Abstract: A semiconductor package includes a base including a first bonding structure; and a first semiconductor chip, including a second bonding structure, the second bonding structure being coupled to the first bonding structure of the base, wherein the first bonding structure includes: a test pad; a first pad being electrically connected to the test pad; and a first insulating layer, wherein the second bonding structure includes: a second pad being electrically connected to the first pad; and a second insulating layer being in contact with the first insulating layer, and wherein at least a portion of the test pad is in contact with the second insulating layer.

Abstract: A pulse rate and respiratory rate measuring method includes acquiring a facial image comprising a face of a user, calculating a color signal from a predetermined number of skin regions of interest in the face of the user in the facial image, calculating a pulse wave signal or a respiratory signal by converting an extracted signal into a time domain after extracting a signal in a frequency band corresponding to pulse or respiration in frequency data obtained by converting the color signal into a frequency domain, and measuring a pulse rate or a respiratory rate corresponding to the frequency band based on peak interval information in the pulse wave signal or the respiratory signal.

Abstract: A semiconductor package is provided. The semiconductor package includes a lower structure including an upper insulating layer and an upper pad; and a semiconductor chip provided on the lower structure and comprising a lower insulating layer and a lower pad. The lower insulating layer is in contact with and coupled to the upper insulating layer and the lower pad is in contact with and coupled to the upper pad, and a lateral side of the semiconductor chip extends between an upper side and a lower side of the semiconductor chip and comprises a recessed portion.

Abstract: A semiconductor system may be provided. The semiconductor system may include a phase changeable memory device. The phase changeable memory device may include a phase changeable memory cell array, the phase changeable memory cell array may include a plurality of word lines, a plurality of bit lines overlapped with the word lines and phase changeable memory cells respectively connected to overlapping points between the word lines and the bit lines, and the phase changeable memory cell may include a phase changeable material. The semiconductor system may include a controller. The controller may be configured to provide the phase changeable memory device with a command and an address for controlling the phase changeable memory device.

Abstract: There is provided an ammonia gas removal system, including a fine bubble generation device which is configured to receive at least a portion of scrubber process water from a storage tank, and to generate fine bubbles containing carbon dioxide gas in the received scrubber process water, the storage tank being configured to store the scrubber process water to be provided to a gas scrubber, the gas scrubber being configured to spray the process water onto ammonia-containing gas.

Abstract: An electronic device is disclosed. An electronic device comprises: a first memory in which an operating system and an application program executed on the operating system are stored; a second memory; a processor for loading at least some codes among codes corresponding to an application program from the first memory to the second memory, and when access information of the codes loaded in the second memory is received from a kernel of an operating system, accessing an area in which the loaded codes are stored, on the basis of the received information and executing the application program; and a snoop for monitoring access to an area in which a preset code, the access of which has been limited, from among codes loaded in the second memory is stored.

Abstract: The present invention provides a method for preparing a PNA oligomer. More specifically, the present invention can prepare a PNA oligomer which is easily separable from byproducts through a simple and short process by using PNA dimers, PNA trimers or PNA tetramers, and which has extremely high yields and purity.

Abstract: A method for charging a battery includes: determining a first charging section, in which a current charging rate of the battery is located, from among a plurality of charging sections predetermined based on a functional relation between a state of charge of the battery and an open circuit voltage of an anode of the battery; and charging the battery for the first charging section with a first charging rate corresponding to the first charging section.

Abstract: A blood pressure measurement method, includes: receiving an image comprising a skin image of a user; converting each color data of skin regions of interest in a predetermined part of the skin image into frequency domain data; calculating a maximum peak value of pulses in pulse related frequency domain data of the frequency domain data, a maximum frequency value corresponding to the maximum peak value, and a maximum peak frequency phase difference of a phase difference of the maximum frequency value between the skin regions; calculating a pulse transit time as a function of the maximum frequency value and the maximum peak frequency phase difference; and calculating a blood pressure of the user as a function of the maximum peak value, the maximum frequency value, and the pulse transit time.

Abstract: Provided is an apparatus for generating an image, the apparatus including a processor configured to detect at least one object near a vehicle by using a result of sensing a surrounding area of the vehicle, determine a direction and a distance from the vehicle to the detected at least one object, and generate an image of the surrounding area of the vehicle based on the determined direction and distance. Therefore, the apparatus may accurately express a shape of the object and a relative location between the vehicle and the object on a three-dimensional (3D) image of the surrounding area of a vehicle.

Abstract: Disclosed is a liquid crystal display device, including: a first substrate including a display area displaying an image, and a non-display area disposed in a form surrounding the display area; a second substrate spaced apart from the first substrate; and a liquid crystal layer disposed between the first substrate and the second substrate; and a first static electricity absorbing pattern disposed on the non-display area of the first substrate.

Abstract: A dial transmission lever device according to an exemplary embodiment of the present invention includes a dial knob, a button guide unit, a plurality of button units, a rubber unit, and a board unit. The dial knob is rotatable from a predetermined reference position and includes a first hole that penetrates the dial knob from one end to the other end of the dial knob. The button guide unit is disposed in the dial knob. The plurality of button units is disposed in the button guide unit. The rubber unit is disposed below the button guide unit and includes protruding portions disposed below the plurality of button units, respectively. The board unit is disposed below the rubber unit. In addition, the dial knob further includes a rotary member disposed in the first hole, coupled to the dial knob, and configured to rotate together with the dial knob.

Abstract: A semiconductor package includes: a lower semiconductor chip including a first semiconductor substrate, which includes a first semiconductor device on an active surface thereof and a protrusion defined by a recess region on an inactive surface thereof opposite to the active surface, a plurality of external connecting pads on a bottom surface of the first semiconductor substrate, and a plurality of through-electrodes electrically connected to the plurality of external connecting pads; and at least one upper semiconductor chip stacked on the protrusion of the lower semiconductor chip and electrically connected to the plurality of through-electrodes, the at least one upper semiconductor chip including a second semiconductor substrate which includes a second semiconductor device on an active surface thereof.

Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip so that the first semiconductor chip is vertically between the second semiconductor chip and the substrate, a first molding layer adjacent to a sidewall of the first semiconductor chip on the substrate, the first molding layer formed of a first molding material, and a second molding layer adjacent to a sidewall of the second semiconductor chip on the substrate so that the first molding layer is vertically between the second molding layer and the substrate. The second molding layer is formed of a second molding material different from the first molding material.

Abstract: A die stack structure may include a base die having base contact pads insulated by a base protection patterns and a flat side surface, a die stack bonded to the base die and having a plurality of component dies on the base die such that each of the component dies includes component contact pads insulated by a corresponding component protection pattern, and a residual mold unevenly arranged on a side surface of the die stack such that the component dies are attached to each other by the residual mold.

Abstract: An electronic apparatus and a control method thereof are provided. The control method includes: receiving video data; acquiring a plurality of feature information representing an object from the received video data using a plurality of filters; detecting the object included in the video data using feature information, among the plurality of feature information, acquired by at least two of the plurality of filters; and providing information on the detected object. As a result, the electronic apparatus can accurately detect surrounding vehicles and pedestrians even under a general road condition, dark road conditions (such as at night time and bad weather), or the like.

Abstract: A method for charging a battery includes: determining a first charging section, in which a current charging rate of the battery is located, from among a plurality of charging sections predetermined based on a functional relation between a state of charge of the battery and an open circuit voltage of an anode of the battery; and charging the battery for the first charging section with a first charging rate corresponding to the first charging section.

Abstract: A semiconductor package including a first device layer including first semiconductor devices, a first cover insulating layer, and first through-electrodes passing through at least a portion of the first device layer, a second device layer second semiconductor devices, a second cover insulating layer, and second through-electrodes passing through at least a portion of the second device layer, the second semiconductor devices vertically overlapping the first semiconductor devices, respectively, the second cover insulating layer in contact with the first cover insulating layer a third device layer including an upper semiconductor chip, the upper semiconductor chip vertically overlapping both at least two of first semiconductor devices and at least two of the second semiconductor devices, and device bonded pads passing through the first and second cover insulating layers, the device bonded pads electrically connecting the first and second through-electrodes to the upper semiconductor chip may be provided.

Abstract: A printed circuit board according to various embodiments of the disclosure includes a plurality of layers in which at least one opening is formed and at least one antenna included in at least one layer among the plurality of layers, and the at least one opening is located within a specified distance from the at least one antenna and is formed through at least one of the plurality of layers.

Abstract: A semiconductor package including a first device layer including first semiconductor devices, a first cover insulating layer, and first through-electrodes passing through at least a portion of the first device layer, a second device layer second semiconductor devices, a second cover insulating layer, and second through-electrodes passing through at least a portion of the second device layer, the second semiconductor devices vertically overlapping the first semiconductor devices, respectively, the second cover insulating layer in contact with the first cover insulating layer a third device layer including an upper semiconductor chip, the upper semiconductor chip vertically overlapping both at least two of first semiconductor devices and at least two of the second semiconductor devices, and device bonded pads passing through the first and second cover insulating layers, the device bonded pads electrically connecting the first and second through-electrodes to the upper semiconductor chip may be provided.