Abstract: A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.

Abstract: This laser cutting process makes use of a short pulse laser in combination with optics that generate a focal line to fully perforate the body of a range of ion-exchangeable glass compositions. The glass is moved relative to the laser beam to create perforated lines that trace out the shape of any desired parts. The glass may be cut pre-ion exchange, or may be cut post-ion exchange. The laser creates hole-like defect zones that penetrate the full depth the glass, of approximately 1 micron in diameter. These perforations or defect regions are generally spaced from 1 to 15 microns apart.

Abstract: A method of laser drilling, forming a perforation, cutting, separating or otherwise processing a material includes focusing a pulsed laser beam into a laser beam focal line, and directing the laser beam focal line into a workpiece comprising a stack including at least: a first layer, facing the laser beam, the first layer being the material to be laser processed, a second layer comprising a carrier layer, and a laser beam disruption element located between the first and second layers, the laser beam focal line generating an induced absorption within the material of the first layer, the induced absorption producing a defect line along the laser beam focal line within the material of the first layer. The beam disruption element may be a beam disruption layer or a beam disruption interface.

Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Abstract: A system for laser drilling of a material includes a pulsed laser configured to produce a pulsed laser beam having a wavelength less than or equal to about 850 nm, the wavelength selected such that the material is substantially transparent at this wavelength. The system further includes an optical assembly positioned in the beam path of the laser, configured to transform the laser beam into a laser beam focal line oriented along the beam propagation direction, on a beam emergence side of the optical assembly.

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Abstract: Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.

Abstract: A method of cutting an article (172) from a chemically strengthened glass substrate (110) includes generating a pulsed laser beam (108) from a laser source (106). The pulsed laser beam (108) may have a pulse duration of less than about 1000 fs and an output wavelength such that the chemically strengthened glass substrate (110) is substantially transparent to the pulsed laser beam (108). The pulsed laser beam (108) may be focused to form a beam waist (109) that is positioned in the same horizontal plane as an inner tensile region (124) of the chemically strengthened glass substrate (110). The beam waist (109) may be translated in a first pass along a cut line (116), wherein the beam waist (109) traverses an edge (111) of the chemically strengthened glass substrate. The beam waist (113) may then be translated in a second pass along the cut line (116) such that a crack (119) propagates from the edge (113) along the cut line (116) ahead of the translated beam waist (109) during the second pass.

Abstract: This disclosure describes a process for strengthening, by ion-exchange, the edges of an article separated from a large glass sheet after the sheet has been ion-exchanged to strengthen by exposing only the one or a plurality of the edges of the separated article to an ion-exchange medium (for example without limitation, a salt, paste, frit, glass) while the glass surface is maintained at temperatures less than 200° C.

Abstract: Glass interposer panels and methods for forming the same are described herein. The interposer panels include a glass substrate core formed from an ion-exchangeable glass. A first layer of compressive stress may extend from a first surface of the glass substrate into the thickness T of the glass substrate core to a first depth of layer D1. A second layer of compressive stress may be spaced apart from the first layer of compressive stress and extending from a second surface of the glass substrate core into the thickness T of the glass substrate core to a second depth of layer D2. A plurality of through-vias may extend through the thickness T of the glass substrate core. Each through-via is surrounded by an intermediate zone of compressive stress that extends from the first layer of compressive stress to the second layer of compressive stress adjacent to a sidewall of each through-via.

Abstract: Methods for separating glass articles from glass substrate sheets are described herein. In one embodiment, a method includes focusing a laser beam on at least one surface of the glass substrate sheet such that the laser beam has an asymmetrical intensity distribution at the at least one surface of the glass substrate sheet. The method further includes translating the laser beam on the at least one surface of the glass substrate sheet along a desired groove line to form at least one groove on the at least one surface of the glass substrate sheet. The at least one groove extends partially through a thickness of the glass substrate sheet along the desired groove line and has bevelled or chamfered walls. The glass article may be separated from the glass substrate sheet along the at least one groove.

Abstract: Methods for separating strengthened glass articles from glass substrate sheets and strengthened glass substrate sheets are described herein. In one embodiment, a method of separating a glass article from a glass substrate sheet includes forming at least one groove on at least one surface of the glass substrate sheet. The at least one groove continuously extends around a perimeter of the glass article and extends partially through a thickness of the glass substrate sheet. The method further includes strengthening the glass substrate sheet by a strengthening process and separating the glass article from the glass substrate sheet along the at least one groove such that one or more edges of the glass article are under compressive stress. In another embodiment, a strengthened glass substrate sheet includes an ion exchanged glass having one or more grooves in one or more strengthened surface layers, the one or more grooves defining glass articles.

Abstract: Glass interposer panels and methods for forming the same are described herein. The interposer panels include a glass substrate core formed from an ion-exchangeable glass. A first layer of compressive stress may extend from a first surface of the glass substrate into the thickness T of the glass substrate core to a first depth of layer D1. A second layer of compressive stress may be spaced apart from the first layer of compressive stress and extending from a second surface of the glass substrate core into the thickness T of the glass substrate core to a second depth of layer D2. A plurality of through-vias may extend through the thickness T of the glass substrate core. Each through-via is surrounded by an intermediate zone of compressive stress that extends from the first layer of compressive stress to the second layer of compressive stress adjacent to a sidewall of each through-via.

Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

Abstract: Strengthened glass substrate sheets and methods of fabricating glass panels from glass substrate sheets are disclosed. In one embodiment, a method includes forming at least one series of holes through a thickness of the glass substrate sheet, wherein the at least one series of holes defines a perimeter of the glass panel to be separated from the glass substrate sheet. The method further includes strengthening the glass substrate sheet by a strengthening process, and separating the glass panel from the glass substrate sheet along the at least one series of holes. At least a portion of one or more edges of the glass panel has an associated edge compressive layer. In another embodiment, a strengthened glass substrate sheet includes at least one series of holes that defines a perimeter of one or more glass panels to be separated from the strengthened glass substrate sheet.

Abstract: Methods for separating glass articles from glass substrate sheets are described herein. In one embodiment, a method includes focusing a laser beam on at least one surface of the glass substrate sheet such that the laser beam has an asymmetrical intensity distribution at the at least one surface of the glass substrate sheet. The method further includes translating the laser beam on the at least one surface of the glass substrate sheet along a desired groove line to form at least one groove on the at least one surface of the glass substrate sheet. The at least one groove extends partially through a thickness of the glass substrate sheet along the desired groove line and has bevelled or chamfered walls. The glass article may be separated from the glass substrate sheet along the at least one groove.

Abstract: A method of cutting an article (172) from a chemically strengthened glass substrate (110) includes generating a pulsed laser beam (108) from a laser source (106). The pulsed laser beam (108) may have a pulse duration of less than about 1000 fs and an output wavelength such that the chemically strengthened glass substrate (110) is substantially transparent to the pulsed laser beam (108). The pulsed laser beam (108) may be focused to form a beam waist (109) that is positioned in the same horizontal plane as an inner tensile region (124) of the chemically strengthened glass substrate (110). The beam waist (109) may be translated in a first pass along a cut line (116), wherein the beam waist (109) traverses an edge (111) of the chemically strengthened glass substrate. The beam waist (113) may then be translated in a second pass along the cut line (116) such that a crack (119) propagates from the edge (113) along the cut line (116) ahead of the translated beam waist (109) during the second pass.

Abstract: A method is provided for separating or dividing strengthened glass articles, particularly strengthened glass sheets, into at least two pieces, one of which has a predetermined shape and/or dimension. A flaw is initiated in the glass at a depth that is greater than the depth of the strengthened surface layer of the glass, and a vent extending from the flaw is created at a vent depth that is greater than the depth of and outside the strengthened surface layer to at least partially separate the glass. In one embodiment, the vent is generated by treating the glass with a laser to heat the glass to a temperature in a range from about 50° C. below the strain point of the glass up to a temperature between the strain point and the anneal point of the glass. A glass article having at least one strengthened surface and at least one edge having an average edge strength of at least 200 MPa is also described.