Abstract: The present disclosure relates to an organometallic compound having the following structure of Chemical Formula 1, Ir(LA)m(LB)n, an organic light emitting diode (OLED) where the organometallic compound is applied to an emitting material layer and an organic light emitting device. The luminous efficiency, color purity and luminous lifespan of the OLED and the organic light emitting device can be improved.

Abstract: A lighting device includes a heat sink for dissipating heat from a light source. The heat sink is located between an inner case and an outer case, and a power controller is located in the inner case. The light source may include one or more light emitting diodes.

Abstract: A lens may include: a lens part including an incidence surface onto which light is incident and a emission surface through which the light incident onto the incidence surface is emitted, and an outer surface which reflects the light incident onto the incidence surface toward the emission surface; and a holder part including a lens housing integrally connected with edge of the emission surface and surrounds an outer peripheral of the lens part, and at least one alignment protrusion located at a lower portion of the lens housing.

Abstract: An optical semiconductor lighting apparatus according to exemplary embodiments of the present invention provides a heat radiation member having a heat radiation plate where heat radiation fins are disposed radially, a cooling member disposed in an internal space at the center part of the heat radiation plate which inner curved portions of the heat radiation fins form, a light emitting member coupled to a lower surface of the heat radiation plate, and a cover coupled to the outer edge of the heat radiation member while covering the cooling member wherein the heat radiation fins comprise a first heat radiation fin and a second heat radiation fin which is lower than the first heat radiation fin.

Abstract: A light emitting diode (LED) lighting apparatus includes: a power supply unit configured to convert AC current and/or voltage into DC current and/or voltage and output the converted DC current and/or voltage, a light emitting module comprising a printed circuit board (PCB) and a plurality of LEDs disposed on a first side of the PCB, wherein the light emitting module is configured to receive the DC current from the power supply unit, a fan module configured to receive the DC voltage from the power supply unit, and a temperature sensor configured to generate temperature information and transmit the temperature information to the fan module. Moreover, the temperature sensor is disposed on the PCB.

Abstract: Provided are a light emitting diode unit including a light emitting diode integrated with a lens, a line printer head using the light emitting diode, and a method of manufacturing the light emitting diode. The light emitting diode unit includes the light emitting diode layer bonded to a transparent substrate after removing a growth substrate on which the light emitting layer is grown, and a lens that refracts light emitted from the light emitting diode is formed on the transparent substrate.

Abstract: An optical semiconductor illuminating apparatus includes a light emitting module including semiconductor optical elements, a casing part disposed over the light emitting module and having a switching mode power supply (SMPS) embedded therein, a first airtightness part including a packing frame fixed to an outer side of an edge of a communication slot penetrating through a side surface of the casing part, and a second airtightness part provided to an upper side of the casing part.

Abstract: An optical semiconductor illuminating apparatus includes a housing configured to receive power from one side thereof and comprising a first area, a heat dissipation base extending from the housing and comprising a second area smaller than the first area, and a light emitting module comprising at least one optical semiconductor device disposed on a portion of the housing and the heat dissipation base, and comprising a third area smaller than the first area and larger than the second area, in which the housing forms an overlap region comprising a fourth area overlapping the light emitting module, and the light emitting module is electrically connected to a power source through the overlap region.

Abstract: The lighting device including a reflector; a heat radiating body having a wall disposed around the reflective part of the reflector; a light emitter including a substrate disposed on a bottom surface of the wall of the heat radiating body and a plurality of light emitting devices disposed on the substrate; and a cover including a reflective surface disposed under the bottom surface and reflecting a first light from the light emitting devices to the reflective part of the reflector, and having an opening emitting a second light from the reflective part of the reflector to outside.

Abstract: Provided are a light emitting diode unit including a light emitting diode integrated with a lens, a line printer head using the light emitting diode, and a method of manufacturing the light emitting diode. The light emitting diode unit includes the light emitting diode layer bonded to a transparent substrate after removing a growth substrate on which the light emitting layer is grown, and a lens that refracts light emitted from the light emitting diode is formed on the transparent substrate.

Abstract: A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.

Abstract: A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.

Abstract: A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.

Abstract: An optical semiconductor lighting apparatus including a housing with a first end portion and a second end portion that is open, a light source module disposed in the housing, a fan disposed adjacent to the light source module in the housing, the fan rotating in a first direction to blow air toward the light source module, and a reflector disposed adjacent to the second end portion of the housing, the reflector enhancing an illumination scope. A moving path, in which at least a portion of the air drawn into the housing by the fan externally flows through the light source module, is formed in the housing.

Abstract: A lighting device includes a heat sink for dissipating heat from a light source. The heat sink is located between an inner case and an outer case, and a power controller is located in the inner case. The light source may include one or more light emitting diodes.

Abstract: A lighting device includes a heat sink for dissipating heat from a light source. The heat sink is located between an inner case and an outer case, and a power controller is located in the inner case. The light source may include one or more light emitting diodes.

Abstract: An optical semiconductor based illuminating apparatus including a housing having an opening portion, a lighting unit disposed adjacent to the housing that includes at least one optical semiconductor, a power supply mounted within the housing that supplies power to the lighting unit, and a gate unit connected to the opening part that opens and shuts the inner housing.