Patents by Inventor Seung Hyuk Kang

Seung Hyuk Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140038312
    Abstract: A magnetic tunneling junction device and fabrication method is disclosed. In a particular embodiment, a non-transitory computer-readable medium includes processor executable instructions. The instructions, when executed by a processor, cause the processor to initiate deposition of a capping material on a free layer of a magnetic tunneling junction structure to form a capping layer. The instructions, when executed by the processor, cause the processor to initiate oxidization of a first layer of the capping material to form a first oxidized layer of oxidized material.
    Type: Application
    Filed: October 8, 2013
    Publication date: February 6, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Kangho Lee, Xiaochun Zhu, Xia Li, Seung Hyuk Kang
  • Publication number: 20140021570
    Abstract: Methods and apparatus for shielding a shielding a non-volatile memory, such as shielding a magnetic tunnel junction (MTJ) device from a magnetic flux are provided. In an example, a shielding layer is formed adjacent to an electrode of an MTJ device, such that the shielding layer substantially surrounds a surface of the electrode, and a metal line is coupled to the shielding layer. The metal line can be coupled to the shielding layer by a via.
    Type: Application
    Filed: September 25, 2013
    Publication date: January 23, 2014
    Applicant: QUALCOMM INCORPORATED
    Inventors: Wei-Chuan Chen, Xia Li, Seung Hyuk Kang
  • Publication number: 20130320468
    Abstract: According to an embodiment of the invention, a magnetic tunnel junction (MTJ) element includes a reference ferromagnetic layer, a storage ferromagnetic layer, and an insulating layer. The storage ferromagnetic layer includes a CoFeB sub-layer coupled to a CoFe sub-layer and/or a NiFe sub-layer through a non-magnetic sub-layer. The insulating layer is disposed between the reference and storage ferromagnetic layers.
    Type: Application
    Filed: August 5, 2013
    Publication date: December 5, 2013
    Applicant: QUALCOMM Incorporated
    Inventors: Xiaochun Zhu, Xia Li, Seung Hyuk Kang