Patents by Inventor Seok In Hong

Seok In Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for managing cloud storage
    Patent number: 10776324
    Abstract: A method and a system for integrally managing at least one cloud storage in a system for managing cloud storage implemented by a computer may include: configuring a network drive for a first cloud storage on a first server related to the system for managing cloud storage which is assigned to a user of a first electronic device; linking a second cloud storage on a second server used by the user; and integrally managing the first cloud storage and the second cloud storage through the network drive.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: September 15, 2020
    Assignee: NHN Entertainment Corporation
    Inventors: Eunsung Yl, Jihoon Jo, Yonghee Lee, Nam Jug Kim, Nam Kyung Kim, Jiyoon Bang, Beom Seok Jang, HongSeok Choi, DongWoo Kim, Min Hyeong Kim, MinKyu Lee, Yeonseong Chae, Yong Seok Hong, CheolHyeon Jo, JiHae Kim, Jinwoo Kim, Jin Kyung Lyu, SeYoung Jang, YunJung Woo, Eunsook Jin
  • Stacked memory device and a memory chip including the same
    Patent number: 10768824
    Abstract: A stacked memory includes a logic semiconductor die, a plurality of memory semiconductor dies stacked with the logic semiconductor die, a plurality of through-silicon vias (TSVs) electrically connecting the logic semiconductor die and the memory semiconductor dies, a global processor disposed in the logic semiconductor die and configured to perform a global sub process corresponding to a portion of a data process, a plurality of local processors respectively disposed in the memory semiconductor dies and configured to perform local sub processes corresponding to other portions of the data process and a plurality of memory integrated circuits respectively disposed in the memory semiconductor dies and configured to store data associated with the data process.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: September 8, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hak-Soo Yu, Je-Min Ryu, Reum Oh, Pavan Kumar Kasibhatla, Seok-In Hong
  • Torque converter for vehicle
    Patent number: 10767723
    Abstract: A torque converter for a vehicle including a front cover; an impeller which is coupled to the front cover and rotates together with the front cover; a turbine which is disposed at a position facing the impeller; a reactor which is positioned between the impeller and the turbine and changes a flow of oil flowing from the turbine to the impeller; a lock-up clutch which has a piston that directly connects the front cover and the turbine; and a torsional damper which includes a pair of retaining plates that receives driving power of an engine from the turbine or the lock-up clutch, and a driven plate that is disposed between the retaining plates, the torsional damper being coupled to the lock-up clutch and absorbing impact and vibration applied in a rotation direction.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: September 8, 2020
    Assignee: Valeo Kapec Co., Ltd
    Inventors: Jun Yong Song, Soon Seok Hong, Soon Cheol Shin
  • Method and system for sharing file between devices
    Patent number: 10762057
    Abstract: A method for sharing file of a first electronic device used by a user using a share message implemented by a computer may include: uploading a file to be shared with a second electronic device used by the user to a server according to the share message transmitted through a chat session set between an account of the user of the first electronic device and the server providing a cloud service; storing the share message including a link of a storage location of the server for the file uploaded to the server as an instance message of a private chat room corresponding to the chat session; and displaying the share message stored as the instance message through the private chat room on a screen of the first electronic device, wherein the second electronic device may be configured to access the private chat room with the account of the user.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: September 1, 2020
    Assignee: NHN Corporation
    Inventors: Eunsung Yi, Jihoon Jo, Yonghee Lee, Nam Jug Kim, Nam Kyung Kim, Jiyoon Bang, Beom Seok Jang, HongSeok Choi, DongWoo Kim, MinKyu Lee, Yeonseong Chae, Yong Seok Hong, CheolHyeon Jo, JiHae Kim, Jinwoo Kim, Min Hyeong Kim, Jin Kyung Lyu, SeYoung Jang, YunJung Woo, Eunsook Jin
  • Installation structure for pedal stroke sensor
    Patent number: 10752222
    Abstract: Disclosed herein is an installation structure for a pedal stroke sensor, including: a piston configured to move forward and backward by an operation of a pedal; a mounting member disposed on the piston; a first shaft coupled with the mounting member; a second shaft including a second gear engaged with a first gear of the first shaft; and a measuring portion disposed on the second shaft.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: August 25, 2020
    Assignee: MANDO CORPORATION
    Inventor: Kwang Seok Hong
  • Transmission control device detecting change of shift level and vehicle having the same
    Patent number: 10753458
    Abstract: A transmission control device may be provided that includes a magnet, a magnetic sensor, a slider, a shift lever, and a motion conversion member. The magnetic sensor is fixed to a predetermined position and measures a magnetic field which changes according to a relative position with respect to the magnet. The magnet is disposed at one end of the slider. The shift lever rotates to a position according to a shift level by user operations. When the shift lever rotates, the motion conversion member converts a rotational motion of the shift lever into a linear motion, and moves the slider in a first direction.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: August 25, 2020
    Assignee: KYUNG CHANG INDUSTRIAL CO., Ltd.
    Inventor: Hyeong Seok Hong
  • MEMORY SYSTEM INCLUDING A PLURALITY OF CONTROLLERS
    Publication number: 20200241989
    Abstract: A memory system includes a memory device, a first controller, and a second controller. The first controller is configured to output a control signal for the memory device and data to be stored in the memory device based on a signal received from a host. The second controller includes a non-volatile memory configured to store the data. The second controller is configured to receive the control signal and the data from the first controller, and control the memory device based on the control signal.
    Type: Application
    Filed: September 17, 2019
    Publication date: July 30, 2020
    Inventors: Kui-Yon Mun, Jae-Yong Jeong, Sung-Kyu Park, Beomkyu Shin, Young-Seok Hong
  • Electronic device including light-emitting elements and method of operating electronic device
    Patent number: 10715739
    Abstract: An electronic device and a method of operating the electronic device are provided. The electronic device includes an imaging device configured to obtain an image of a subject, a light source including light-emitting elements configured to emit light in different directions, and a controller configured to determine a position of the subject and a distance to the subject in the image, and control a luminance of the light-emitting elements based on the position of the subject and the distance to the subject.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: July 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-yeol Ryu, Jong-chul Choi, Ivan Panchenko, Mikhail Popov, Jae-hyoung Park, Hyun-seok Hong, Jong-tae Kim, Jin-sung Kim, Ju-hee Kim
  • METHOD OF OPERATING MEMORY CONTROLLER AND MEMORY SYSTEM, AND THE MEMORY SYSTEM
    Publication number: 20200201561
    Abstract: A method of controlling a first memory controller that controls a non-volatile memory device includes: the first memory controller receiving first data and a first physical address from a second memory controller via a first interface of the first memory controller; the first memory controller storing the first data in a non-volatile memory buffer of the first memory controller; and the first memory controller programming the first data stored in the non-volatile memory buffer in a first physical region of the non-volatile memory device corresponding to the first physical address.
    Type: Application
    Filed: August 19, 2019
    Publication date: June 25, 2020
    Inventors: KUI-YON MUN, SUNG-KYU PARK, BEOM-KYU SHIN, YOUNG-SEOK HONG, JAE-YONG JEONG
  • SEMICONDUCTOR SYSTEM INCLUDING A PHASE CHANGEABLE MEMORY DEVICE
    Publication number: 20200185029
    Abstract: A semiconductor system may be provided. The semiconductor system may include a phase changeable memory device. The phase changeable memory device may include a phase changeable memory cell array, the phase changeable memory cell array may include a plurality of word lines, a plurality of bit lines overlapped with the word lines and phase changeable memory cells respectively connected to overlapping points between the word lines and the bit lines, and the phase changeable memory cell may include a phase changeable material. The semiconductor system may include a controller. The controller may be configured to provide the phase changeable memory device with a command and an address for controlling the phase changeable memory device.
    Type: Application
    Filed: February 13, 2020
    Publication date: June 11, 2020
    Applicant: SK hynix Inc.
    Inventor: Yun Seok HONG
  • ELECTRONIC DEVICE AND METHOD FOR RECOGNIZING OBJECT BY USING PLURALITY OF SENSORS
    Publication number: 20200175714
    Abstract: A method of recognizing an object, and a device therefor are provided. The method includes obtaining first sensing data from a first sensor that senses the object, obtaining second sensing data from a second sensor that senses the object, obtaining a first object recognition reliability for the object and a second object recognition reliability for the object respectively based on the first sensing data and the second sensing data, based on the first object recognition reliability and the second object recognition reliability, matching object information of the object recognized using the second sensing data to the first sensing data, and storing the matched object information in a database of one of the first sensor and the second sensor.
    Type: Application
    Filed: February 6, 2020
    Publication date: June 4, 2020
    Inventors: Hyun-seok HONG, Sahng-gyu PARK, Bo-seok MOON, Hae-in CHUN
  • SEMICONDUCTOR PACKAGE
    Publication number: 20200135636
    Abstract: A semiconductor package is provided. The semiconductor package includes a lower structure including an upper insulating layer and an upper pad; and a semiconductor chip provided on the lower structure and comprising a lower insulating layer and a lower pad. The lower insulating layer is in contact with and coupled to the upper insulating layer and the lower pad is in contact with and coupled to the upper pad, and a lateral side of the semiconductor chip extends between an upper side and a lower side of the semiconductor chip and comprises a recessed portion.
    Type: Application
    Filed: June 25, 2019
    Publication date: April 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyuek Jae LEE, Ji Hoon KIM, Tae Hun KIM, Ji Seok HONG, Ji Hwan HWANG
  • SEMICONDUCTOR PACKAGE INCLUDING TEST PAD
    Publication number: 20200135594
    Abstract: A semiconductor package includes a base including a first bonding structure; and a first semiconductor chip, including a second bonding structure, the second bonding structure being coupled to the first bonding structure of the base, wherein the first bonding structure includes: a test pad; a first pad being electrically connected to the test pad; and a first insulating layer, wherein the second bonding structure includes: a second pad being electrically connected to the first pad; and a second insulating layer being in contact with the first insulating layer, and wherein at least a portion of the test pad is in contact with the second insulating layer.
    Type: Application
    Filed: July 11, 2019
    Publication date: April 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyuek Jae LEE, Tae Hun KIM, Ji Hwan HWANG, Ji Hoon KIM, Ji Seok HONG
  • SEMICONDUCTOR PACKAGE
    Publication number: 20200135699
    Abstract: A semiconductor package includes a base structure having a base pad, a first semiconductor chip on the base structure, and having a first connection pad bonded to the base pad, a first bonding structure including an base insulation layer of a base structure and a first lower insulation layer of the first semiconductor chip bonded to the base insulation layer, a second semiconductor chip on the first semiconductor chip, and having a second connection pad connected to the first through-electrode, and a second bonding structure including a first upper insulation layer of the first semiconductor chip, and a second lower insulation layer of the second semiconductor chip bonded to the first upper insulation layer, and the first upper insulation layer has a dummy insulation portion extending onto the base structure around the first semiconductor chip.
    Type: Application
    Filed: October 1, 2019
    Publication date: April 30, 2020
    Inventors: Ji Hwan HWANG, Ji Hoon KIM, Ji Seok HONG, Tae Hun KIM, Hyuek Jae LEE
  • DIE STACK STRUCTURE, SEMICONDUCTOR PACKAGE HAVING THE SAME AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200135698
    Abstract: A die stack structure may include a base die having base contact pads insulated by a base protection patterns and a flat side surface, a die stack bonded to the base die and having a plurality of component dies on the base die such that each of the component dies includes component contact pads insulated by a corresponding component protection pattern, and a residual mold unevenly arranged on a side surface of the die stack such that the component dies are attached to each other by the residual mold.
    Type: Application
    Filed: August 6, 2019
    Publication date: April 30, 2020
    Inventors: Ji-Seok HONG, Ji-Hoon KIM, Tae-Hun KIM, Hyuek-Jae LEE, Ji-Hwan HWANG
  • ELECTRONIC APPARATUS AND CONTROL METHOD THEREOF
    Publication number: 20200117924
    Abstract: An electronic apparatus and a control method thereof are provided. The control method includes: receiving video data; acquiring a plurality of feature information representing an object from the received video data using a plurality of filters; detecting the object included in the video data using feature information, among the plurality of feature information, acquired by at least two of the plurality of filters; and providing information on the detected object. As a result, the electronic apparatus can accurately detect surrounding vehicles and pedestrians even under a general road condition, dark road conditions (such as at night time and bad weather), or the like.
    Type: Application
    Filed: December 11, 2019
    Publication date: April 16, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae-gyu LIM, Yeong-rok LEE, Hyun-seok HONG, Seung-hoon HAN, Bo-seok MOON
  • SEMICONDUCTOR PACKAGE
    Publication number: 20200111763
    Abstract: A semiconductor package includes: a lower semiconductor chip including a first semiconductor substrate, which includes a first semiconductor device on an active surface thereof and a protrusion defined by a recess region on an inactive surface thereof opposite to the active surface, a plurality of external connecting pads on a bottom surface of the first semiconductor substrate, and a plurality of through-electrodes electrically connected to the plurality of external connecting pads; and at least one upper semiconductor chip stacked on the protrusion of the lower semiconductor chip and electrically connected to the plurality of through-electrodes, the at least one upper semiconductor chip including a second semiconductor substrate which includes a second semiconductor device on an active surface thereof.
    Type: Application
    Filed: June 19, 2019
    Publication date: April 9, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ji-seok HONG, Ji-hoon KIM
  • Display device and method of driving the same
    Patent number: 10607563
    Abstract: A display device includes a timing controller, a driver, and a display panel. The timing controller outputs a first clock signal having first rising time during an active section and a second clock signal having second rising time during a blank section adjacent to the active section. The driver generates a data signal based on the first clock signal and the second clock signal and to output the data signal. The display panel displays an image based on the data signal. The first rising time is shorter than the second rising time.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: March 31, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong In Kim, Jin Kyu Park, Yo Han Lee, Ki Hoon Choi, Hyun Seok Hong
  • Button-type transmission control device
    Patent number: 10605354
    Abstract: A button-type transmission control device includes: a button portion which includes a first area and a second area different from the first area; a hinge disposed under the button portion; and a substrate which is disposed under the hinge. The substrate includes a first terminal placed under the first area and a second terminal placed under the second area. When pressure is applied to the first area, the button portion is inclined such that the first area descends with respect to the hinge, so that the first area contacts the first terminal, and a gear shift position corresponding to the first terminal is selected. When pressure is applied to the second area, the button portion is inclined such that the second area descends with respect to the hinge, so that the second area contacts the second terminal, and a gear shift position corresponding to the second terminal is selected.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: March 31, 2020
    Assignee: KYUNG CHANG INDUSTRIAL CO., Ltd.
    Inventors: Dong Won Kim, Hyeong Seok Hong, Min Sik Choo
  • Data transfer device and semiconductor device including the data transfer device
    Patent number: 10607666
    Abstract: A data transfer device may include: a global input/output (GIO) driver configured for driving input data and outputting the driven data to a first GIO line, and configured for using a second supply voltage lower than a first supply voltage as a source voltage to drive the input data; and a repeater configured for amplifying data applied to the first GIO line, outputting the amplified data to a second GIO line, and shifting the data applied to the first GIO line to a level of the first supply voltage. The repeater may drive the data applied to the first GIO line to a first node, drive an output of the first node to the second GIO line, and reset the first node to the level of the first supply voltage based on a reset signal before a read operation.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: March 31, 2020
    Assignee: SK hynix Inc.
    Inventor: Yun Seok Hong