case plates are coupled to each other with the battery cell disposed therebetween and are fastened to each other by holders fitted over the opposite ends of the case plates. In another embodiment, the structures of the front and rear case plates may be asymmetrical structures so that the front and rear case plates can be coupled with each other in an insert coupling manner without using a separate tool or fastening means.

Abstract: The present disclosure provides a method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling to substrate. The substrate for transfer printing includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate.

Abstract: A method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate.

Abstract: Assigning identifiers to a plurality of test devices to manage the test devices, and displaying the assigned identifiers on the test devices to distinguish the test devices.

Abstract: Disclosed herein is a superconducting wire which is used in, for example, superconducting magnet energy storage systems. The superconducting wire includes: a wire comprising a metal substrate, a superconducting layer and a buffer interposed between the metal substrate and the superconducting layer; and a stabilizer layer plated on the wire, wherein an epoxy resin insulating layer coats the entire surface of the stabilizer layer. The superconducting wire makes it possible to reduce damage to an insulating material when forming the insulating material during the production of the superconducting wire, and it has a uniform surface and can be produced in a simple manner.

Abstract: The present invention relates to a lithium battery and, more particularly, to a lithium battery, in which the structure of a battery module contained in the lithium battery is simplified, thus reducing the size of the entire lithium battery, and which includes a connector by which two or more lithium batteries are mechanically coupled to each other so that in response to a required amount of power, an appropriate number of lithium batteries can be easily connected to each other.