Abstract: A threshold voltage measuring device may include a metal-oxide-semiconductor (MOS) transistor, a drain voltage clamping circuit configured to control a drain voltage of the MOS transistor wherein the drain voltage having a substantially constant level, and a constant current supply circuit configured to cause a drain-source current to flow through the MOS transistor wherein the drain-source current having a substantially constant magnitude.

Abstract: A data read operation method of a memory device includes applying a read voltage having a first preparation level and a first target level to a word line of a selected cell in the memory device to read a program state of the selected cell, applying a first read pass voltage having a second preparation level and a second target level to at least one word line of first non-selected cells not adjacent to the selected cell and in the same string as the selected cell, and applying a second read pass voltage having a third target level to a word line of at least one second non-selected cell adjacent to the selected cell.

Abstract: Adaptive pulse generation circuits for clocking pulse latches with minimum hold time are provided. In one aspect, an adaptive pulse generation circuit employs a dynamic XOR-based logic gate configured to provide a pulse generation signal based on an XOR-based function of data input and data output-based signals of a pulse latch. A pull-down keeper circuit is configured to pull the pulse generation signal to a ground voltage in response to the pulse generation signal being in an inactive state while the clock signal is in an active state. A logic circuit is configured to generate an adaptive pulse signal to clock a pulse latch in response to the pulse generation signal and the clock signal being in an active state. This configuration results in the pulse width of the adaptive pulse signal corresponding to the input-to-output delay of the pulse latch.

Abstract: A 5 Transistor Static Random Access Memory (5T SRAM) is designed for reduced cell size and immunity to process variation. The 5T SRAM includes a storage element for storing data, wherein the storage element is coupled to a first voltage and a ground voltage. The storage element can include symmetrically sized cross-coupled inverters. A single access transistor controls read and write operations on the storage element. Control logic is configured to generate a value of the first voltage a write operation that is different from the value of the first voltage for a read operation.

Abstract: Error detection and correction decoding apparatus performs single error correction-double error detection (SEC-DED) or double error correction-triple error detection (DEC-TED) depending on whether the data input contains a single-bit error or a multiple-bit error, to reduce power consumption and latency in case of single-bit errors and to provide powerful error correction in case of multiple-bit errors.

Abstract: Stable SRAM cells utilizing Independent Gate FinFET architectures provide improvements over conventional SRAM cells in device parameters such as Read Static Noise Margin (RSNM) and Write Noise Margin (WNM). Exemplary SRAM cells comprise a pair of storage nodes, a pair of bit lines, a pair of pull-up devices, a pair of pull-down devices and a pair of pass-gate devices. A first control signal and a second control signal are configured to adjust drive strengths of the pass-gate devices, and a third control signal is configured to adjust drive strengths of the pull-up devices, wherein the first control signal is routed orthogonal to a bit line direction, and the second and third control signals are routed in a direction same as the bit line direction. RSNM and WNM are improved by adjusting drive strengths of the pull-up and pass-gate devices during read and write operations.

Abstract: Metal-oxide semiconductor (MOS) transistor offset-cancelling (OC), zero-sensing (ZS) dead zone, current-latched sense amplifiers (SAs) (CLSAs) (OCZS-SAs) for sensing differential voltages are provided. An OCZS-SA is configured to amplify received differential data and reference input voltages with a smaller sense amplifier offset voltage to provide larger sense margin between different storage states of memory bitcell(s). The OCZS-SA is configured to cancel out offset voltages of input and complement input transistors, and keep the input and complement input transistors in their activated state during sensing phases so that sensing is not performed in their “dead zones” when their gate-to-source voltage (Vgs) is below their respective threshold voltages.

Abstract: Disclosed is an apparatus for counting single photons including an edge combiner configured to detect an edge of each of applied clocks using a plurality of Phase-Locked Loops (PLL) to generate a combined signal; a sampling unit configured to sample all events occurring in each SPAD of a single photon detection diode (SPAD) array using an OR tree and an XOR tree; and a calculation unit configured to count the sampled events based on the combined signal to count single photons.

Abstract: Disclosed is a local bit line-sharing memory device, including a plurality of memory cells that share a local bit line pair; a pre-charging unit that is connected to a write bit line pair and pre-charges the local bit line pair; and a data reading unit that reads data when bit line voltage pre-charged in a memory cell selected from the memory cells is discharged.

Abstract: Error detection and correction decoding apparatus performs single error correction-double error detection (SEC-DED) or double error correction-triple error detection (DEC-TED) depending on whether the data input contains a single-bit error or a multiple-bit error, to reduce power consumption and latency in case of single-bit errors and to provide powerful error correction in case of multiple-bit errors.

Abstract: A programming method of a non-volatile memory device including a plurality of memory cells arranged in a plurality of cell strings includes sequentially applying a first pass voltage to unselected word lines of word lines connected to the plurality of memory cells during a first interval and a second pass voltage higher than the first pass voltage to the unselected word lines during a second interval; and applying a discharge voltage lower than a program voltage to a selected word line of the word lines connected to the plurality of memory cells after applying the program voltage to the selected word line in the first interval, and applying the program voltage to the selected word line during the second interval.

Abstract: A data read operation method of a memory device includes applying a read voltage having a first preparation level and a first target level to a word line of a selected cell in the memory device to read a program state of the selected cell, applying a first read pass voltage having a second preparation level and a second target level to at least one word line of first non-selected cells not adjacent to the selected cell and in the same string as the selected cell, and applying a second read pass voltage having a third target level to a word line of at least one second non-selected cell adjacent to the selected cell.

Abstract: Non-volatile (NV)-content addressable memory (CAM) (NV-CAM) cells employing differential magnetic tunnel junction (MTJ) sensing for increased sense margin are disclosed. By the NV-CAM cells employing MTJ differential sensing, differential cell voltages can be generated for match and mismatch conditions in response to search operations. The differential cell voltages are amplified to provide a larger match line voltage differential for match and mismatch conditions, thus providing a larger sense margin between match and mismatch conditions. For example, a cross-coupled transistor sense amplifier employing positive feedback may be employed to amplify the differential cell voltages to provide a larger match line voltage differential for match and mismatch conditions. Providing NV-CAM cells that have a larger sense margin can mitigate sensing issues for increased search operation reliability.

Abstract: Systems and methods relate to operations on a magnetoresistive random access memory (MRAM) bit cell using a circuit configured in multiple phases. In a sensing circuit phase, the circuit configured to determine a first differential voltage between a data voltage across the bit cell and a reference voltage. In a pre-amplifying phase, the circuit is configured to pre-amplify the first differential voltage to generate a pre-amplified differential voltage, which does not have offset voltages that may arise due to process variations. In a sense amplifier phase, the circuit is configured to amplify the pre-amplified differential voltage in a latch. Generation of the pre-amplified differential voltage cancels offset voltages which may arise in the latch. In a write phase, the circuit is further configured to write a write data value to the MRAM bit cell.

Abstract: A method of sensing a data value stored at a memory cell according to a dual mode sensing scheme includes determining, at a sensing circuit, whether a resistance of a magnetic tunnel junction (MTJ) element is within a first range of resistance values, within a second range of resistance values, or within a third range of resistance values. The MTJ element is included in the memory cell. The method also includes determining the data value stored at the memory cell according to a first mode of operation if the resistance of the MTJ element is within the first range of resistance values or within the third range of resistance values. The method further includes determining the data value stored at the memory cell according to a second mode of operation if the resistance of the MTJ element is within the second range of resistance values.

Abstract: Error detection and correction decoding apparatus performs single error correction-double error detection (SEC-DED) or double error correction-triple error detection (DEC-TED) depending on whether the data input contains a single-bit error or a multiple-bit error, to reduce power consumption and latency in case of single-bit errors and to provide powerful error correction in case of multiple-bit errors.

Abstract: Methods and apparatuses for static memory cells. A static memory cell may include a first pass gate transistor including a first back gate node and a second pass gate transistor including a second back gate node. The static memory cell may include a first pull down transistor including a third back gate node and a second pull down transistor including a fourth back gate node. The source node of the first pull down transistor, source node of the second pull down transistor, and first, second, third, and fourth back gate nodes are electrically coupled to each other to form a common node.

Abstract: Provided is a semiconductor memory device. The semiconductor memory device includes: a memory cell; a sensing circuit connected to the memory cell via a first bit line and a second bit line different from the first bit line, the sensing circuit configured to sense data stored in the memory cell; and a bit line voltage control circuit connected to the memory cell via the first bit line and the second bit line, the bit line voltage control circuit configured to precharge the first bit line to a first voltage that is lower than a supply voltage and to precharge the second bit line to a second voltage that is lower than the supply voltage and is different from the first voltage.

Abstract: Provided is a temperature sensing circuit and a temperature sensing method including a delay unit delaying an input clock signal to generate a feedback clock signal, and including logic gates of which delay times are variable according to temperature, a delay control unit comparing the feedback clock signal with a reference clock signal and controlling each of the logic gates of the delay unit according to the comparison result, and an input signal control unit selecting, as the input clock signal, any one of the feedback clock signal and the reference clock signal to input the input clock signal to the delay unit.

Abstract: A threshold voltage measuring device may include a metal-oxide-semiconductor (MOS) transistor, a drain voltage clamping circuit configured to control a drain voltage of the MOS transistor wherein the drain voltage having a substantially constant level, and a constant current supply circuit configured to cause a drain-source current to flow through the MOS transistor wherein the drain-source current having a substantially constant magnitude.