Abstract: A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.

Abstract: Disclosed is a thin film heat pipe suitable for removal of hot spots in displays such as an LCD, an LED, and a PDP. An exemplary embodiment of the present disclosure provides a thin plate heat pipe including: a body part having a flat plate shape; a through-hole formed in the body part in a longitudinal direction; a plurality of grooves formed on the inner wall of the through-hole and in which a working fluid flows; and a wick formed in at least a part of the through-hole.

Abstract: Disclosed is a thinned flat plate heat pipe fabricated by extrusion and provides a thinned flat plate heat pipe including: a body part having a flat plate shape; a through-hole formed in the longitudinal direction of the body part; and one or more grooves formed on at least one side of an inner wall of the through-hole and allowing a working fluid to flow. According to exemplary embodiments of the present disclosure, a relative wide steam flowing space can be ensured and an interface friction flowing resistance between gas and liquid can be further reduced through portions without the groove and the thickness of the thinned flat plate heat pipe can be maximally reduced, a thin-film type cooling element having a simple structure and a low manufacturing cost can be fabricated.

Abstract: Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.

Abstract: Provided is a heat transfer device which has a function of generating power through vibration of capillary grooves having a thin piezoelectric film deposited thereon, in addition to a heat transfer function of discharging heat transferred from a heating element to the outside.

Abstract: Provided is a solid type heat dissipation device for electronic communication appliances. The solid type heat dissipation device includes a graphite thin plate horizontally transferring heat, a plurality of metal fillers passing through the graphite thin plate to vertically transfer heat, and a plurality of metal thin plates attached to upper and lower surfaces of the graphite thin plate and connected to the metal fillers.

Abstract: A flat plate type heat spreading device is provided. The flat plat type heat spreading device can reduce heat by generating phase transition of liquid by using heat of a heat source so as to solve various problems caused by heat generated in components of electronic devices such as personal computers or mobile phones. Specifically, the flat plate type heat spreading device includes a lower plate for evaporating liquid, a middle plate combined with an upper surface of the lower plate, which separately includes a path through which evaporated vapor passes and a path through which condensed fluid flows into the lower plate, and an upper plate combined with an upper surface of the middle plate, which condenses the evaporated vapor.

Abstract: A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.

Abstract: There is provided a flat plate type micro heat transport device formed of two plates coupled with each other to be opposite to each other, each of which includes: a reservoir formed to store a moving fluid charged via an inlet; a evaporator formed separated from the reservoir to generate vapor having latent heat by vaporizing the moving fluid; a vapor flow path formed to be connected to the evaporator, through which the vapor having latent heat is transported; a condenser formed to be connected to the vapor flow path and to condense the vapor having latent heat; and a liquid flow path formed to be connected to the condenser and the evaporator and separately from the vapor flow path to transport a liquid obtained by condensing the vapor. The device may efficiently control heat with respect to portable electronic devices by effectively transportring heat generated by a heat source.

Abstract: Provided is a vapor-liquid phase change cooling device, which may be manufactured with no limitation of thickness. The cooling device includes a first thin plate including a groove-shaped capillary region, an evaporator section for evaporating a working fluid injected from outside, and a condenser section having a vapor condensation space for condensing the evaporated working fluid, a second thin plate having a vapor pathway for transporting the evaporated working fluid to the condenser section, and a third thin plate having a liquid pathway for transporting the working fluid condensed in the condenser section to the evaporator section.

Abstract: Provided are a heat control device and a method of manufacturing a heat control device. The method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates.

Abstract: Provided is a heat uniforming device for an electronic apparatus, which improves the flow and circulation of operating fluid through evaporation and condensation using capillary attraction. The heat uniforming device for the electronic apparatus includes: an evaporation unit comprised of a planar first plate including a first multi-channel capillary region for evaporating an externally injected operating fluid due to heat transmitted from a heating source; and a condensation unit comprised of a planar second plate including a second multi-channel capillary region for condensing vapor supplied from the evaporation unit and a return region having a fluid path that communicates with all channels of the second multi-channel capillary region.

Abstract: A method for fabricating a metal micro heat pipe with a polygonal cross-section to allow working fluid to flow by capillary force generated at edges of the polygonal of the micro heat pipe. The polygonal cross-section is formed of a single metal layer via a single drawing process. The micro heat pipe is formed of a single metal plate.

Abstract: Provided is a flat plate-type heat pipe formed of a flat pipe having a predetermined through-hole formed therein and a plurality of grooves extending from an inner surface of the through-hole in a longitudinal direction so that, while the interior of the heat pipe is in a vacuum state, heat in the heat pipe is discharged to the exterior due to a phase change of between liquid and gaseous states of working fluid and the working fluid flows by a capillary force produced from the plurality of grooves, whereby it is possible to obtain a strong capillary force and an excellent cooling effect while it is manufactured through a simple process.

Abstract: Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.

Abstract: A micro heat pipe with a polygonal cross-section is manufactured via drawing. The micro heat pipe has flat or concave sides to allow working fluid to flow by capillary force generated at the edges of the micro heat pipe. Another micro heat pipe is manufactured by forming a plurality of through holes with a polygonal cross-section in a metal plate via extrusion, in which each of the through holes has flat or concave sides to allow working fluid to flow by capillary force generated at the edges of each of the through holes. The micro heat pipes can be manufactured easily via drawing or extrusion, can induce strong capillary force through simple structural modifications, and provide superior cooling effects.

Abstract: A heat pipe having a woven-wire wick and a straight fine-wire wick is disclosed. The heat pipe can be easily manufactured and improve a thermal performance of the heat pipe. The heat pipe includes a pipe container; a straight fine-wire wick located in the pipe container, wherein the straight fine-wire wick has a porosity; a woven-wire wick having a plurality of groups of wires spirally woven to form a substantially cylindrical wick, for contacting the straight fine-wire wick to an inner wall of the pipe container, wherein when the woven-wire wick is forced radially and inwardly in order for the woven-wire wick to be inserted into the pipe container, the woven-wire wick has restoration forces in a radial and outward direction from axis of the woven-wire wick and is tightly contact with the inner wall of the pipe container, and wherein ends of the straight fine-wire wick and the woven-wire wick are fixed to ends of the pipe container.

Abstract: A heat pipe having a woven-wire wick and a straight fine-wire wick is disclosed. The heat pipe can be easily manufactured and improve a thermal performance of the heat pipe. The heat pipe includes a pipe container; a straight fine-wire wick located in the pipe container, wherein the straight fine-wire wick has a porosity; a woven-wire wick having a plurality of groups of wires spirally woven to form a substantially cylindrical wick, for contacting the straight fine-wire wick to an inner wall of the pipe container, wherein when the woven-wire wick is forced radially and inwardly in order for the woven-wire wick to be inserted into the pipe container, the woven-wire wick has restoration forces in a radial and outward direction from axis of the woven-wire wick and is tightly contact with the inner wall of the pipe container, and wherein ends of the straight fine-wire wick and the woven-wire wick are fixed to ends of the pipe container.