Patents by Inventor Seong Jin Lee

Seong Jin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170077891
    Abstract: Disclosed is a technology that enables an elastic composite filter to have a capacitor to remove noise. The elastic composite includes a functional material layer; electrode patterns disposed on top and bottom surfaces of the material layer, respectively; and a conductive elastic member adhered onto the top electrode pattern, wherein the elastic member is coupled electrically and mechanically to the top electrode pattern to be used as an electrode, and the elastic member is in direct contact with a conductive object to provide elasticity.
    Type: Application
    Filed: September 9, 2016
    Publication date: March 16, 2017
    Inventors: Sun-Ki Kim, Byung-Sun Jung, Jung-Sup Choi, Seong-Jin Lee, Kwang-Hwi Choi
  • Publication number: 20170005538
    Abstract: Disclosed is an insulator of a motor, including a first side wall portion and a second side wall portion in which a coil is wound on outsides thereof, and which are disposed to face each other, to form an accommodation space at insides thereof, and also to form an entrance portion through which a stator is inserted; a connecting portion integrally formed with the first side wall portion and the second side wall portion; and a clip portion formed to protrude from at least one of an end of the first side wall portion and an end of the second side wall portion, and disposed at the entrance portion. Therefore, assemblability of the insulator with the stator can be ensured, and a manufacturing cost and a manufacturing time can be reduced.
    Type: Application
    Filed: June 29, 2016
    Publication date: January 5, 2017
    Inventor: Seong Jin Lee
  • Patent number: 9375901
    Abstract: A conductive elastic member includes a polymer foamed body having elasticity and including an open cell structure having a sheet shape including a plurality of pores vertically connecting upper and lower sides without skin layers, conductive elastic rubber coating layers formed by adhering liquid elastic rubber including conductive particles mixed therein to the upper and lower sides of the polymer foamed body and inner surfaces of the pores by hardening, a conductive polymer cover layer formed by adhering liquid elastic polymers including conductive particles mixed therein to an upper side of the conductive elastic rubber coating layer formed on the upper side of the polymer foamed body by hardening the polymers, and a conductive base material adhered to a lower side of the conductive elastic rubber coating layer formed on the lower side of the polymer foamed body by hardening the elastic rubber.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: June 28, 2016
    Assignees: Joinset Co., Ltd.
    Inventors: Seong-Jin Lee, Hyun-Ill Lee, Eung-Won Kim, Sun-Ki Kim, Byung-Sun Jung
  • Publication number: 20150213920
    Abstract: A conductive elastic member includes a polymer foamed body having elasticity and including an open cell structure having a sheet shape including a plurality of pores vertically connecting upper and lower sides without skin layers, conductive elastic rubber coating layers formed by adhering liquid elastic rubber including conductive particles mixed therein to the upper and lower sides of the polymer foamed body and inner surfaces of the pores by hardening, a conductive polymer cover layer formed by adhering liquid elastic polymers including conductive particles mixed therein to an upper side of the conductive elastic rubber coating layer formed on the upper side of the polymer foamed body by hardening the polymers, and a conductive base material adhered to a lower side of the conductive elastic rubber coating layer formed on the lower side of the polymer foamed body by hardening the elastic rubber.
    Type: Application
    Filed: January 22, 2015
    Publication date: July 30, 2015
    Inventors: Seong-Jin Lee, Hyun-Ill Lee, Eung-Won Kim, Sun-Ki Kim, Byung-Sun Jung
  • Patent number: 8861159
    Abstract: The semiconductor device is provided. The semiconductor device includes a substrate, an electrostatic discharge layer disposed on the substrate and including a plurality of electrostatic discharge circuits, at least one semiconductor chip stacked on the electrostatic discharge layer, and a plurality of vertical electrical connections which pass through the at least one semiconductor chip and the electrostatic discharge layer to connect the at least one semiconductor chip to the semiconductor substrate. The vertical electrical connections are connected to the electrostatic discharge circuits, respectively.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: October 14, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seong-Jin Lee, Jang Seok Choi
  • Patent number: 8599539
    Abstract: Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: December 3, 2013
    Assignees: Joinset Co., Ltd.
    Inventors: Sun-Ki Kim, Seong-Jin Lee, Ki-Han Park
  • Patent number: 8492770
    Abstract: A thin film transistor includes a gate electrode formed on a substrate, a semiconductor pattern overlapped with the gate electrode, a source electrode overlapped with a first end of the semiconductor pattern and a drain electrode overlapped with a second end of the semiconductor pattern and spaced apart from the source electrode. The semiconductor pattern includes an amorphous multi-elements compound including a II B element and a VI A element or including a III A element and a V A element and having an electron mobility no less than 1.0 cm2/Vs and an amorphous phase, wherein the VI A element excludes oxygen. Thus, a driving characteristic of the thin film transistor may be improved.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: July 23, 2013
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae-Woo Park, Je-Hun Lee, Seong-Jin Lee, Yeon-Hong Kim
  • Patent number: 8315763
    Abstract: The present invention relates to a control apparatus for vehicle, and in particular, to a control apparatus for vehicle that is capable of changing an operation mode of body controller of vehicle as well as changing various electronic instruments in the vehicle. In particular embodiments, a control apparatus for vehicle that controls various electronic instruments of vehicle according to the present invention includes a key input unit that receives an operation mode selection signal for one of a plurality of operation modes for a specific body controller; and a multimedia CAN communications unit that sends the operation mode selection signal to a body controller through a gateway, receives and displays an operation mode change confirmation signal from the body controller through the gateway.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: November 20, 2012
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Seong Jin Lee
  • Publication number: 20120106011
    Abstract: The semiconductor device is provided. The semiconductor device includes a substrate, an electrostatic discharge layer disposed on the substrate and including a plurality of electrostatic discharge circuits, at least one semiconductor chip stacked on the electrostatic discharge layer, and a plurality of vertical electrical connections which pass through the at least one semiconductor chip and the electrostatic discharge layer to connect the at least one semiconductor chip to the semiconductor substrate. The vertical electrical connections are connected to the electrostatic discharge circuits, respectively.
    Type: Application
    Filed: September 7, 2011
    Publication date: May 3, 2012
    Inventors: Seong-Jin Lee, Jang Seok Choi
  • Publication number: 20120026659
    Abstract: Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.
    Type: Application
    Filed: July 29, 2011
    Publication date: February 2, 2012
    Applicants: JOINSET CO., LTD.
    Inventors: SUN-KI KIM, Seong-Jin Lee, Ki-Han Park
  • Publication number: 20100131156
    Abstract: The present invention relates to a control apparatus for vehicle, and in particular, to a control apparatus for vehicle that is capable of changing an operation mode of body controller of vehicle as well as changing various electronic instruments in the vehicle. In particular embodiments, a control apparatus for vehicle that controls various electronic instruments of vehicle according to the present invention includes a key input unit that receives an operation mode selection signal for one of a plurality of operation modes for a specific body controller; and a multimedia CAN communications unit that sends the operation mode selection signal to a body controller through a gateway, receives and displays an operation mode change confirmation signal from the body controller through the gateway.
    Type: Application
    Filed: August 4, 2009
    Publication date: May 27, 2010
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Seong Jin Lee
  • Patent number: D644761
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: September 6, 2011
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seong Jin Lee, Ki Tae Kang, Do Hyoung Kim
  • Patent number: D647639
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: October 25, 2011
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seong Jin Lee, Hyun Gu Kang, Do Hyoung Kim
  • Patent number: D661414
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: June 5, 2012
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Ki Tae Kang, Seong Jin Lee