Patents by Inventor Seung-jae Jung

Seung-jae Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11555906
    Abstract: An ultrasonic includes: a piezoelectric layer; an absorbing layer disposed at a lower portion of the piezoelectric layer, configured to absorb an acoustic signal; and a connection part disposed between the piezoelectric layer and the absorbing layer. The connection part may deform at least partially so that a plurality of acoustic signals radiated from the piezoelectric layer due to the connection part have different magnitudes. In the case of the ultrasonic probe, since the magnitude of the acoustic energy radiated from the center of the ultrasonic probe is larger than the magnitude of the acoustic energy radiated from the side of the ultrasonic probe, the directivity of the ultrasonic signal is improved and a side lobe is decreased. In addition, an apodization effect capable of suppressing overlapping between adjacent phases can be obtained by using a difference in the magnitude of the acoustic energy to be radiated.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: January 17, 2023
    Assignee: SAMSUNG MEDISON CO. LTD.
    Inventors: In Seong Song, Jong-sun Ko, Yong Jae Kim, Won Hee Lee, Jin Woo Jung, Jee Rak Choi, Yoon Sung Kyung, Seung Hyun Kim, Ji Su Kim, Joong Hyun Park, Jin Hwan Park, Kyung Min Lee
  • Publication number: 20220395383
    Abstract: An intervertebral fusion cage is disclosed. An intervertebral fusion cage according to an embodiment of the present invention comprises: a body including a receiving part of which upper and lower portions are open, an upper guide part, and a lower guide part; a moving member disposed in the receiving part; a screw which is screw-coupled to the body and moves forwards or backwards relative to the body integrally with the moving member when rotating; an upper plate which has a guided part guided by the upper guide part and is disposed above the body while being engaged with the moving member; and a lower plate which has a guided part guided by the lower guide part and is disposed under the body while being engaged with the moving member.
    Type: Application
    Filed: September 29, 2020
    Publication date: December 15, 2022
    Applicants: CG BIO CO., LTD., SEOUL NATIONAL UNIVERSITY HOSPITAL
    Inventors: Ui Su JUNG, Seung Jae HYUN
  • Publication number: 20220398119
    Abstract: Disclosed herein are an apparatus and a method for providing a virtual multi-cloud service. The apparatus for providing a virtual multi-cloud service includes one or more processors and execution memory for storing at least one program that is executed by the one or more processors, wherein the at least one program is configured to create a virtual machine cluster requested by an operator using an external cloud computing infrastructure, install a container orchestration tool in the virtual machine cluster using container-related information registered by the operator in advance, and create a virtual cloud requested by the operator using the container orchestration tool.
    Type: Application
    Filed: March 3, 2022
    Publication date: December 15, 2022
    Inventors: Byoung-Seob KIM, Dong-Jae KANG, Soo-Young KIM, Yun-Kon KIM, Seung-Jo BAE, Ji-Hoon SEO, Seok-Ho SON, Byeong-Thaek OH, Young-Woo JUNG
  • Patent number: 11495391
    Abstract: An inductor includes a body including a plurality of insulating layers and a plurality of coil patterns are disposed on each of the plurality of insulating layers, and first and second external electrodes disposed on an external surface of the body. The plurality of coil patterns are connected to each other by coil connecting portions and both end portions thereof are electrically connected to the first and second external electrodes through coil lead portions, respectively, to form a coil. The plurality of coil patterns include coil patterns disposed on an outer portion of the body and coil patterns disposed on an inner portion of the body, the coil patterns disposed on the inner portion of the body include first coil patterns electrically connected in parallel, and at least one of the first coil patterns includes an internal side portion having a shape different from shapes of remaining coil patterns.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: November 8, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Jae Song, Sang Jong Lee, Su Bong Jang, Seung Hee Hong, Min Ki Jung
  • Publication number: 20220329651
    Abstract: Disclosed herein are a container orchestration apparatus in an environment of multiple geographically distributed clouds and a method using the same. The container orchestration method includes receiving, by the container orchestration apparatus, a service request from a device using service; and dynamically deploying, by the container orchestration apparatus, a service node and a service instance for processing the service request based on auto-scheduling of a container orchestration cluster based on the environment of multiple geographically distributed clouds.
    Type: Application
    Filed: November 3, 2021
    Publication date: October 13, 2022
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Soo-Young KIM, Dong-Jae KANG, Byoung-Seob KIM, Seok-Ho SON, Yun-Kon KIM, Seung-Jo BAE, Ji-Hoon SEO, Byeong-Thaek OH, Young-Woo JUNG
  • Publication number: 20220310277
    Abstract: Proposed is a nuclear fuel pellet manufactured with UO2 powder and being in a cylindrical shape, the nuclear fuel pellet including: a dish (10) provided in a shape of a spherical groove having a predetermined curvature and a diameter of 4.8 to 5.2 mm at a center of each of top and bottom surfaces of the nuclear fuel pellet; a shoulder (20) provided in an annular plane along a rim of the dish (10); a first chamfer (310) provided along a rim of the shoulder (20) while being adjacent to the shoulder (20); and a second chamfer (320) provided along a rim of the first chamfer (310), wherein a width (SW) of the shoulder (20) is 0.4565 mm to 0.6565 mm, an angle between the first chamfer (310) and a horizontal plane is 2.0°, and an angle between the second chamfer (320) and the horizontal plane is 18.0°.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 29, 2022
    Inventors: Yeon-soo Na, Kwang-young Lim, Tae Sik Jung, Seung-jae Lee, Min Jae Ju
  • Patent number: 11456107
    Abstract: An inductor includes a body including a plurality of insulating layers and a plurality of coil patterns are disposed on each of the plurality of insulating layers, and first and second external electrodes disposed on an external surface of the body. The plurality of coil patterns are connected to each other by coil connecting portions and both end portions thereof are electrically connected to the first and second external electrodes through coil lead portions, respectively, to form a coil. The plurality of coil patterns include coil patterns disposed on an outer portion of the body and coil patterns disposed on an inner portion of the body, the coil patterns disposed on the inner portion of the body include first coil patterns electrically connected in parallel, and at least one of the first coil patterns includes an internal side portion having a shape different from shapes of remaining coil patterns.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: September 27, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Jae Song, Sang Jong Lee, Su Bong Jang, Seung Hee Hong, Min Ki Jung
  • Patent number: 11452459
    Abstract: An electronic device according to an embodiment of the present invention may comprise: a housing comprising a first glass plate, a second glass plate facing in the opposite direction to the first glass plate, and a side member surrounding the space between the first glass plate and the second glass plate, the second plate comprising an outer surface facing in the opposite direction to the first plate and an inner surface facing the first plate; an inner middle plate positioned between the first plate and the second plate; a touch screen display positioned between the middle plate and the first plate; an opaque layer comprising a first opening and a second opening positioned within 150 mm from the first opening, the opaque layer being directly or indirectly attached to the inner surface of the second plate comprising a hole overlapping with the first opening but comprising no hole overlapping with the second opening; a camera assembly partially positioned inside the hole of the second plate and the first openi
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: September 27, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Su Jung, Yong-Seok Lee, Seung-Jae Bae, Jong-Kyun Im, Jin-A Mock, Jin-Young Park
  • Patent number: 11424042
    Abstract: Provided is a nuclear-fuel sintered pellet based on oxide in which a plate-type fine precipitate material in a base of a sintered pellet of uranium dioxide, used as nuclear fuel in nuclear power plants, is uniformly dispersed in a matrix of uranium dioxide fuel thereof so as to form a donut-shaped precipitate cluster, and to a method of manufacturing the same. The plate-type fine precipitate material is uniformly precipitated in a tissue thereof or forms a donut-shaped precipitate cluster having a two-dimensional structure through dispersion to improve thermal and physical performance of the nuclear-fuel sintered pellet of uranium dioxide, whereby the creep deformation rate and thermal conductivity of the sintered pellet are improved. The nuclear-fuel sintered pellet based on oxide can reduce the Pellet-Clad Interaction (PCI) failure and the core temperature of nuclear fuel when an accident occurs, thereby significantly improving the safety of a nuclear reactor.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: August 23, 2022
    Assignee: KEPCO NUCLEAR FUEL CO., LTD.
    Inventors: Yeon Soo Na, Kwang Young Lim, Tae Sik Jung, Min Jae Ju, Yoon Ho Kim, Seung Jae Lee
  • Publication number: 20220223303
    Abstract: Proposed are nuclear fuel pellets showing high oxidation resistance in a steam atmosphere and a method for manufacturing same. The method includes: preparing a powder mixture by mixing a sintering additive powder including Cr2O3, MnO, and SiO2 with a uranium dioxide powder; forming a molded body by subjecting the powder mixture to compression molding; and sintering the molded body in a weak oxidative atmosphere in which an oxygen potential is ?581.9 kJ/mol to ?218.2 kJ/mol. The nuclear fuel pellets contain 0.05% to 0.16% by weight of the sintering additive composed of Cr2O3, MnO, and SiO2. A liquid phase generated during the sintering accelerates grain growth and inhibits reaction between uranium dioxide with steam by forming a film at the grain boundary of the uranium dioxide. This reduces leakage of a fission material by improving high-temperature water vapor oxidation resistance at around 1204° C. in a loss-of-coolant accident condition.
    Type: Application
    Filed: March 22, 2022
    Publication date: July 14, 2022
    Applicant: KEPCO NUCLEAR FUEL CO., LTD.
    Inventors: Kwang-young Lim, Tae-sik Jung, Yeon-su Na, Min-jae Joo, Seung-jae Lee, Yoon-ho Kim
  • Patent number: 11383579
    Abstract: An air conditioning system for a vehicle and a control method thereof may include a temperature detector; an air conditioning actuator including a cooling device and a blower; and a controller connected to the temperature detector and the air conditioning actuator and including: a load determination portion determining an air conditioning load based on factors including an internal temperature or an external temperature of a vehicle detected by the temperature detector; a storage portion storing a control map that controls the air conditioning actuator according to the air conditioning load; and an update portion updating a control value, pre-stored in the control map, of the air conditioning actuator for the air conditioning load to a demand value of a user when receiving the demand value of the user for the air conditioning actuator.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: July 12, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Hanon Systems
    Inventors: Gee Young Shin, Dong Ho Kwon, Dae Ig Jung, Seung Hyeok Chang, Jeong Hoon Lee, Joong Jae Kim
  • Publication number: 20220208768
    Abstract: A semiconductor device includes a bit line extending in a first direction, a gate electrode extending in a second direction, and a semiconductor pattern extending in a third direction and connected to the bit line, and a capacitor. The capacitor includes a first electrode connected to the semiconductor pattern and a dielectric film between the first and second electrodes. The first or the second direction is perpendicular to an upper surface of the substrate. The first electrode includes an upper and a lower plate region parallel to the upper surface of the substrate, and a connecting region which connects the upper and the lower plate regions. The upper and the lower plate regions of the first electrode include an upper and a lower surface facing each other. The dielectric film extends along the upper and the lower surfaces of the upper and lower plate regions of the first electrode.
    Type: Application
    Filed: March 21, 2022
    Publication date: June 30, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung Jae JUNG, Jae Hoon KIM, Kwang-Ho PARK, Yong-Hoon SON
  • Patent number: 11315929
    Abstract: A semiconductor device includes a bit line extending in a first direction, a gate electrode extending in a second direction, and a semiconductor pattern extending in a third direction and connected to the bit line, and a capacitor. The capacitor includes a first electrode connected to the semiconductor pattern and a dielectric film between the first and second electrodes. The first or the second direction is perpendicular to an upper surface of the substrate. The first electrode includes an upper and a lower plate region parallel to the upper surface of the substrate, and a connecting region which connects the upper and the lower plate regions. The upper and the lower plate regions of the first electrode include an upper and a lower surface facing each other. The dielectric film extends along the upper and the lower surfaces of the upper and lower plate regions of the first electrode.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: April 26, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung Jae Jung, Jae Hoon Kim, Kwang-Ho Park, Yong-hoon Son
  • Publication number: 20210257368
    Abstract: A semiconductor device includes a bit line extending in a first direction, a gate electrode extending in a second direction, and a semiconductor pattern extending in a third direction and connected to the bit line, and a capacitor. The capacitor includes a first electrode connected to the semiconductor pattern and a dielectric film between the first and second electrodes. The first or the second direction is perpendicular to an upper surface of the substrate. The first electrode includes an upper and a lower plate region parallel to the upper surface of the substrate, and a connecting region which connects the upper and the lower plate regions. The upper and the lower plate regions of the first electrode include an upper and a lower surface facing each other. The dielectric film extends along the upper and the lower surfaces of the upper and lower plate regions of the first electrode.
    Type: Application
    Filed: September 30, 2020
    Publication date: August 19, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung Jae JUNG, Jae Hoon KIM, Kwang-Ho PARK, Yong-hoon SON
  • Publication number: 20210134800
    Abstract: A semiconductor memory device including first-first conductive lines on a substrate; second-first conductive lines on the first-first conductive lines; first contacts connected to the first-first conductive lines; and second contacts connected to the second-first conductive lines, wherein the first-first conductive lines protrude in a first direction beyond the second-first conductive lines; the first-first conductive lines include first regions having a first thickness, second regions having a second thickness, the second thickness being greater than the first thickness, and third regions having a third thickness, the third thickness being smaller than the first thickness and smaller than the second thickness, and the second regions of the first-first conductive lines are between the first regions of the first-first conductive lines and the third regions of the first-first conductive lines.
    Type: Application
    Filed: June 11, 2020
    Publication date: May 6, 2021
    Inventors: Kwang-Ho PARK, Jae Hoon KIM, Yong-Hoon SON, Seung Jae JUNG
  • Patent number: 10325922
    Abstract: A semiconductor device includes a substrate, a stacked structure of insulating layers and gate electrodes alternately and repeatedly stacked on the substrate, and a pillar passing through the stacked-layer structure. The insulating layers include lower insulating layers, intermediate insulating layers disposed on the lower insulating layers, and upper insulating layers disposed on the intermediate insulating layers. The lower insulating layers have a hardness less than that of the intermediate insulating layers, and the upper insulating layers have a hardness greater than that of the intermediate insulating layers.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: June 18, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yeong Dae Lim, Seung Jae Jung, Jin Young Bang, Il Woo Kim, Ho Gil Jung
  • Patent number: 10276793
    Abstract: A variable resistance memory device includes a plurality of first conductive lines, each of the first conductive lines extends in a first direction, a plurality of second conductive lines are above the first conductive lines, and each of the second conductive lines extend in a second direction transverse to the first direction. A plurality of first memory cells are at intersections where the first and second conductive lines overlap each other, each of the first memory cells including a first variable resistance structure having a first variable resistance pattern, a first sacrificial pattern and a second variable resistance pattern sequentially stacked in the first direction on a first plane. A plurality of third conductive lines are above the second conductive lines, each of the third conductive lines extend in the first direction, and a plurality of second memory cells are at intersections where the second and the third conductive lines overlap each other.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: April 30, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Jae Jung, Youn-Seon Kang
  • Publication number: 20180350830
    Abstract: A semiconductor device includes a substrate, a stacked structure of insulating layers and gate electrodes alternately and repeatedly stacked on the substrate, and a pillar passing through the stacked-layer structure. The insulating layers include lower insulating layers, intermediate insulating layers disposed on the lower insulating layers, and upper insulating layers disposed on the intermediate insulating layers. The lower insulating layers have a hardness less than that of the intermediate insulating layers, and the upper insulating layers have a hardness greater than that of the intermediate insulating layers.
    Type: Application
    Filed: November 17, 2017
    Publication date: December 6, 2018
    Inventors: YEONG DAE LIM, SEUNG JAE JUNG, JIN YOUNG BANG, IL WOO KIM, HO GIL JUNG
  • Patent number: 10121798
    Abstract: A semiconductor device includes a substrate, a stacked structure on the substrate, and a vertical structure in a hole passing through the stacked structure. The stacked structure includes units stacked on top of each other in a direction perpendicular to a top surface of the substrate. The units include first units and second units between the first units. Each of the first units includes a first interlayer insulating layer on a first gate, and each of the second units includes a second interlayer insulating layer on a second gate. A ratio of a thickness of the second interlayer insulating layer with respect to a thickness of the second gate is different from a ratio of a thickness of the first interlayer insulating layer with respect to a thickness of the first gate.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: November 6, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yeong Dae Lim, Seung Jae Jung
  • Patent number: 10115602
    Abstract: A method of manufacturing a semiconductor device includes alternately stacking mold insulating layers and sacrificial layers on a substrate; forming channel holes penetrating through the mold insulating layers and the sacrificial layers and allowing recessed regions to be formed in the substrate; cleaning a surface of the recessed regions in such a manner that processes of forming a first protective layer in an upper region of the channel holes and performing an anisotropic dry etching process on the recessed regions in a lower portion of the channel holes are alternately repeated one or more times, in-situ; and forming epitaxial layers on the recessed regions of the substrate.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: October 30, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung Jae Jung, Sang Joon Yoon, Yong Hyun Kwon, Dae Hyun Jang, Ha Na Kim