Patents by Inventor Seung-Hun Shin

Seung-Hun Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210233929
    Abstract: A nonvolatile memory device and method of fabricating same are provided.
    Type: Application
    Filed: July 16, 2020
    Publication date: July 29, 2021
    Inventors: SEUNG WON LEE, TAE HUN KIM, MIN CHEOL PARK, HYE RI SHIN, JUN HEE LIM, SI YEON CHO
  • Publication number: 20210204386
    Abstract: The X-ray generator includes a booster for boosting a first DC voltage supplied from a voltage source to a second DC voltage higher than the first DC voltage, at least one capacitor for receiving the second DC voltage and generating a charging voltage on the basis of the second DC voltage, a converter for converting the charging voltage into a driving voltage, an X-ray source for receiving the driving voltage and emitting X-rays according to the driving voltage, and a controller for controlling the booster, the converter, and the X-ray source. The controller calculates a cooling time required for cooling the X-ray source to a predetermined temperature or lower, determines the magnitude of the second DC voltage according to the cooling time, and applies the second DC voltage to the capacitor for the cooling time.
    Type: Application
    Filed: December 22, 2020
    Publication date: July 1, 2021
    Applicants: VATECH Co., Ltd., VATECH EWOO Holdings Co., Ltd.
    Inventor: Seung Hun SHIN
  • Patent number: 11040651
    Abstract: A multifunctional switch device for a vehicle includes a housing coupled to one side of the steering column, a lever switch protrudingly mounted on one side of the housing so as to be rotatably manipulated within a predetermined section range, a moving block disposed within the housing so as to be rotatably moved together with the lever switch, a retaining block being provided at one side of the moving block, a guide bush mounted at one side of the steering column so as to rotate together with the steering wheel, and a cancel cam configured to be operated by the guide bush depending on a manipulated state of the steering wheel to return the moving block that has been rotatably moved to its original position. The cancel cam includes a cam body rotatably coupled to the housing and a shock-absorbing rib elastically deformably disposed at the cam body.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: June 22, 2021
    Assignee: LS AUTOMOTIVE TECHNOLOGIES CO., LTD.
    Inventors: Soon Hak Kwon, Seung Hun Shin, Jae Chul Lee, Sung Ho Joo
  • Patent number: 10971537
    Abstract: An image sensor includes a semiconductor substrate including a pixel region and a pad region, a plurality of photoelectric conversion regions in the pixel region, an interconnect structure on a front surface of the semiconductor substrate, a pad structure in the pad region and on a rear surface of the semiconductor substrate, a through via structure in the pad region and electrically connected to the interconnect structure through the semiconductor substrate, and an isolation structure at least partially extending through the pad region of the semiconductor substrate from the rear surface of the semiconductor substrate. The isolation structure surrounds the pad structure and the through via structure in a plane extending parallel to the rear surface of the semiconductor substrate.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: April 6, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-hun Shin, Duk-seo Park
  • Patent number: 10943939
    Abstract: A semiconductor device includes a lower device and an upper device disposed on the lower device. The lower device includes a lower substrate, a lower plug pad disposed on the lower substrate, and a lower interlayer dielectric layer on the lower plug pad. The upper device includes an upper substrate, an etch-delay structure in a lower portion of the upper substrate, an upper plug pad disposed on a bottom surface of the upper substrate, an upper interlayer dielectric layer on the upper plug pad, and a via plug configured to penetrate the upper substrate and contact the upper plug pad and the lower plug pad. The via plug includes a first portion in contact with the upper plug pad and the first etch-delay structure, and a second portion in contact with the lower plug pad.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: March 9, 2021
    Inventors: Byung-Jun Park, Chang-Rok Moon, Seung-Hun Shin, Seong-Ho Oh, Tae-Seok Oh, June-Taeg Lee
  • Patent number: 10867857
    Abstract: A method of cutting a substrate including a device region and a scribe lane region includes selectively forming a passivation layer in the device region of the substrate, selectively forming a self-assembled monolayer on the passivation layer, and performing plasma cutting in the scribe lane region.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: December 15, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang-Seong Jeon, Seung-Hun Shin, Jae-Kyung Yoo, Teak-Hoon Lee
  • Publication number: 20200279886
    Abstract: An image sensor includes a semiconductor substrate including a pixel region and a pad region, a plurality of photoelectric conversion regions in the pixel region, an interconnect structure on a front surface of the semiconductor substrate, a pad structure in the pad region and on a rear surface of the semiconductor substrate, a through via structure in the pad region and electrically connected to the interconnect structure through the semiconductor substrate, and an isolation structure at least partially extending through the pad region of the semiconductor substrate from the rear surface of the semiconductor substrate. The isolation structure surrounds the pad structure and the through via structure in a plane extending parallel to the rear surface of the semiconductor substrate.
    Type: Application
    Filed: May 18, 2020
    Publication date: September 3, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung-hun SHIN, Duk-seo PARK
  • Patent number: 10672823
    Abstract: An image sensor includes a semiconductor substrate including a pixel region and a pad region, a plurality of photoelectric conversion regions in the pixel region, an interconnect structure on a front surface of the semiconductor substrate, a pad structure in the pad region and on a rear surface of the semiconductor substrate, a through via structure in the pad region and electrically connected to the interconnect structure through the semiconductor substrate, and an isolation structure at least partially extending through the pad region of the semiconductor substrate from the rear surface of the semiconductor substrate. The isolation structure surrounds the pad structure and the through via structure in a plane extending parallel to the rear surface of the semiconductor substrate.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: June 2, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-hun Shin, Duk-seo Park
  • Publication number: 20200098635
    Abstract: A method of cutting a substrate including a device region and a scribe lane region includes selectively forming a passivation layer in the device region of the substrate, selectively forming a self-assembled monolayer on the passivation layer, and performing plasma cutting in the scribe lane region.
    Type: Application
    Filed: August 13, 2019
    Publication date: March 26, 2020
    Inventors: CHANG-SEONG JEON, SEUNG-HUN SHIN, JAE-KYUNG YOO, TEAK-HOON LEE
  • Publication number: 20190366913
    Abstract: The present invention provides a multifunctional switch device for a vehicle, which can reduce noise generation due to a collision between components when performing a return function after the activation of a turn signal. The multifunctional switch device for a vehicle, according to the present invention includes: a housing coupled to one side of the steering column; a lever switch protrudingly mounted on one side of the housing so as to be rotatably manipulated within a predetermined section range; a moving block disposed within the housing so as to be rotatably moved together with the lever switch, a retaining block being provided at one side of the moving block; a guide bush mounted at one side of the steering column so as to rotate together with the steering wheel; and a cancel cam configured to be operated by the guide bush depending on a manipulated state of the steering wheel to return the moving block that has been rotatably moved to its original position.
    Type: Application
    Filed: December 27, 2017
    Publication date: December 5, 2019
    Applicant: LS AUTOMOTIVE TECHNOLOGIES CO., LTD.
    Inventors: Soon Hak KWON, Seung Hun SHIN, Jae Chul LEE, Sung Ho JOO
  • Patent number: 10477082
    Abstract: An electronic device is provided. The electronic device includes a housing including a front plate, a back plate, and a side member surrounding a space between the front plate and the back plate. The side member includes a plurality of non-conductive portions and a conductive portion. The electronic device also includes a display module, and at least one wireless communication circuit. The electronic device also includes a printed circuit board (PCB). The camera assembly is exposed through a portion of the back plate. The camera assembly includes an image sensor mounted on the PCB, and a plurality of lenses. The camera assembly also includes a barrel that surrounds the plurality of lenses, and a camera bracket that surrounds at least part of the barrel. The camera assembly also includes a metal case that surrounds at least part of the camera assembly, and a shielding structure.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: November 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Tae Jung, Seung-Hun Shin, Chang-Ho Hwang, Min-Soo Kim, Sang-Tae Lee, Ji-Hyuk Jang, Jin-Wan An
  • Publication number: 20190189668
    Abstract: A semiconductor device includes a lower device and an upper device disposed on the lower device. The lower device includes a lower substrate, a lower plug pad disposed on the lower substrate, and a lower interlayer dielectric layer on the lower plug pad. The upper device includes an upper substrate, an etch-delay structure in a lower portion of the upper substrate, an upper plug pad disposed on a bottom surface of the upper substrate, an upper interlayer dielectric layer on the upper plug pad, and a via plug configured to penetrate the upper substrate and contact the upper plug pad and the lower plug pad. The via plug includes a first portion in contact with the upper plug pad and the first etch-delay structure, and a second portion in contact with the lower plug pad.
    Type: Application
    Filed: February 11, 2019
    Publication date: June 20, 2019
    Inventors: BYUNG-JUN PARK, CHANG-ROK MOON, SEUNG-HUN SHIN, SEONG-HO OH, TAE-SEOK OH, JUNE-TAEG LEE
  • Publication number: 20190148439
    Abstract: An image sensor includes a semiconductor substrate including a pixel region and a pad region, a plurality of photoelectric conversion regions in the pixel region, an interconnect structure on a front surface of the semiconductor substrate, a pad structure in the pad region and on a rear surface of the semiconductor substrate, a through via structure in the pad region and electrically connected to the interconnect structure through the semiconductor substrate, and an isolation structure at least partially extending through the pad region of the semiconductor substrate from the rear surface of the semiconductor substrate. The isolation structure surrounds the pad structure and the through via structure in a plane extending parallel to the rear surface of the semiconductor substrate.
    Type: Application
    Filed: August 22, 2018
    Publication date: May 16, 2019
    Applicant: Samsung Electronics Co., ltd.
    Inventors: Seung-hun SHIN, Duk-seo PARK
  • Patent number: 10265038
    Abstract: The present invention relates to an X-ray photographing device and, more specifically, to an X-ray photographing device comprising a variable type arm which can irradiate, without limitation of location or direction, X-rays to a subject using the variable type arm of which the length and rotation angle of joints, etc. are variable.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: April 23, 2019
    Assignees: VATECH Co., Ltd., VATECH EWOO Holdings Co., Ltd.
    Inventors: Tae Woo Kim, Seung Hun Shin, Keong Tae Yeom, Byung Jik Lim, Jin Pyo Chun, Sung Il Choi
  • Patent number: 10229949
    Abstract: A semiconductor device includes a lower device and an upper device disposed on the lower device. The lower device includes a lower substrate, a lower plug pad disposed on the lower substrate, and a lower interlayer dielectric layer on the lower plug pad. The upper device includes an upper substrate, an etch-delay structure in a lower portion of the upper substrate, an upper plug pad disposed on a bottom surface of the upper substrate, an upper interlayer dielectric layer on the upper plug pad, and a via plug configured to penetrate the upper substrate and contact the upper plug pad and the lower plug pad. The via plug includes a first portion in contact with the upper plug pad and the first etch-delay structure, and a second portion in contact with the lower plug pad.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: March 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung-Jun Park, Chang-Rok Moon, Seung-Hun Shin, Seong-Ho Oh, Tae-Seok Oh, June-Taeg Lee
  • Publication number: 20190058814
    Abstract: An electronic device is provided. The electronic device includes a housing including a front plate, a back plate, and a side member surrounding a space between the front plate and the back plate. The side member includes a plurality of non-conductive portions and a conductive portion. The electronic device also includes a display module, and at least one wireless communication circuit. The electronic device also includes a printed circuit board (PCB). The camera assembly is exposed through a portion of the back plate. The camera assembly includes an image sensor mounted on the PCB, and a plurality of lenses. The camera assembly also includes a barrel that surrounds the plurality of lenses, and a camera bracket that surrounds at least part of the barrel. The camera assembly also includes a metal case that surrounds at least part of the camera assembly, and a shielding structure.
    Type: Application
    Filed: August 2, 2018
    Publication date: February 21, 2019
    Inventors: Hyun-Tae JUNG, Seung-Hun SHIN, Chang-Ho HWANG, Min-Soo KIM, Sang-Tae LEE, Ji-Hyuk JANG, Jin-Wan AN
  • Patent number: 9825081
    Abstract: A semiconductor device includes a substrate, a circuit layer formed on a first surface of the substrate and including a via pad and an interlayer insulating layer covering the via pad, a via structure configured to fully pass through the substrate, partially pass through the interlayer insulating layer and be in contact with the via pad, a via isolation insulating layer configured to pass through the substrate and be spaced apart from outer side surfaces of the via structure in a horizontal direction and a pad structure buried in the substrate and exposed on a second surface of the substrate opposite the first surface of the substrate.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: November 21, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Taeseok Oh, Junetaeg Lee, Seung-Hun Shin, Jaesang Yoo
  • Publication number: 20170287967
    Abstract: A semiconductor device includes a lower device and an upper device disposed on the lower device. The lower device includes a lower substrate, a lower plug pad disposed on the lower substrate, and a lower interlayer dielectric layer on the lower plug pad. The upper device includes an upper substrate, an etch-delay structure in a lower portion of the upper substrate, an upper plug pad disposed on a bottom surface of the upper substrate, an upper interlayer dielectric layer on the upper plug pad, and a via plug configured to penetrate the upper substrate and contact the upper plug pad and the lower plug pad. The via plug includes a first portion in contact with the upper plug pad and the first etch-delay structure, and a second portion in contact with the lower plug pad.
    Type: Application
    Filed: June 16, 2017
    Publication date: October 5, 2017
    Inventors: BYUNG-JUN PARK, CHANG-ROK MOON, SEUNG-HUN SHIN, SEONG-HO OH, TAE-SEOK OH, JUNE-TAEG LEE
  • Patent number: 9728572
    Abstract: A semiconductor device includes a lower device and an upper device disposed on the lower device. The lower device includes a lower substrate, a lower plug pad disposed on the lower substrate, and a lower interlayer dielectric layer on the lower plug pad. The upper device includes an upper substrate, an etch-delay structure in a lower portion of the upper substrate, an upper plug pad disposed on a bottom surface of the upper substrate, an upper interlayer dielectric layer on the upper plug pad, and a via plug configured to penetrate the upper substrate and contact the upper plug pad and the lower plug pad. The via plug includes a first portion in contact with the upper plug pad and the first etch-delay structure, and a second portion in contact with the lower plug pad.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: August 8, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung-Jun Park, Chang-Rok Moon, Seung-Hun Shin, Seong-Ho Oh, Tae-Seok Oh, June-Taeg Lee
  • Patent number: 9608026
    Abstract: Methods of manufacturing an integrated circuit device including a through via structure are provided. The methods may include forming an isolation trench through a substrate to form an inner substrate, which is enclosed by the isolation trench and forming an insulating layer in the isolation trench and on a surface of the substrate. The methods may also include forming a hole, which is spaced apart from the isolation trench and passes through a portion of the insulating layer formed on the surface of the substrate and the inner substrate and forming a conductive layer in the hole and on the insulating layer formed on the surface of the substrate. The methods may be used to manufacture image sensors.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: March 28, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung-Jun Park, Seung-Hun Shin