Patents by Inventor Seok In Hong
Seok In Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11905004Abstract: In an air mobility vehicle, an engine operates as required to provide mechanical driving force or electric energy. A battery is charged with the electric energy from the engine. Main rotors operate using the electric energy of the battery and electric power generated by the engine to perform takeoff, landing, and cruising. Auxiliary rotors are disposed at or adjacent to the center of gravity of a vehicle body and mechanically connected to the engine via a clutch. The auxiliary rotors perform the takeoff, the landing, or the cruising by receiving the mechanical driving force from the engine when the clutch is in an engaged position. A controller monitors the states of the battery and the main rotors and controls the operations of the engine and the clutch.Type: GrantFiled: March 2, 2021Date of Patent: February 20, 2024Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Woo Suk Jung, Hee Kwang Lee, Hyun Seok Hong, Hyun Woo Jun
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Patent number: 11887968Abstract: A semiconductor package includes a base structure having a base pad, a first semiconductor chip on the base structure, and having a first connection pad bonded to the base pad, a first bonding structure including an base insulation layer of a base structure and a first lower insulation layer of the first semiconductor chip bonded to the base insulation layer, a second semiconductor chip on the first semiconductor chip, and having a second connection pad connected to the first through-electrode, and a second bonding structure including a first upper insulation layer of the first semiconductor chip, and a second lower insulation layer of the second semiconductor chip bonded to the first upper insulation layer, and the first upper insulation layer has a dummy insulation portion extending onto the base structure around the first semiconductor chip.Type: GrantFiled: October 5, 2021Date of Patent: January 30, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hwan Hwang, Ji Hoon Kim, Ji Seok Hong, Tae Hun Kim, Hyuek Jae Lee
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Patent number: 11887900Abstract: A semiconductor package includes a base including a first bonding structure; and a first semiconductor chip, including a second bonding structure, the second bonding structure being coupled to the first bonding structure of the base, wherein the first bonding structure includes: a test pad; a first pad being electrically connected to the test pad; and a first insulating layer, wherein the second bonding structure includes: a second pad being electrically connected to the first pad; and a second insulating layer being in contact with the first insulating layer, and wherein at least a portion of the test pad is in contact with the second insulating layer.Type: GrantFiled: July 6, 2021Date of Patent: January 30, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyuek Jae Lee, Tae Hun Kim, Ji Hwan Hwang, Ji Hoon Kim, Ji Seok Hong
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Patent number: 11824006Abstract: A semiconductor package includes a first semiconductor chip having a first face and a second face opposite thereto. The first semiconductor chip includes a first wiring layer having a surface that forms the first face. A second semiconductor chip disposed on the first face of the first semiconductor chip includes a second wiring layer directly contacting the first wiring layer. A first mold layer is disposed on one lateral side of the first semiconductor chip and directly contacts the second wiring layer. A first via penetrates the first mold layer. A width of the first wiring layer and the first semiconductor chip in a horizontal direction are substantially the same. A width of the second wiring layer and the second semiconductor chip in the horizontal direction are substantially the same. A height of the first via and the first semiconductor chip in the vertical direction are substantially the same.Type: GrantFiled: October 4, 2021Date of Patent: November 21, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung-Soo Kwak, Ji-Seok Hong
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Publication number: 20230369663Abstract: A method for charging a battery includes: determining a first charging section, in which a current charging rate of the battery is located, from among a plurality of charging sections predetermined based on a functional relation between a state of charge of the battery and an open circuit voltage of an anode of the battery; and charging the battery for the first charging section with a first charging rate corresponding to the first charging section.Type: ApplicationFiled: July 27, 2023Publication date: November 16, 2023Inventors: Jin Seok HONG, Jeong Kuk SHON, Young-Gyoon RYU
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Publication number: 20230349618Abstract: The present invention relates to a water purifier with an ice maker, and more particularly to a water purifier with an ice maker, wherein a guide member for guiding ice may stably guide ice separated while moving together with a tray member, and the guide member does not interfere with a purified water storage part even in a case where the tray member rotates such that the purifier can increase the capacity of the purified water storage part and thus can improve user convenience.Type: ApplicationFiled: May 27, 2021Publication date: November 2, 2023Applicant: COWAY Co., Ltd.Inventors: Kwang Seok HONG, Jung Chul PARK, Do Han KIM, Seong Wook KIM
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Patent number: 11764415Abstract: A method for charging a battery includes: determining a first charging section, in which a current charging rate of the battery is located, from among a plurality of charging sections predetermined based on a functional relation between a state of charge of the battery and an open circuit voltage of an anode of the battery; and charging the battery for the first charging section with a first charging rate corresponding to the first charging section.Type: GrantFiled: December 28, 2020Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Seok Hong, Jeong Kuk Shon, Young-Gyoon Ryu
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Publication number: 20230290718Abstract: Disclosed are interconnection structures, semiconductor packages including the same, and methods of fabricating the same.Type: ApplicationFiled: May 19, 2023Publication date: September 14, 2023Applicant: Samsung Electronics Co., Ltd.Inventors: JI-SEOK HONG, DONGWOO KIM, HYUNAH KIM, UN-BYOUNG KANG, CHUNGSUN LEE
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Patent number: 11744033Abstract: A storage device assembly is provided. The storage device assembly includes a latch assembly having a body and a hook mounted on the body, the hook having elasticity and having distal ends thereof bend away from the body; and a storage device to be joined to the latch assembly. The storage device includes a memory module including a memory connector, and a first enclosure and a second enclosure that encase the memory module except for an opening through which the memory connector is accessible. The first enclosure includes fixing holes corresponding to the distal ends of the hook and configured to accommodate the distal ends of the hook in a configuration in which the storage device is joined to the latch assembly.Type: GrantFiled: April 12, 2021Date of Patent: August 29, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Chui Hur, Bum Jun Kim, Jung Soo Kim, Young Seok Hong
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Publication number: 20230253363Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip so that the first semiconductor chip is vertically between the second semiconductor chip and the substrate, a first molding layer adjacent to a sidewall of the first semiconductor chip on the substrate, the first molding layer formed of a first molding material, and a second molding layer adjacent to a sidewall of the second semiconductor chip on the substrate so that the first molding layer is vertically between the second molding layer and the substrate. The second molding layer is formed of a second molding material different from the first molding material.Type: ApplicationFiled: April 12, 2023Publication date: August 10, 2023Inventors: HYUEKJAE LEE, JIHOON KIM, JiHwan SUH, SO YOUN LEE, JIHWAN HWANG, TAEHUN KIM, JI-SEOK HONG
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Patent number: 11711001Abstract: A is constructed such that upper and lower shafts, which are coaxial, are rotated in opposite directions using a single coil winding, simplifying the structure of the motor apparatus and reducing the numbers of sensors and controllers to be mounted thereon.Type: GrantFiled: July 29, 2021Date of Patent: July 25, 2023Assignees: Hyundai Motor Company, Kia CorporationInventors: Hyun Seok Hong, Sang Hyun Jung, Hee Kwang Lee
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Patent number: 11705769Abstract: A magnetic gear may include a stator, having a stator core having a plurality of teeth extending toward a rotation shaft and a plurality of coils wound around the plurality of teeth, a rotor, having a rotor core disposed inside the stator and fixed to the rotation shaft and a plurality of permanent magnets attached to the external surface of the rotor core, and a pole-piece unit, having a plurality of first pole pieces and a plurality of second pole pieces arranged radially about the rotation shaft between the stator core and the rotor core such that the plurality of first pole pieces and the plurality of second pole pieces are alternately arranged in a circumferential direction thereof.Type: GrantFiled: July 22, 2021Date of Patent: July 18, 2023Assignees: Hyundai Motor Company, Kia CorporationInventors: Hyun Woo Jun, Woo Suk Jung, Hyun Seok Hong, Hee Kwang Lee
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Patent number: 11688679Abstract: Disclosed are interconnection structures, semiconductor packages including the same, and methods of fabricating the same.Type: GrantFiled: May 19, 2021Date of Patent: June 27, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-Seok Hong, Dongwoo Kim, Hyunah Kim, Un-Byoung Kang, Chungsun Lee
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Patent number: 11669614Abstract: An electronic device is disclosed. An electronic device comprises: a first memory in which an operating system and an application program executed on the operating system are stored; a second memory; a processor for loading at least some codes among codes corresponding to an application program from the first memory to the second memory, and when access information of the codes loaded in the second memory is received from a kernel of an operating system, accessing an area in which the loaded codes are stored, on the basis of the received information and executing the application program; and a snoop for monitoring access to an area in which a preset code, the access of which has been limited, from among codes loaded in the second memory is stored.Type: GrantFiled: November 7, 2018Date of Patent: June 6, 2023Assignees: SAMSUNG ELECTRONICS CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Dong Uk Kim, Byung Hoon Kang, Seung Hyun Ha, Dae Hee Jang, Jin Soo Jang, Seok Hong
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Patent number: 11670982Abstract: A motor apparatus has a cooling structure capable of effectively cooling the motor by inducing a fluid flow into the motor. In particular, the motor apparatus includes: a first part having a first flow path and a motor installed thereon; a second part having a second flow path and configured to be rotatably mounted on the first part and connected to the motor; and a turbine portion coupled to the second part and including disks stacked on one another forming spaces therebetween. When the turbine portion is rotated together with the second part, air is drawn through the first flow path or the second flow path and introduced into an opening hole of each of the disks, and the air is discharged into the spaces formed between the respective disks to cool the motor.Type: GrantFiled: March 1, 2021Date of Patent: June 6, 2023Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATIONInventors: Hyun Seok Hong, Woo Suk Jung, Hyun Su Cho, Sang Hyun Jung, Hee Kwang Lee
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Patent number: 11664652Abstract: An emergency power management system of a mobility, may include a fuse device connected to a battery and including a first circuit and a second circuit in which a first fuse and a second fuse are respectively provided and are connected in parallel, a pyro switch provided between the first circuit and the second circuit, and configured to establish electric connection with the first circuit in ordinary times and to release electric connection with the first circuit and to establish electric connection with the second circuit in a case of emergency, a determiner configured to determine abnormality of the first fuse based on current applied from the high-voltage battery or voltages at opposite end portions of the first fuse, and a controller configured to operate the pyro switch when abnormality occurs in the first fuse.Type: GrantFiled: July 30, 2021Date of Patent: May 30, 2023Assignees: Hyundai Motor Company, Kia CorporationInventors: Yoon Cheol Jeon, Hyun Woo Jun, Hee Kwang Lee, Hyun Ki Cho, Gwi Taek Kim, Hyun Seok Hong, Woo Suk Jung
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Patent number: 11658148Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip so that the first semiconductor chip is vertically between the second semiconductor chip and the substrate, a first molding layer adjacent to a sidewall of the first semiconductor chip on the substrate, the first molding layer formed of a first molding material, and a second molding layer adjacent to a sidewall of the second semiconductor chip on the substrate so that the first molding layer is vertically between the second molding layer and the substrate. The second molding layer is formed of a second molding material different from the first molding material.Type: GrantFiled: April 21, 2020Date of Patent: May 23, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyuekjae Lee, Jihoon Kim, JiHwan Suh, So Youn Lee, Jihwan Hwang, Taehun Kim, Ji-Seok Hong
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Patent number: 11642623Abstract: There is provided an ammonia gas removal system, including a fine bubble generation device which is configured to receive at least a portion of scrubber process water from a storage tank, and to generate fine bubbles containing carbon dioxide gas in the received scrubber process water, the storage tank being configured to store the scrubber process water to be provided to a gas scrubber, the gas scrubber being configured to spray the process water onto ammonia-containing gas.Type: GrantFiled: June 24, 2020Date of Patent: May 9, 2023Assignee: SUNG KWANG ENF CO. LTD.Inventor: Won Seok Hong
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Publication number: 20230108350Abstract: The present invention provides a method for producing a PNA oligomer. More specifically, the method comprises a step for reacting a PNA block and a PNA block in a solution to produce a PNA oligomer, and thus a PNA oligomer of interest can be produced with remarkably improved purity and yield.Type: ApplicationFiled: December 22, 2020Publication date: April 6, 2023Inventors: Hee Kyung Park, Yongtae Kim, Juhyeon Jeon, Jinwoo Jung, In Seok Hong
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Patent number: RE49538Abstract: A method of fabricating a semiconductor device includes forming an interlayer dielectric on a substrate, the interlayer dielectric including first and second openings respectively disposed in first and second regions formed separately in the substrate; forming a first conductive layer filling the first and second openings; etching the first conductive layer such that a bottom surface of the first opening is exposed and a portion of the first conductive layer in the second opening remains; and forming a second conductive layer filling the first opening and a portion of the second opening.Type: GrantFiled: October 14, 2020Date of Patent: May 30, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Hoonjoo Na, Sangjin Hyun, Yugyun Shin, Hongbae Park, Sughun Hong, Hye-Lan Lee, Hyung-Seok Hong