Abstract: The present specification provides an electrode laminate including a substrate, an electrode provided on the substrate, and an auxiliary electrode electrically connecting to the electrode and has a laminated structure of a first layer having reflectivity of 80% or greater at a wavelength of 550 nm and a second layer having a higher etching rate compared to the first layer, wherein the auxiliary electrode is either provided between the electrode and the substrate, or provided so that the first layer of the auxiliary electrode adjoins at least part of the side surface of the electrode, and an organic light emitting device including the electrode laminate.

Abstract: The present specification provides an electrode laminate including a substrate, an electrode provided on the substrate, and an auxiliary electrode electrically connecting to the electrode and has a laminated structure of a first layer having reflectivity of 80% or greater at a wavelength of 550 nm and a second layer having a higher etching rate compared to the first layer, wherein the auxiliary electrode is either provided between the electrode and the substrate, or provided so that the first layer of the auxiliary electrode adjoins at least part of the side surface of the electrode, and an organic light emitting device including the electrode laminate.

Abstract: A wireless power transmitter configured to wirelessly transmit power to an electronic device is provided.

Abstract: Disclosed is a technique capable of effectively estimating a three-dimensional location of a target node through a geometric access by using location information of three anchor nodes. The height of a tetrahedron is calculated. Projected estimated distances, obtained by projecting the estimated distances on a plane H formed by the three anchor nodes, and coordinate values of the three anchor nodes converted on a second coordinate system of the plane H are obtained, and then trilateration is performed using the projected estimated distances and the converted coordinate values so as to calculate an estimated location, projected on the plane H, of the target node. A coordinate value of the calculated estimated location is converted into a coordinate value on a first coordinate system and then the height of the tetrahedron is reflected thereto so as to obtain a coordinate value of the three-dimensional estimated location of the target node.

Abstract: An apparatus for connecting to an update server includes an update unit configured to connect to the update server over a network using a pre-stored domain name address of the update server and an IP address acquisition unit configured to acquire an IP address of the connected update server. The IP address acquired by the IP address acquisition unit is stored as a trusted IP address in a storage unit. The apparatus further includes a reconnection processing unit configured to fetch the trusted IP address of the update server and try connecting to the update server using the trusted IP address in the case of failure to connect to the update server using the pre-stored domain name address.

Abstract: The present specification provides an electrode laminate including a substrate, an electrode provided on the substrate, and an auxiliary electrode electrically connecting to the electrode and has a laminated structure of a first layer having reflectivity of 80% or greater at a wavelength of 550 nm and a second layer having a higher etching rate compared to the first layer, wherein the auxiliary electrode is either provided between the electrode and the substrate, or provided so that the first layer of the auxiliary electrode adjoins at least part of the side surface of the electrode, and an organic light emitting device including the electrode laminate.

Abstract: A bonding structure of a semiconductor package includes: a first conductive member configured to transmit an electrical signal; and a bonding pad configured to be electrically coupled to a surface of the first conductive member and comprising a plurality of sub bonding pads.

Abstract: A method and an apparatus for estimating a long-term transfer rate of a terminal are provided. The method for estimating the long-term transfer rate includes: calculating a burst transfer rate of each pilot signal which is transmitted from a base station to a target terminal to calculate a long-term transfer rate; and calculating a long-term transfer rate of the target terminal using distribution of the calculated burst transfer rates and the number (N) of terminals that are serviced by the base station.

Abstract: Provided are an anti-static and anti-microbial surface treatment agent including a quaternary ammonium salt compound as an active ingredient and a method of preventing a polymer fiber from developing static electricity by using the surface treatment agent. The quaternary ammonium salt compound has excellent anti-static and anti-microbial effects for the prevention or improvement of static electricity in a polymer fiber. Accordingly, the quaternary ammonium salt compound is suitable for use as a fabric softener, or an anti-static agent, and also, provides anti-microbial effects to a polymer fiber.

Abstract: A bonding structure of a semiconductor package includes: a first conductive member configured to transmit an electrical signal; and a bonding pad configured to be electrically coupled to a surface of the first conductive member and comprising a plurality of sub bonding pads.

Abstract: A semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface, a chip pad disposed on the first surface of the substrate, and a through-silicon via (TSV) including a plurality of sub vias electrically connected to the chip pad at different positions.

Abstract: A stacked semiconductor package includes a plurality of semiconductor chips each including a substrate having one surface, the other surface which faces away from the one surface and side surfaces which connect the one surface and the other surface, through-silicon vias which pass through the one surface and the other surface of the substrate, repair pads which are exposed on the side surfaces of the substrate, and wiring lines which electrically connect the through-silicon vias with the repair pads, the plurality of semiconductor chips being stacked such that through-silicon vias of the semiconductor chips are connected with one another; and interconnections electrically connecting the repair pads of the semiconductor chips.

Abstract: A bonding structure of a semiconductor package includes: a first conductive member configured to transmit an electrical signal; and a bonding pad configured to be electrically coupled to a surface of the first conductive member and comprising a plurality of sub bonding pads.

Abstract: A method and an apparatus for estimating a long-term transfer rate of a terminal are provided. The method for estimating the long-term transfer rate includes: calculating a burst transfer rate of each pilot signal which is transmitted from a base station to a target terminal to calculate a long-term transfer rate; and calculating a long-term transfer rate of the target terminal using distribution of the calculated burst transfer rates and the number (N) of terminals that are serviced by the base station.

Abstract: An apparatus for connecting to an update server includes an update unit configured to connect to the update server over a network using a pre-stored domain name address of the update server and an IP address acquisition unit configured to acquire an IP address of the connected update server. The IP address acquired by the IP address acquisition unit is stored as a trusted IP address in a storage unit. The apparatus further includes a reconnection processing unit configured to fetch the trusted IP address of the update server and try connecting to the update server using the trusted IP address in the case of failure to connect to the update server using the pre-stored domain name address.

Abstract: A display driver integrated circuit (IC) that stores an output mode of driving circuit control signal in a non-volatile memory and a method of outputting the driving circuit control signal, wherein the display drive IC fixes the driving circuit control signal values using fixation wire disposed on top layers of the display driver IC, and a method of manufacturing the display driver IC.

Abstract: A semiconductor chip and semiconductor package with stack chip structure include align patterns. The align patterns are formed of magnetic materials having opposite polarities on the top and bottom of the semiconductor chip. Thus, when the plurality of chips are stacked on the substrate in order for the packaging, the semiconductor chips may be exactly aligned by the magnetic force between the align patterns of the vertically stacked chips. The semiconductor package includes a plurality of stacked semiconductor chips and a filling material. Each of the stacked semiconductor chips includes a semiconductor substrate having a first surface and a second surface, wherein a circuit pattern such as a bonding pad is formed on the first surface, and a first align pattern formed on the first surface of the semiconductor substrate, wherein the first align pattern is formed of a magnetic material.

Abstract: A stacked semiconductor package includes a plurality of semiconductor chips each including a substrate having one surface, the other surface which faces away from the one surface and side surfaces which connect the one surface and the other surface, through-silicon vias which pass through the one surface and the other surface of the substrate, repair pads which are exposed on the side surfaces of the substrate, and wiring lines which electrically connect the through-silicon vias with the repair pads, the plurality of semiconductor chips being stacked such that through-silicon vias of the semiconductor chips are connected with one another; and interconnections electrically connecting the repair pads of the semiconductor chips.

Abstract: Provided are an anti-static and anti-microbial surface treatment agent including a quaternary ammonium salt compound as an active ingredient and a method of preventing a polymer fiber from developing static electricity by using the surface treatment agent. The quaternary ammonium salt compound has excellent anti-static and anti-microbial effects for the prevention or improvement of static electricity in a polymer fiber. Accordingly, the quaternary ammonium salt compound is suitable for use as a fabric softener, or an anti-static agent, and also, provides anti-microbial effects to a polymer fiber.

Abstract: A wireless localization technology using efficient multilateration in a wireless sensor network is disclosed. After calculating estimated distances from each of at least three reference nodes to a blind node using received signal strength of wireless signals that the at least three reference nodes received from the blind node, the estimated location of the blind node is obtained through multilateration using the calculated estimated distances. To correct error in the estimated location, the estimated distances are used, and the error correction direction and error correction distance for the estimated location are calculated by applying a largest weight to the reference node closest to the estimated location. The error of the estimated location is corrected by move the estimated location of the blind node by the calculated error correction direction and error correction distance. Calculation for the error correction is very simple and fast.