Patents by Inventor Seung Min SHIN

Seung Min SHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12301909
    Abstract: A display apparatus and a server which implements an interactive system are disclosed. The server includes a communicator which receives text information corresponding to a user voice collected at the display apparatus from the display apparatus, and a controller which extracts an utterance component from the text information and controls so that a query to search contents is generated using the extracted utterance component and transmitted to an external server which categorizes metadata of the content under each item and stores the same, in which the controller generates the query by adding a preset item to a criteria to search a content, when a number of criteria to categorize the content under an item corresponding to the extracted utterance component is less than a preset number.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: May 13, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-Wook Shin, Seung-min Shin, Sung-wook Choi, Hye-jeong Lee, Ji-hye Chung
  • Publication number: 20250111505
    Abstract: The present disclosure relates to an organoid selection device and method, and, particularly, can provide an organoid selection device and method, which enable a mature organoid to be selected from an image by using an artificial intelligence model. Particularly, provided is a device, which constructs and verifies an artificial intelligence model so as to use only image information about an organoid, and thus can more accurately select a mature organoid exhibiting uniform efficacy.
    Type: Application
    Filed: January 17, 2023
    Publication date: April 3, 2025
    Inventors: Do Hyun KIM, Seungchul LEE, Sung Won KIM, Mi Hyun LIM, Keon Hyeok PARK, Seung Min SHIN
  • Patent number: 12165866
    Abstract: A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: December 10, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Hyun Park, Seo Hyun Kim, Seung Ho Kim, Young Chan Kim, Young-Hoo Kim, Tae-Hong Kim, Hyun Woo Nho, Seung Min Shin, Kun Tack Lee, Hun Jae Jang
  • Patent number: 12100602
    Abstract: A wet etching apparatus includes a process bath having an internal space configured to receive an etchant and having a support unit, on which a wafer is disposed to be in contact with the etchant. A laser unit is disposed above the process bath and is configured to direct a laser beam to the wafer and to heat the wafer thereby. An etchant supply unit is configured to supply the etchant to the internal space of the process bath.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: September 24, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Woo Lee, Yong Jun Choi, Seok Hoon Kim, Seung Min Shin, Ji Hoon Cha
  • Patent number: 12042828
    Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
    Type: Grant
    Filed: April 12, 2023
    Date of Patent: July 23, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung Min Shin, Hun Jae Jang, Seok Hoon Kim, Young-Hoo Kim, In Gi Kim, Tae-Hong Kim, Kun Tack Lee, Ji Hoon Cha, Yong Jun Choi
  • Publication number: 20240169997
    Abstract: An audio signal processing method, which is executed by a processor electronically communicating with a deep neural network within a computing system, may comprise: acquiring, by the processor, an input signal before encoding and an output signal after quantization and decoding; calculating, by the processor, a perceptual global loss for a frame corresponding to the input and the output signals; acquiring, by the processor, a plurality of subframes corresponding to the input and output signals by applying a windowing function to the frame of the input and output signals; calculating, by the processor, perceptual local losses for the plurality of subframes corresponding to the input and output signals; and acquiring, by the processor, multi-time scale perceptual loss based on the perceptual global and local losses.
    Type: Application
    Filed: November 9, 2023
    Publication date: May 23, 2024
    Inventors: Jong Mo SUNG, Seung Kwon BEACK, Young Cheol Park, Joon BYUN, Seung Min SHIN
  • Publication number: 20240081129
    Abstract: A stretchable optical device comprises: a flexible substrate divided into M×N pixels; a first thin film sealing layer formed on the flexible substrate, located inside a pixel, and formed from a first inorganic material; an actuation device layer located inside the pixel and formed on the first thin film sealing layer; a light-emitting layer located inside the pixel and connected to the actuation device layer; a second thin film sealing layer located inside the pixel, formed on the light-emitting layer, coming into contact with the first thin film sealing layer, and formed from a second inorganic material; a third thin film sealing layer located inside the pixel, formed on the second thin film sealing layer, and formed from a composite material of an organic material and an inorganic material; and a flexible film adhered to the flexible substrate, the stretchable optical device divided into a high flexible area, which is dependent on the shape of the flexible film and has stretchable folds, and a low flexible
    Type: Application
    Filed: September 11, 2023
    Publication date: March 7, 2024
    Applicant: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SEJONG CAMPUS
    Inventors: Mun Pyo HONG, Seung Min SHIN
  • Patent number: 11923216
    Abstract: An apparatus and method for treating a substrate are provided. The apparatus includes at least one first process chamber configured to supply a developer onto the substrate; at least one second process chamber configured to treat the substrate using a supercritical fluid; a transfer chamber configured to transfer the substrate from the at least one first process chamber to the at least one second process chamber, while the developer supplied in the at least one first process chamber remains on the substrate; and a temperature and humidity control system configured to manage temperature and humidity of the transfer chamber by supplying a first gas of constant temperature and humidity into the transfer chamber.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: March 5, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SEMES CO., LTD.
    Inventors: Seung Min Shin, Sang Jin Park, Hae Won Choi, Jang Jin Lee, Ji Hwan Park, Kun Tack Lee, Koriakin Anton, Joon Ho Won, Jin Yeong Sung, Pil Kyun Heo
  • Patent number: 11862457
    Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: SeongKeun Cho, Young Hoo Kim, Seung Min Shin, Tae Min Earmme, Kun Tack Lee, Hun Jae Jang, Eun Hee Jeang
  • Publication number: 20230343613
    Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.
    Type: Application
    Filed: June 26, 2023
    Publication date: October 26, 2023
    Inventors: Yong Jun CHOI, Seok Hoon KIM, Young-Hoo KIM, In Gi KIM, Sung Hyun PARK, Seung Min SHIN, Kun Tack LEE, Jinwoo LEE, Hun Jae JANG, Ji Hoon CHA
  • Publication number: 20230335130
    Abstract: Disclosed herein is a service management system and method. The method includes receiving, by a computing device, a request for a service from at least one client of a plurality of clients, wherein the request indicates an input parameter; converting, based on at least one request conversion rule, the input parameter to a converted parameter; generating, based on the converted parameter and based on at least one action generation rule associated with the at least one client, an action corresponding to the request and associated with the at least one client; generating, based on the generated action and based on at least one service conversion rule, an instruction signal requesting the service for the at least one client; and transmitting, to at least one of a plurality of service providers, the instruction signal.
    Type: Application
    Filed: April 12, 2023
    Publication date: October 19, 2023
    Inventor: Seung Min Shin
  • Publication number: 20230300398
    Abstract: A display apparatus and a server which implements an interactive system are disclosed. The server includes a communicator which receives text information corresponding to a user voice collected at the display apparatus from the display apparatus, and a controller which extracts an utterance component from the text information and controls so that a query to search contents is generated using the extracted utterance component and transmitted to an external server which categorizes metadata of the content under each item and stores the same, in which the controller generates the query by adding a preset item to a criteria to search a content, when a number of criteria to categorize the content under an item corresponding to the extracted utterance component is less than a preset number.
    Type: Application
    Filed: May 23, 2023
    Publication date: September 21, 2023
    Applicant: SAMSUNG ELECTRONICS CoO.,LTD.
    Inventors: Yong-wook SHIN, Seung-min SHIN, Sung-wook CHOI, Hye-jeong LEE, Ji-hye CHUNG
  • Patent number: 11742221
    Abstract: A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: August 29, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-Min Shin, Seok-Hoon Kim, Young-Hoo Kim, In-Gi Kim, Tae-Hong Kim, Sung-Hyun Park, Jin-Woo Lee, Ji-Hoon Cha, Yong-Jun Choi
  • Publication number: 20230253218
    Abstract: An apparatus is provided. The apparatus includes a spinner configured to hold a wafer, a nozzle configured to supply a liquid chemical onto an upper surface of the wafer, and a laser module configured to heat the wafer by radiating a laser beam to a lower surface of the wafer while the nozzle supplies the liquid chemical onto the upper surface of the wafer.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Inventors: Ji Hoon CHA, Jinwoo LEE, Seok Hoon KIM, In Gi KIM, Seung Min SHIN, Yong Jun CHOI
  • Publication number: 20230249230
    Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
    Type: Application
    Filed: April 12, 2023
    Publication date: August 10, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung Min SHIN, Hun Jae Jang, Seok Hoon Kim, Young-Hoo Kim, In Gi Kim, Tae-Hong Kim, Kun Tack Lee, Ji Hoon Cha, Yong Jun Choi
  • Patent number: 11721565
    Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: August 8, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Jun Choi, Seok Hoon Kim, Young-Hoo Kim, In Gi Kim, Sung Hyun Park, Seung Min Shin, Kun Tack Lee, Jinwoo Lee, Hun Jae Jang, Ji Hoon Cha
  • Patent number: 11700409
    Abstract: A display apparatus and a server which implements an interactive system are disclosed. The server includes a communicator which receives text information corresponding to a user voice collected at the display apparatus from the display apparatus, and a controller which extracts an utterance component from the text information and controls so that a query to search contents is generated using the extracted utterance component and transmitted to an external server which categorizes metadata of the content under each item and stores the same, in which the controller generates the query by adding a preset item to a criteria to search a content, when a number of criteria to categorize the content under an item corresponding to the extracted utterance component is less than a preset number.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: July 11, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-wook Shin, Seung-min Shin, Sung-wook Choi, Hye-jeong Lee, Ji-hye Chung
  • Publication number: 20230197481
    Abstract: An apparatus and method for treating a substrate are provided. The apparatus includes at least one first process chamber configured to supply a developer onto the substrate; at least one second process chamber configured to treat the substrate using a supercritical fluid; a transfer chamber configured to transfer the substrate from the at least one first process chamber to the at least one second process chamber, while the developer supplied in the at least one first process chamber remains on the substrate; and a temperature and humidity control system configured to manage temperature and humidity of the transfer chamber by supplying a first gas of constant temperature and humidity into the transfer chamber.
    Type: Application
    Filed: August 22, 2022
    Publication date: June 22, 2023
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SEMES CO., LTD.
    Inventors: Seung Min SHIN, Sang Jin PARK, Hae Won CHOI, Jang Jin LEE, Ji Hwan PARK, Kun Tack LEE, Koriakin ANTON, Joon Ho WON, Jin Yeong SUNG, Pil Kyun HEO
  • Publication number: 20230154743
    Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.
    Type: Application
    Filed: January 18, 2023
    Publication date: May 18, 2023
    Inventors: SeongKeun CHO, Young Hoo KIM, Seung Min SHIN, Tae Min EARMME, Kun Tack LEE, Hun Jae JANG, Eun Hee JEANG
  • Patent number: 11648594
    Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: May 16, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Min Shin, Hun Jae Jang, Seok Hoon Kim, Young-Hoo Kim, In Gi Kim, Tae-Hong Kim, Kun Tack Lee, Ji Hoon Cha, Yong Jun Choi