Patents by Inventor Seung Hwan Kim

Seung Hwan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220145131
    Abstract: Proposed are a CMP slurry composition and a polishing method using the same. The CMP slurry composition in which the zeta potential of colloidal silica serving as an abrasive is properly controlled and metal impurities are removed from the colloidal silica and to a polishing method using the same. The CMP slurry composition is configured to improve a polishing performance for a silicon oxide film, minimize scratches on a finished surface, and to enable adjustment of a content ratio of an abrasive and an additive in the composition, thereby enabling adjustment of a polishing selectivity among a silicon oxide film, a silicon nitride film, and a polysilicon film.
    Type: Application
    Filed: March 2, 2020
    Publication date: May 12, 2022
    Inventors: Seung Hun LEE, Seung Hyun LEE, Seong Hwan KIM
  • Publication number: 20220131106
    Abstract: A display device includes: a substrate including an opening area, a peripheral area surrounding the opening area, and a display area surrounding the peripheral area; a transistor overlapping the display area on the substrate; an insulation layer on the transistor; a first electrode on the insulation layer; a pixel definition layer on the first electrode; an intermediate layer and a second electrode that overlap the first electrode and include a functional layer; a dam overlapping the peripheral area; and a first layer overlapping the peripheral area and spaced apart from the intermediate layer, wherein the first layer is spaced apart from an upper surface of the dam and covers a side surface of the dam.
    Type: Application
    Filed: April 28, 2021
    Publication date: April 28, 2022
    Inventors: Hoi Soo KWON, Sun Young KIM, Seung Hwan KIM, Hwi Seong KIM, Yu Jin YE, Jae-Man LEE, Hee-Won YOON
  • Publication number: 20220122977
    Abstract: A semiconductor device includes: a plurality of active layers stacked in a first direction perpendicular to a substrate and laterally oriented in a second direction intersecting with the first direction; a plurality of bit lines each of which is coupled to one side of each of the active layers and laterally oriented in a direction intersecting with the first direction and the second direction; a plurality of capacitors each of which is coupled to another side of each of the active layers; and a word line vertically oriented penetrating the active layers in the first direction.
    Type: Application
    Filed: March 25, 2021
    Publication date: April 21, 2022
    Inventor: Seung Hwan KIM
  • Publication number: 20220122976
    Abstract: A memory device includes: a word line stack including word lines that are alternately stacked vertically over a substrate, and having an edge portion; at least one supporter extending vertically in a direction that the word lines are stacked and supporting the edge portion of the word line stack; contact plugs that are electrically connected to the word lines at the edge portion of the word line stack; and active layers positioned between the word lines, and horizontally oriented in a direction intersecting with the word lines.
    Type: Application
    Filed: March 25, 2021
    Publication date: April 21, 2022
    Inventor: Seung Hwan KIM
  • Patent number: 11310495
    Abstract: A method of filtering reconstructed video data, the method comprising: determining whether one or more conditions associated with the adjacent reconstructed video blocks are satisfied; selecting a filter based on whether the one or more conditions are satisfied; modifying sample values in the adjacent reconstructed video blocks based on the selected filter.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: April 19, 2022
    Assignees: SHARP KABUSHIKI KAISHA, FG INNOVATION COMPANY LIMITED
    Inventors: Seung-Hwan Kim, Jie Zhao, Kiran Mukesh Misra, Christopher Andrew Segall
  • Publication number: 20220103812
    Abstract: A video coding device may be configured to perform intra prediction coding according to one or more of the techniques described herein.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 31, 2022
    Inventors: SEUNG-HWAN KIM, CHRISTOPHER ANDREW SEGALL
  • Patent number: 11277606
    Abstract: A method for decoding a bitstream comprising: (a) decoding at least one pictures from the bitstream; and (b) partitioning each of the at least one pictures into a plurality of slices, wherein each of the plurality of slices includes at least one coding units, wherein (c) palette table predictor size of a coding unit of the at least one coding units is set equal to 0 at start of a slice of the plurality of slices.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: March 15, 2022
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Kiran Mukesh Misra, Seung-Hwan Kim, Jie Zhao, Christopher Andrew Segall, Tomohiro Ikai
  • Publication number: 20220068904
    Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.
    Type: Application
    Filed: April 1, 2021
    Publication date: March 3, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jongho PARK, Seung Hwan KIM, Jun Young OH, Jungjoo KIM, Yongkwan LEE, Dong-Ju JANG
  • Publication number: 20220056426
    Abstract: The present application relates to a psicose-6-phosphate phosphatase, a microorganism comprising the same, and a method for producing psicose using the same.
    Type: Application
    Filed: December 5, 2019
    Publication date: February 24, 2022
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Hyun June Park, Sang Young Yoon, Hyun Kug Cho, Sung Jae Yang, So-hyeong Kim, Seung Hwan Kim, Il Hyang Park, Byung-sam Son, Seong Bo Kim, Seung Won Park
  • Publication number: 20220060751
    Abstract: An image encoding/decoding method and apparatus are provided. An image decoding method according to the present disclosure may comprise generating a prediction block by performing intra prediction with respect to a current block, generating a residual block by performing inverse transform with respect to a transform coefficient of the current block, and reconstructing the current block based on the prediction block and the residual block. The inverse transform may comprise inverse primary transform and inverse secondary transform, and the inverse secondary transform may be performed based on whether intra prediction for the current block is matrix based intra prediction (MIP).
    Type: Application
    Filed: November 8, 2021
    Publication date: February 24, 2022
    Inventors: Jung Hak NAM, Moonmo KOO, Jaehyun LIM, Seung Hwan KIM
  • Publication number: 20220037852
    Abstract: The surface emitting laser device according to the embodiment includes a substrate, a first metal layer disposed on the substrate, a second metal layer disposed on the first metal layer, and a third metal layer disposed between the first metal layer and the second metal layer. The first to third metal layers may include different materials, and the second metal layer may include copper (Cu). The third metal layer may prevent diffusion of copper from the second metal layer into the first metal layer.
    Type: Application
    Filed: September 9, 2019
    Publication date: February 3, 2022
    Applicant: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Se Yeon JUNG, Seung Hwan KIM
  • Patent number: 11233990
    Abstract: A video coding device may be configured to perform intra prediction coding according to one or more of the techniques described herein.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: January 25, 2022
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Seung-Hwan Kim, Christopher Andrew Segall
  • Publication number: 20220007056
    Abstract: A system utilizing a high throughput coding mode for CABAC in HEVC is described. The system may include an electronic device configured to obtain a block of data to be encoded using an arithmetic based encoder; to generate a sequence of syntax elements using the obtained block; to compare an Absolute-3 value of the sequence or a parameter associated with the Absolute-3 value to a preset value; and to convert the Absolute-3 value to a codeword using a first code or a second code that is different than the first code, according to a result of the comparison.
    Type: Application
    Filed: June 14, 2021
    Publication date: January 6, 2022
    Inventors: Seung-Hwan Kim, Louis J. Kerofsky, Christopher A. Segall
  • Publication number: 20220005809
    Abstract: A memory device includes a substrate, an active layer spaced apart from a surface of the substrate and laterally oriented in a first direction and including an opened first side, a closed second side, and a channel layer between the first side and the second side, and a word line laterally oriented in a second direction crossing the first direction while surrounding the channel layer.
    Type: Application
    Filed: January 26, 2021
    Publication date: January 6, 2022
    Inventors: Il Do KIM, Dong Sun SHEEN, Seung Hwan KIM
  • Patent number: 11217544
    Abstract: A semiconductor package includes: a package substrate; a first semiconductor chip disposed over the package substrate and having a center region and an edge region; and a package redistribution layer disposed over the first semiconductor chip, wherein the first semiconductor chip comprises: a lower structure; a redistribution conductive layer disposed over the lower structure and electrically connected to the lower structure, the redistribution conductive layer including a redistribution pad disposed in the center region; and a protective layer covering the lower structure and the redistribution conductive layer, and having an opening exposing the redistribution pad, wherein the package redistribution layer comprises: a package redistribution conductive layer connected to the redistribution pad and extending to the edge region, the package redistribution conductive layer including a package redistribution pad disposed in the edge region, and, wherein, in the edge region, the redistribution conductive layer is
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: January 4, 2022
    Assignee: SK hynix Inc.
    Inventors: Jong Hyun Kim, Seung Hwan Kim, Hyun Chul Seo, Ki Young Kim
  • Publication number: 20210400257
    Abstract: An image encoding/decoding method and apparatus for signaling an ACT or LMCS tool based on a color space and a method of transmitting a bitstream are provided. An image decoding may include determining a color space of a current image, determining whether to enable a predetermined decoding tool based on the color space, and decoding the current image depending on whether to enable the predetermined decoding tool.
    Type: Application
    Filed: June 21, 2021
    Publication date: December 23, 2021
    Inventors: Jie Zhao, Seung Hwan Kim, Hendry Hendry
  • Publication number: 20210391199
    Abstract: The present disclosure provides a magazine supporting equipment for supporting a magazine with multiple input ports. The magazine supporting equipment comprises a contact plate, a first sidewall plate, and a second sidewall plate. The contact plate is in contact with the magazine. The first sidewall plate extends vertically from one end of the contact plate. The second sidewall plate parallel is to the first sidewall plate and extends vertically from one end to the other end of the contact plate. The first sidewall plate extends along at least a part of a first sidewall of the magazine. The second sidewall plate extends along at least a part of a second sidewall of the magazine. The first sidewall plate and the second sidewall plate include control openings through which gas flows in and out.
    Type: Application
    Filed: March 15, 2021
    Publication date: December 16, 2021
    Inventors: Jun Young OH, Seung Hwan KIM, Jong Ho PARK, Yong Kwan LEE, Jong Ho LEE
  • Publication number: 20210366853
    Abstract: A semiconductor package includes: a package substrate; a first semiconductor chip disposed over the package substrate and having a center region and an edge region; and a package redistribution layer disposed over the first semiconductor chip, wherein the first semiconductor chip comprises: a lower structure; a redistribution conductive layer disposed over the lower structure and electrically connected to the lower structure, the redistribution conductive layer including a redistribution pad disposed in the center region; and a protective layer covering the lower structure and the redistribution conductive layer, and having an opening exposing the redistribution pad, wherein the package redistribution layer comprises: a package redistribution conductive layer connected to the redistribution pad and extending to the edge region, the package redistribution conductive layer including a package redistribution pad disposed in the edge region, and, wherein, in the edge region, the redistribution conductive layer is
    Type: Application
    Filed: August 25, 2020
    Publication date: November 25, 2021
    Applicant: SK hynix Inc.
    Inventors: Jong Hyun KIM, Seung Hwan KIM, Hyun Chul SEO, Ki Young KIM
  • Publication number: 20210366832
    Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.
    Type: Application
    Filed: August 3, 2021
    Publication date: November 25, 2021
    Inventors: JONGHO PARK, SEUNG HWAN KIM, JUN YOUNG OH, Kyong Hwan KOH, SANGSOO KIM, DONG-JU JANG
  • Publication number: 20210355461
    Abstract: The present application relates to a psicose-6-phosphate phosphatase comprising motif A and motif B, a composition for producing D-psicose comprising the enzyme, and a method for producing D-psicose using the enzyme.
    Type: Application
    Filed: July 25, 2018
    Publication date: November 18, 2021
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Byung-Sam SON, Hyun Kug CHO, Sung Jae YANG, Seong Bo KIM, Seung Hwan KIM, Hyun June PARK