Abstract: Provided herein is a semiconductor device and a method of manufacturing the same. The method includes alternately forming sacrificial layers and interlayer insulating layers on a semiconductor substrate. The method further includes forming a slit to expose the sacrificial layers by etching through the sacrificial layers and the interlayer insulating layers and forming interlayer openings by removing the exposed sacrificial layers. The method also includes depositing a conductive material in the interlayer openings and forming seams in which core patterns are deposited. The method additionally includes oxidizing a portion of the conductive material in the interlayer openings using a wet etching process and forming conductive patterns by removing the oxidized portion of the conductive material from the interlayer openings while leaving the seams intact.

Abstract: Provided herein is a semiconductor device and a method of manufacturing the same. The method includes alternately forming sacrificial layers and interlayer insulating layers on a semiconductor substrate. The method further includes forming a slit to expose the sacrificial layers by etching through the sacrificial layers and the interlayer insulating layers and forming interlayer openings by removing the exposed sacrificial layers. The method also includes depositing a conductive material in the interlayer openings and forming seams in which core patterns are deposited. The method additionally includes oxidizing a portion of the conductive material in the interlayer openings using a wet etching process and forming conductive patterns by removing the oxidized portion of the conductive material from the interlayer openings while leaving the seams intact.

Abstract: A semiconductor device includes a first semiconductor layer, a second semiconductor layer spaced apart from the first semiconductor layer and disposed on the first semiconductor layer, a gate stack structure disposed on the second semiconductor layer, a third semiconductor layer positioned between the first and second semiconductor layers, and a channel pillar passing through the gate stack structure, the second semiconductor layer and the third semiconductor layer and extending into the first semiconductor layer.

Abstract: Provided herein is a semiconductor device and a method of manufacturing the same. The method includes alternately forming sacrificial layers and interlayer insulating layers on a semiconductor substrate. The method further includes forming a slit to expose the sacrificial layers by etching through the sacrificial layers and the interlayer insulating layers and forming interlayer openings by removing the exposed sacrificial layers. The method also includes depositing a conductive material in the interlayer openings and forming seams in which core patterns are deposited. The method additionally includes oxidizing a portion of the conductive material in the interlayer openings using a wet etching process and forming conductive patterns by removing the oxidized portion of the conductive material from the interlayer openings while leaving the seams intact.

Abstract: A semiconductor device includes a first semiconductor layer, a second semiconductor layer spaced apart from the first semiconductor layer and disposed on the first semiconductor layer, a gate stack structure disposed on the second semiconductor layer, a third semiconductor layer positioned between the first and second semiconductor layers, and a channel pillar passing through the gate stack structure, the second semiconductor layer and the third semiconductor layer and extending into the first semiconductor layer.

Abstract: An electronic device includes at least one communication circuit, and a processor electrically connected with the at least one communication circuit. The processor may be configured to select an external electronic device in response to a user input, broadcast, through the at least one communication circuit using a first protocol, a connection request for a second protocol-based communication with the external electronic device, receive a response to the connection request from the external electronic device through the at least one communication circuit, and perform communication with the external electronic device through the at least one communication circuit using a second protocol, based on connection information about the external electronic device for the second protocol-based communication, the connection information being contained in the response.

Abstract: A method of controlling a location information system in a vehicle includes: establishing a communication path between a control unit equipped in the vehicle and a smart device; acquiring, by the control unit of the vehicle, first data including a first heading value and first location information; transmitting, by the control unit of the vehicle, the measured first data to the smart device; receiving, at the smart device, the first data from the control unit of the vehicle via the communication path; acquiring, by the smart device, second data including a second heading value and second location information; comparing, by the smart device, the first data with the second data; and updating, by the smart device, information of a navigation function of the smart device based on the first data or the second data depending on the comparing of the first data with the second data.

Abstract: A semiconductor device includes a first semiconductor layer, a second semiconductor layer spaced apart from the first semiconductor layer and disposed on the first semiconductor layer, a gate stack structure disposed on the second semiconductor layer, a third semiconductor layer positioned between the first and second semiconductor layers, and a channel pillar passing through the gate stack structure, the second semiconductor layer and the third semiconductor layer and extending into the first semiconductor layer.

Abstract: A method for controlling a mobile device engaging with a head unit of vehicle includes executing a vehicle engagement application installed in the mobile device, determining first and second spaces having the same size in a frame buffer, monitoring whether a first data responsive to an execution of the vehicle engagement application is written in the first and second spaces, and if the first data is not written in the first and second spaces, performing an autonomous recovery process for the vehicle engagement application.

Abstract: Disclosed is a method of manufacturing a semiconductor device, including: forming a multi-layered stack; forming a vertical hole in the stack; forming a plurality of material layers over a bottom and a sidewall of the vertical hole, wherein the plurality of material layers includes a first material layer and a second material layer, wherein the second material layer is provided under the first material layer; patterning the first material layer located over the bottom of the vertical hole to form a first opening, wherein the first opening exposes the second material layer; and patterning the second material layer exposed by the first opening using a difference in an etch rate between the first material layer and the second material layer.

Abstract: A method and apparatus for providing a security service for a vehicle-dedicated data channel in linking between a vehicle head unit and an external device is disclosed. The method of providing the security service for the vehicle-dedicated data channel may include: transmitting, to the terminal, a predetermined integrity verification request message for requesting integrity verification of application software and an operating system included in the terminal; receiving an integrity verification result message from the terminal, exchanging a plaintext symmetric key with the terminal when integrity of the operating system and the application software is successfully verified according to the integrity verification result message; and establishing a vehicle-dedicated data channel to the terminal and transmitting and receiving a packet encrypted using the plaintext symmetric key through the established vehicle-dedicated data channel when the plaintext symmetric key is successfully exchanged.

Abstract: Disclosed are a method and apparatus for providing a linking service between a vehicle AVN system and a smartphone based on a virtualization framework. An apparatus for providing a linking service between a vehicle audio video navigation (AVN) system and a smartphone, includes a host operating system for managing an operation and a state of a host process and AVN application, and managing hardware resources included in the apparatus for the host process and AVN application, a guest operating system for managing an operation and a state of a guest process/the smartphone linkage application, and a hypervisor for emulating the hardware resources according to a control signal of the host operating system to allocate a virtualized hardware resource to the guest operating system. Therefore, the present disclosure has an advantage of continuously providing an existing AVN function irrespective of an error of a function of linking a vehicle AVN system and a smartphone.

Abstract: Disclosed is AA? graphite with a new stacking feature of graphene, and a fabrication method thereof. Graphene is stacked in the sequence of AA? where alternate graphene layers exhibiting the AA? stacking are translated by a half hexagon (1.23 ?). AA? graphite has an interplanar spacing of about 3.44 ? larger than that of the conventional AB stacked graphite (3.35 ?) that has been known as the only crystal of pure graphite. This may allow the AA? stacked graphite to have unique physical and chemical characteristics.

Abstract: A universal serial bus (USB) multi-host device includes a plurality of upstream ports connected to a first host and a second host, a storage for storing data to be transmitted from the first host to the second host through the upstream ports, and a controller, and if the storage receives the data, the controller transmitting a signal based on the received data to the second host, and transmitting the stored data to the second host.

Abstract: Disclosed is a method of manufacturing a semiconductor device, including: forming a multi-layered stack; forming a vertical hole in the stack; forming a plurality of material layers over a bottom and a sidewall of the vertical hole, wherein the plurality of material layers includes a first material layer and a second material layer, wherein the second material layer is provided under the first material layer; patterning the first material layer located over the bottom of the vertical hole to form a first opening, wherein the first opening exposes the second material layer; and patterning the second material layer exposed by the first opening using a difference in an etch rate between the first material layer and the second material layer.

Abstract: A method of controlling a location information system in a vehicle includes: establishing a communication path between a control unit equipped in the vehicle and a smart device; acquiring, by the control unit of the vehicle, first data including a first heading value and first location information; transmitting, by the control unit of the vehicle, the measured first data to the smart device; receiving, at the smart device, the first data from the control unit of the vehicle via the communication path; acquiring, by the smart device, second data including a second heading value and second location information; comparing, by the smart device, the first data with the second data; and updating, by the smart device, information of a navigation function of the smart device based on the first data or the second data depending on the comparing of the first data with the second data.

Abstract: A method and apparatus for providing a security service for a vehicle-dedicated data channel in linking between a vehicle head unit and an external device is disclosed. The method of providing the security service for the vehicle-dedicated data channel may include: transmitting, to the terminal, a predetermined integrity verification request message for requesting integrity verification of application software and an operating system included in the terminal; receiving an integrity verification result message from the terminal, exchanging a plaintext symmetric key with the terminal when integrity of the operating system and the application software is successfully verified according to the integrity verification result message; and establishing a vehicle-dedicated data channel to the terminal and transmitting and receiving a packet encrypted using the plaintext symmetric key through the established vehicle-dedicated data channel when the plaintext symmetric key is successfully exchanged.

Abstract: Disclosed are a method and apparatus for providing a linking service between a vehicle AVN system and a smartphone based on a virtualization framework. An apparatus for providing a linking service between a vehicle audio video navigation (AVN) system and a smartphone, includes a host operating system for managing an operation and a state of a host process and AVN application, and managing hardware resources included in the apparatus for the host process and AVN application, a guest operating system for managing an operation and a state of a guest process/the smartphone linkage application, and a hypervisor for emulating the hardware resources according to a control signal of the host operating system to allocate a virtualized hardware resource to the guest operating system. Therefore, the present disclosure has an advantage of continuously providing an existing AVN function irrespective of an error of a function of linking a vehicle AVN system and a smartphone.

Abstract: A method for controlling a mobile device engaging with a head unit of vehicle includes executing a vehicle engagement application installed in the mobile device, determining first and second spaces having the same size in a frame buffer, monitoring whether a first data responsive to an execution of the vehicle engagement application is written in the first and second spaces, and if the first data is not written in the first and second spaces, performing an autonomous recovery process for the vehicle engagement application.

Abstract: A method of manufacturing a semiconductor device includes forming isolation layers in a first direction at trenches at isolation regions defined at a semiconductor substrate and forming gate lines in a second direction crossing the first direction over the isolation layers and active regions defined between the isolation layers, performing a dry-etch process to remove the isolation layers, and forming an insulating layer over the semiconductor substrate to form a first air gap extending in the first direction in the trenches and a second air gap extending in the second direction between the gate lines.